Innoscience Technology, a company founded to create a global energy ecosystem based on high performance, low-cost gallium-nitride-on-silicon (GaN-on-Si) power solutions, will take part in the Applied Power Electronics Conference (APEC) event held in Houston, Texas on March 20-24, 2022.
Murata, a Japanese module expert, Deutsche Telekom, leader in telecommunications and Nowi, specialist in energy harvesting, have successfully introduced the world’s smallest energy harvesting NB-IoT module, featuring pioneering nuSIM technology.
Transfer Multisort Elektronik (TME) continues to expand the variety of applications it is able to address by adding to the range of products available through its distribution network.
TDK Corporation (TSE 6762) announces the introduction of 20U high, 19-inch rack cabinet high power solutions to the TDK-Lambda GENESYS+ series of programmable DC power supplies.
MediaTek inc. and Anritsu Corporation are pleased to announce that the first DAPS handover for 5G New Radio (NR) has been verified with a device containing the MediaTek M80 5G modem and Anritsu’s MT8000A Radio Communication Test Station with Rapid Test Designer (RTD) application software.
NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have launched a proof-of-concept (PoC) testing to run NEC's 5G core network (5GC) service in a hybrid cloud environment that leverages the Amazon Web Services (AWS) cloud using end-to-end cloud-native network architecture.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top manufacturer of micro-electro-mechanical systems (MEMS), is introducing its third generation of MEMS sensors.
KREEMO and Sivers Semiconductors announced that they had succeeded in developing the world’s first high performance 5G module with a 360o coverage for metaverse at MWC 2022.
The funding round, which includes current investors Parkwalk and Amadeus, will enable the business to increase its technological capacity globally and enhance its R&D capabilities.