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TE Connectivity News

TE Connectivity launches first-to-market SolderSleeve device for space

The new solution supports space applications requiring low outgassing and resistance to extreme temperatures. TE Connectivity (TE), a world leader in connectivity and sensors, is introducing its SolderSleeve device for space, a first-to-market solution that provides a controlled and reliable solder joint for low outgassing applications, including low earth orbit (LEO) satellites.

Nexcom News

Middleweight NVR NViS 14162 Poised to Break the Boundary of Value & Functionality

The demands for seeing more and more details has pushed the evolution of resolution for years, from 480 pixels, 720 pixels all the way to 1080p and now 4K. With ever-growing resolution, the thirst for capacity has also challenged the status quo of video surveillance application.

PEPPERL+FUCHS FACTORY AUTOMATION

Experience Hybrid Automation: Pepperl+Fuchs Combines its "Digital Expo" with its Exhibit at the SPS 2021 Trade Show

Where the boundaries between the real and digital worlds are blurred, there exists a space for new ideas and hybrid concepts: Bolstered by this motif, the automation specialists at Pepperl+Fuchs are now combining their exhibit at the SPS trade show in Nuremberg (November 23 – 25, 2021; Hall 7A, Stand 330) with the company's free "Digital Expo" digital show (November 15 – 26, 2021) for the very first time. The aim of the project is to establish an interplay between the respective advantages of analog and digital communication under the motto "Your Future Automation" and to transform both events into a holistic hybrid experience for visitors.

SK Hynix News

SK hynix Announces Development of HBM3 DRAM

SK hynix Inc. announced that it has become the first in the industry to successfully develop the High Bandwidth Memory 3, the world’s best-performing DRAM.

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