Anritsu Corporation is pleased to announce that its Signal Quality Analyzer-R MP1900A now supports the PCI Express®6.0 (PCIe®6.0) Base Specification Receiver Test (Rx Test).
Murata launches the Type 2AB UWB + Bluetooth® Low Energy, one of the smallest ultra-wideband modules currently available (10.5 mm x 8.3 mm x 1.44 mm). The combination of low power consumption with high accuracy and reliability results in an efficient and cost-effective variant for compact and battery-powered IoT devices.
Ongoing growth in clip-bonded FlatPower (CFP) manufacturing capacity and portfolio serves increasing demand from modern automotive and industrial applications.
ams OSRAM, a global leader in optical solutions, has released the Metal Can® PLT5 522FA_P-M12, its first commercial off-the-shelf semiconductor laser emitter to produce the specific 514nm wavelength output required by many applications for life science in research and diagnostics.
SnapEDA, the first search engine for electronic design, and Abracon, an industry leader in passive components, have released over 13,000 new computer-aided design (CAD) models to help engineers design electronics faster.
Smart home solutions increase consumers’ convenience while reducing energy consumption and lowering consumers’ carbon footprints. However, different device ecosystems, products and protocols have made implementing a truly connected, secured smart home difficult until now.
STMicroelectronics has introduced a 64-channel ultrasound transmitter with new features to enhance the image quality and convenience of high-performance portable industrial and medical instruments.
TTI Europe is now a preferred partner for TE automotive products and the largest stocking distributor for the company’s interconnection systems and relays covering internal combustion, hybrid, and electric vehicle platforms.
Siemens Digital Industries Software today announced that Samsung Foundry’s advanced 3nm process technology now supports Siemens’ entire Calibre® nmPlatform tool, which is the industry’s leading solution for physical verification of next-generation integrated circuits (ICs).