05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-05T00:00:00+00:00" | date "longDate" }}

Nowi Energy News

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Lane Electronics News

Meet Lane Electronics at DVD2022 – the Defence Industry Exhibition

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-05T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

Mitsubishi Electric to Ship Samples of Tunable Laser-diode Chip for Optical-fiber Communication

Will increase capacity of digital coherent communication and downsize optical transceivers.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-05T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Electronics Unveils High-Performance 990 PRO SSD Optimized for Gaming and Creative Applications

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Read more…

03 {{ "2022-09-03T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-03T00:00:00+00:00" | date "longDate" }}

Codasip News

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

Read more…

02 {{ "2022-09-02T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-02T00:00:00+00:00" | date "longDate" }}

Bender News

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-01T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-01T00:00:00+00:00" | date "longDate" }}

TDK News

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-01T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

Virgin Media O2, NEC and Rakuten Symphony drive multi-vendor Open RAN innovation in the UK

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

Read more…

29 {{ "2022-08-29T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-08-29T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba Releases Stepping Motor Driver IC That Contributes to Saving Space on Circuit Boards

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has expanded its lineup of stepping motor driver ICs with the launch of “TB67S549FTG,” a stepping motor driver IC housed in a small package, with built-in constant-current control that does not require external circuit components.

Read more…

Case studies

Delta Powers Europe’s Largest Solar Park with 3,500 High-Efficiency Inverters

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Meet Lane Electronics at DVD2022 – the Defence Industry Exhibition

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Mitsubishi Electric to Ship Samples of Tunable Laser-diode Chip for Optical-fiber Communication

Will increase capacity of digital coherent communication and downsize optical transceivers.

Samsung Electronics Unveils High-Performance 990 PRO SSD Optimized for Gaming and Creative Applications

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

Virgin Media O2, NEC and Rakuten Symphony drive multi-vendor Open RAN innovation in the UK

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

Toshiba Releases Stepping Motor Driver IC That Contributes to Saving Space on Circuit Boards

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has expanded its lineup of stepping motor driver ICs with the launch of “TB67S549FTG,” a stepping motor driver IC housed in a small package, with built-in constant-current control that does not require external circuit components.

International

Case studies

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Will increase capacity of digital coherent communication and downsize optical transceivers.

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel® Pathfinder for RISC-V* program.

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has expanded its lineup of stepping motor driver ICs with the launch of “TB67S549FTG,” a stepping motor driver IC housed in a small package, with built-in constant-current control that does not require external circuit components.

International

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.