Diodes Incorporated is addressing the need for advanced signal conditioning in modern automotive designs by introducing two precision operational amplifiers (op-amps) aimed at different signal frequency scenarios.
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, continues to expand its line card by adding 36 new manufacturers through the end of August 2022.
STMicroelectronics has created the STM32 Hotspot organization on GitHub, a new place for community members to find professionally developed embedded software projects for STM32 microcontrollers. STM32 Hotspot contains non-productized code created by ST’s in-house engineers, originally written for purposes such as exhibition demonstrations and proof-of-concept models.
onsemi, a leader in intelligent power and sensing technologies, will showcase its latest image sensing technology at VISION – the world’s leading trade fair for machine vision – at booth 10G30.
Panasonic Industry Europe has extended its range of Bluetooth® LE modules with the launch of the PAN1782, which targets cost-effective applications that still require high performance, including professional lighting, asset tracking, smart home, advanced wearables, and higher value IoT applications.
Tektronix, Inc., a leading global equipment and software manufacturer delivering innovative, precise and easy-to-operate test, measurement and monitoring solutions, has today announced its participation at this year’s electronica 2022 exhibition, taking place in Munich from November 15-18.
First-of-its-kind system enables a new class of solid-state thermal management systems that is currently only possible with bulkier, mechanical alternatives.
Diodes Incorporated today announced the latest addition to its broad portfolio of ReDrivers with the release of a 1.8V low-power, 4 data lanes 2.5Gbps ReDriver.
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.