11 {{ "2022-11-11T00:00:00+00:00" | date "MMM" }} '22

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Allegro Micro Systems News

Allegro MicroSystems Announces PCB-Less 3D Magnetic Sensor for Vehicle Safety and ADAS Applications

Allegro MicroSystems, Inc. (“Allegro”), a global leader in sensing and power solutions for motion control and energy-efficient systems, today announced the A31316 3D Hall-effect position sensor, the latest addition to the company’s 3DMAG line of 3D sensors.

Read more…

10 {{ "2022-11-10T00:00:00+00:00" | date "MMM" }} '22

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Cyntec

Cyntec to Exhibit a Broad Range of Magnetic and Passive Solutions for Automotive ECU and Electrification at Electronica 2022

Standard and customised solutions in line with Cyntec’s vision of being a global leader of prime technology, innovation & sustainability in the automotive electronics ecosystem.

Read more…

10 {{ "2022-11-10T00:00:00+00:00" | date "MMM" }} '22

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TTI News

TTI Europe Highlights New Value Added Capability at Electronica 2022

TTI Europe is supporting its customers in multiple ways.

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09 {{ "2022-11-09T00:00:00+00:00" | date "MMM" }} '22

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ARROW News

Arrow Electronics Signs Sunway Communication to Expand RF Connectivity Offering

Arrow Electronics has signed an agreement with Sunway Communication, a developer and manufacturer of components and modules for RF connectivity applications, that will see Arrow offering and supporting the entire Sunway portfolio throughout the Americas, Europe, Middle East and Africa.

Read more…

09 {{ "2022-11-09T00:00:00+00:00" | date "MMM" }} '22

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Kontron News

KONTRON PRESENTS KISS V4 ADL FAMILY - UPDATE TO LATEST 12TH GEN INTEL^® CORETM PROCESSORS FOR A NEW CLASS OF PERFORMANCE

As of now, the industrial rackmount systems in 1U, 2U and 4U formats will be equipped with motherboards developed and manufactured in Germany based on the latest 12th Gen Intel^® CoreTM processors, boasting higher performance, increased reliability and better energy efficiency.

Read more…

09 {{ "2022-11-09T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-11-09T00:00:00+00:00" | date "longDate" }}

Samsung News

Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND with Industry’s Highest Bit Density

Samsung’s eighth-generation V-NAND features both the industry’s highest storage capacity and highest bit density to enable expanded storage space in next-generation servers.

Read more…

08 {{ "2022-11-08T00:00:00+00:00" | date "MMM" }} '22

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ONSEMI News

onsemi to Demo Multiple Innovative Technologies at electronica 2022

Top-Cool MOSFETs, a new rotary position sensor and the VISION EQXX by Mercedes-Benz powered by onsemi silicon carbide (SiC) devices, highlight company’s strength in intelligent power and sensing.

Read more…

08 {{ "2022-11-08T00:00:00+00:00" | date "MMM" }} '22

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PEPPERL+FUCHS PROCESS AUTOMATION

ECOM Instruments at SPS 2022: Intrinsically safe mobile device ecosystem for every smart factory scenario

At SPS - Smart Production Solutions from 8. to 10. November in Nuremberg, the Pepperl+Fuchs brand ECOM Instruments will be demonstrating a multi-faceted ecosystem as the link between mobile workers and the hazardous areas of a smart factory in hall 7A at booth 411. Smartphones, tablets and smart glasses provide mobile workers with almost unlimited flexibility in every application scenario.

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07 {{ "2022-11-07T00:00:00+00:00" | date "MMM" }} '22

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Infineon News

Infineon introduces new XENSIV TLE4971 sensor family for automotive applications

Infineon Technologies AG today announced the addition of the new XENSIV TLE4971 family to its current sensor portfolio for automotive applications.

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04 {{ "2022-11-04T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-11-04T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon introduces new CMOS transceiver MMIC CTRX8181 with high performance, scalability and reliability for automotive radar

A high-performance and reliable radar module is the key to an improved automated driving assistance system and autonomous driving in the future.

