Provides network equipment manufacturers and data center operators with an extensible cybersecurity test platform that supports hyperscale data volumes, encryption demands, and security challenges.
Combining high surge robustness with very low trigger and extremely low clamping voltages, the PESD4V0Y1BBSF and PESD4V0X2UM offer a highly effective solution for the protection of sensitive systems.
Aiming at Infineon’s latest AURIX TC4x the hardware support package for MathWorks Simulink® supports automotive engineers in designing advanced electric vehicles, sensor fusion, and radar signal processing functions, even before silicon is available. With the package, the designers can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.
Mitsubishi Electric Corporation announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30A rated current for use in inverter systems of home appliances, will be released in February 2023.
Toshiba Corporation has unveiled a technology breakthrough in photoluminescence, a novel phosphor that delivers excellent solubility in polymers or organic solvents, where it is transparent and colorless under visible light, and that emits persistent red-light emissions under UV light, with excellent color purity and a luminescence six times that of current phosphors.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announced the launch of a new resource site dedicated to sensor design guides.
Rohde & Schwarz and Broadcom have successfully validated the R&S CMP180 radio communication tester for Broadcom Wi-Fi 7 chipsets. OEMs and ODMs of wireless devices can now get their first Wi-Fi 7 products ready for market.
Analog Devices, Inc. invites the public and media to experience life at the Intelligent Edge through interactive demonstrations and expert discussions at CES 2023.
Vector presents its compact multi-gig USB-to-Ethernet adapter VN5601. The adapter is not only high performing, its compact dimensions make it ideally suited for portable use. It also offers easy connection to Vector Hardware.
TDK Corporation will showcase more than 30 technology demonstrations and experiences across its component and system solution portfolio for the entire spectrum of electronics applications at the 2023 Consumer Electronics Show (CES) in Las Vegas, Nevada, from January 5th through January 8th. Additionally, TDK plans to release multiple product and partner announcements for its InvenSense brand MEMS sensors throughout the week of the conference.