Anritsu Corporation President Hirokazu Hamada announces Anritsu is demonstrating its Signal Quality Analyzer-R MP1900A series as part of a PCI-Express® (PCIe®) 6.0 Base Specification test system, along with Tektronix Inc.’s DPO70000SX real-time oscilloscope and silicon-proven Synopsys® PCI Express 6.0 IP. The demonstration will be conducted during the PCI-SIG Developers Conference at Santa Clara Convention Center.
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT) and Inflight Entertainment and Connectivity (IFE&C) solutions, today announces FAA PMA approval of the ACE Flight 2780 Auxiliary Modem Unit (AMU) and general availability of the ACE Flight 4783 Dual MODMAN.
Sivers Semiconductors AB today announced that its subsidiary Sivers Wireless with its partner KREEMO, based in Korea, which has world-class technology in the 5G mmWave antenna field, have jointly developed a Transparent Antenna-on-Display module which implements a mmWave antenna on high resolution display panels of any size and shape.
Due to their numerous advantages, three-phase brushless DC (BLDC) motors are becoming the preferred choice for designing modern battery-powered motor products.
4x-785C PXI & PXIe range increases performance, minimizes space and cost Debuting at International Microwave Symposium (IMS), Booth 11006, Colorado Convention Center 19-24 June 2022, Denver.
At embedded world 2022, Congatec – a leading vendor of embedded and edge computing technology – and System Industrie Electronic – an ISO 13485 certified expert in system design and integration, mass production and assembly of medical OEM platforms – have officially launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector.
Nexperia, the expert in essential semiconductors, today announced the latest addition to its family of voltage level translators, the NXT4557GU and NXT4556UP. These devices enable seamless connectivity of next generation low voltage mobile phone baseband processors with its subscribers’ identity module (SIM) cards.
TDK Corporation has introduced a thin pattern coil to support the wireless charging of next generation mobile devices. Industry-leading 0.76 ㎜ thickness achieved via unique pattern coil technology.