10
'21
Written on
CK Switches News
10
'21
Written on
Infineon News
Infineon's 5th Generation CAPSENSE technology extends market leadership with improved robustness, reliability and lower power consumption
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today launched the company’s fifth-generation CAPSENSE capacitive and inductive touch sensing human-machine interface (HMI) technology.
10
'21
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Sivers Semiconductors News
Sivers Semiconductors delivers proof point of its world leading 5G mmWave technology in collaboration with Rohde & Schwarz
Sivers Semiconductors AB today announced that its subsidiary Sivers Wireless has partnered with Rohde & Schwarz, a market-leading supplier of test and measurement solutions for Radio Frequency (RF) components and the wireless industry, to test the performance of Sivers Semiconductors state-of-art Radio Frequency Integrated Circuit (RFIC) TRXBF01.
10
'21
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TDK News
THERMISTORS: TDK OFFERS HIGH-PRECISION NTC CHIPS FOR EMBEDDING INTO IGBT MODULES
TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of -55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.
09
'21
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Renesas News
Renesas Programmable Smart Gate Driver for BLDC Motor Applications Drives Multiple Configurations; Integrates Analog Power Components to Reduce BOM Cost and Board Space
The RAA227063 Pairs with a Variety of MCUs to Deliver Efficient, Flexible Motor Control in a Smaller Footprint; New Winning Combo Showcases the Device with Renesas’ New RA6T2 MCU.
09
'21
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Mouser News
Mouser Electronics Now Distributing Fujitsu Semiconductor Memory Solution Products
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, proudly announces that it now distributes ferroelectric random access memory (FRAM) and large-density resistive random access memory (ReRAM) products from Fujitsu Semiconductor Memory Solution.
09
'21
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Toshiba News
New automotive photocoupler offers highest collector-emitter voltage of 200V
The automotive qualified device is suitable for many HEV / BEV applications including battery monitoring.
09
'21
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Fraunhofer News
MEMS MICROSPEAKERS FOR THE FUTURE OF THE MOBILE INTERNET
The microspeakers for wireless in-ear headphones from Arioso Systems GmbH, a spin-off of the Fraunhofer Institute for Photonic Microsystems IPMS, are up to ten times smaller than conventional microspeakers and are made entirely from silicon. Currently at the prototype stage, the energy-efficient MEMS speakers may in future play a role in expanding the range of functions offered by miniaturized headphones – such as instant translations and health monitoring features. This is made possible by an innovative sound transducer principle that dispenses with the membrane, the central element of a conventional speaker.
09
'21
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Melexis News
Melexis development kit: effortless contactless current sensing evaluation
Magnetic evaluation made easy with a comprehensive modular platform.
09
'21
Written on
Avalue News