Read more…

Case studies

CompControl automates inbound electronics logistics with machine vision

Allegro MicroSystems Announces PCB-Less 3D Magnetic Sensor for Vehicle Safety and ADAS Applications

Allegro MicroSystems, Inc. (“Allegro”), a global leader in sensing and power solutions for motion control and energy-efficient systems, today announced the A31316 3D Hall-effect position sensor, the latest addition to the company’s 3DMAG line of 3D sensors.

Cyntec to Exhibit a Broad Range of Magnetic and Passive Solutions for Automotive ECU and Electrification at Electronica 2022

Standard and customised solutions in line with Cyntec’s vision of being a global leader of prime technology, innovation & sustainability in the automotive electronics ecosystem.

TTI Europe Highlights New Value Added Capability at Electronica 2022

TTI Europe is supporting its customers in multiple ways.

Arrow Electronics Signs Sunway Communication to Expand RF Connectivity Offering

Arrow Electronics has signed an agreement with Sunway Communication, a developer and manufacturer of components and modules for RF connectivity applications, that will see Arrow offering and supporting the entire Sunway portfolio throughout the Americas, Europe, Middle East and Africa.

KONTRON PRESENTS KISS V4 ADL FAMILY - UPDATE TO LATEST 12TH GEN INTEL^® CORETM PROCESSORS FOR A NEW CLASS OF PERFORMANCE

As of now, the industrial rackmount systems in 1U, 2U and 4U formats will be equipped with motherboards developed and manufactured in Germany based on the latest 12th Gen Intel^® CoreTM processors, boasting higher performance, increased reliability and better energy efficiency.

Samsung Electronics Begins Mass Production of 8th-Gen Vertical NAND with Industry’s Highest Bit Density

Samsung’s eighth-generation V-NAND features both the industry’s highest storage capacity and highest bit density to enable expanded storage space in next-generation servers.

onsemi to Demo Multiple Innovative Technologies at electronica 2022

Top-Cool MOSFETs, a new rotary position sensor and the VISION EQXX by Mercedes-Benz powered by onsemi silicon carbide (SiC) devices, highlight company’s strength in intelligent power and sensing.

ECOM Instruments at SPS 2022: Intrinsically safe mobile device ecosystem for every smart factory scenario

Infineon introduces new XENSIV TLE4971 sensor family for automotive applications

Infineon Technologies AG today announced the addition of the new XENSIV TLE4971 family to its current sensor portfolio for automotive applications.

Infineon introduces new CMOS transceiver MMIC CTRX8181 with high performance, scalability and reliability for automotive radar

A high-performance and reliable radar module is the key to an improved automated driving assistance system and autonomous driving in the future.

International

Case studies

Allegro MicroSystems, Inc. (“Allegro”), a global leader in sensing and power solutions for motion control and energy-efficient systems, today announced the A31316 3D Hall-effect position sensor, the latest addition to the company’s 3DMAG line of 3D sensors.

Standard and customised solutions in line with Cyntec’s vision of being a global leader of prime technology, innovation & sustainability in the automotive electronics ecosystem.

TTI Europe is supporting its customers in multiple ways.

Arrow Electronics has signed an agreement with Sunway Communication, a developer and manufacturer of components and modules for RF connectivity applications, that will see Arrow offering and supporting the entire Sunway portfolio throughout the Americas, Europe, Middle East and Africa.

As of now, the industrial rackmount systems in 1U, 2U and 4U formats will be equipped with motherboards developed and manufactured in Germany based on the latest 12th Gen Intel® CoreTM processors, boasting higher performance, increased reliability and better energy efficiency.

Samsung’s eighth-generation V-NAND features both the industry’s highest storage capacity and highest bit density to enable expanded storage space in next-generation servers.

Top-Cool MOSFETs, a new rotary position sensor and the VISION EQXX by Mercedes-Benz powered by onsemi silicon carbide (SiC) devices, highlight company’s strength in intelligent power and sensing.

Infineon Technologies AG today announced the addition of the new XENSIV TLE4971 family to its current sensor portfolio for automotive applications.

A high-performance and reliable radar module is the key to an improved automated driving assistance system and autonomous driving in the future.

International

As of now, the industrial rackmount systems in 1U, 2U and 4U formats will be equipped with motherboards developed and manufactured in Germany based on the latest 12th Gen Intel^® CoreTM processors, boasting higher performance, increased reliability and better energy efficiency.