05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Samsung News

Samsung Electronics Unveils High-Performance 990 PRO SSD Optimized for Gaming and Creative Applications

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-05T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

Mitsubishi Electric to Ship Samples of Tunable Laser-diode Chip for Optical-fiber Communication

Will increase capacity of digital coherent communication and downsize optical transceivers.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Lane Electronics News

Meet Lane Electronics at DVD2022 – the Defence Industry Exhibition

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

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Nowi Energy News

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Read more…

05 {{ "2022-09-05T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-05T00:00:00+00:00" | date "longDate" }}

Impulse Embedded News

Aaeon BOXER-8640AI Embedded Box PCs powered by new NVIDIA Jetson AGX Orin now available from Impulse Embedded

Impulse Embedded, a leading provider of industrial computing systems and solutions, announces the availability of Aaeon Technology’s BOXER-8640AI, their latest rugged, embedded box PC and their first to be powered by the NVIDIA flagship Jetson AGX Orin System-on-Module (SoM), which boasts a sixfold increase in AI performance over the previous generation Jetson AGX Xavier.

Read more…

03 {{ "2022-09-03T00:00:00+00:00" | date "MMM" }} '22

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Codasip News

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

Read more…

02 {{ "2022-09-02T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-02T00:00:00+00:00" | date "longDate" }}

Bender News

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-01T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

Virgin Media O2, NEC and Rakuten Symphony drive multi-vendor Open RAN innovation in the UK

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-01T00:00:00+00:00" | date "longDate" }}

TDK News

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

Read more…

01 {{ "2022-09-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-09-01T00:00:00+00:00" | date "longDate" }}

Toshiba News

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

Read more…

Market Overview

Sustainability in Electronic Components: Eco-Friendly Materials and Recycling Initiatives

Technical Articles

High-Speed Vision Solution for IC Chip Marking Inspection and Recognition

Case studies

NEXCOM, Profet AI Empower Engineers with Accessible Industrial AI

White Paper

Delta Electronics Ensuring Medical Safety with Advanced Isolation & EMC Power Solutions

Samsung Electronics Unveils High-Performance 990 PRO SSD Optimized for Gaming and Creative Applications

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Mitsubishi Electric to Ship Samples of Tunable Laser-diode Chip for Optical-fiber Communication

Will increase capacity of digital coherent communication and downsize optical transceivers.

Meet Lane Electronics at DVD2022 – the Defence Industry Exhibition

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Telink Introduces Energy Harvesting Multi-protocol Wireless Connectivity Module, Powered by Nowi, to Enable Batteryless Solutions

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Aaeon BOXER-8640AI Embedded Box PCs powered by new NVIDIA Jetson AGX Orin now available from Impulse Embedded

Codasip joins Intel Pathfinder for RISC-V program

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.

NEW, DIVISIBLE MEASURING CURRENT TRANSFORMERS FOR EXISTING ELECTRICAL INSTALLATIONS

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Virgin Media O2, NEC and Rakuten Symphony drive multi-vendor Open RAN innovation in the UK

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

Inductors: New advanced multilayer inductors from TDK meet evolving automotive PoC demands

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

TOSHIBA LAUNCHES THIRD GENERATION 650V SILICON CARBIDE (SIC) MOSFETS

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

International

Market Overview

Technical Articles

Case studies

White Paper

Blazing speeds of the 990 PRO cut load times and increase game responsiveness while its thermal control solutions keep the drive at optimal temperature for uninterrupted play.

Will increase capacity of digital coherent communication and downsize optical transceivers.

Lane Electronics will be showcasing their extensive portfolio of robust and waterproof connectors at DVD2022, located at the Millbrook Proving Ground on September 21st - 22nd.

Telink and Nowi reinforce their existing partnership by launching an Energy Autonomous Wireless Connectivity Module. This new product offering enables additional energy harvesting use-cases by further reducing bill of material size, cost and complexity.

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel® Pathfinder for RISC-V* program.

Bender has added new measuring current transformers to its portfolio that are specifically intended for use in existing electrical installations.

Virgin Media O2, NEC Corporation and Rakuten Symphony have announced their joint multi-vendor Open RAN deployment is entering the field phase, commencing with the activation of the first live sites in Virgin Media O2's commercial network.

TDK Corporation has announced the introduction of the new MLJ1608WG Series of multilayer inductors. These compact components are targeted at use in automotive Power over Coax (PoC) implementations. Mass production began in August 2022.

Toshiba Electronics Europe GmbH (“Toshiba”) has launched a total of five new third-generation 650V silicon carbide (SiC) MOSFET devices for industrial equipment.

International

Codasip, the leader in processor design automation and RISC-V processor IP, today announced that it would make its 32-bit L31 core available through the Professional Edition of the Intel^® Pathfinder for RISC-V* program.