Innodisk, a leading global provider of industrial-grade flash storage, DRAM memory and embedded peripherals, has announced its latest step into the AI market, with the launch of EXMU-X261, an FPGA Machine Vision Platform. Powered by AMD’s Xilinx Kria K26 SOM, which was designed to enable smart city and smart factory applications, Innodisk’s FPGA Machine Vision Platform is set to lead the way for industrial system integrators looking to develop machine vision applications.
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announces the final remaining 2022 episode of its award-winning Empowering Innovation Together program.
Infineon Technologies AG and Fingerprint Cards AB (STO: FING B, Fingerprints) today announced the signing of a joint development and commercialization agreement of a plug-and-play turnkey solution for biometric payment smart cards. The goal of the cooperation is to make biometric smart card production as simple and easy as producing a standard dual interface payment card.
ST has introduced LSM6DSV16X, the flagship 6-axis inertial measurement unit (IMU) embedding ST’s Sensor Fusion Low Power (SFLP) technology, Artificial Intelligence (AI), and adaptive-self-configuration (ASC) for superior power optimization.
High-frequency crystal oscillators from Hong Kong X'tals (HKC) ensure high stability and low noise in the system design. This is possible thanks to a differential output and low-phase jitter.
Leveraging proprietary PCB electrical and mechanical design topologies, Murata has introduced a new series of compact DC-DC converters that are aligned with the increasing prevalence of wide bandgap technology. The new MGN1 series of 1W output DC-DC converters are designed to deliver the voltages needed by the gate drivers of GaN devices.
Infineon Technologies AG recently added EasyPACK 4B to its industry-leading Easy power module family. The lead-type of the new family targets applications in photovoltaic string inverters.
Diodes Incorporated (Diodes) is introducing its latest PCIe® 3.0 packet switch, the DIODES PI7C9X3G1224GP. A high-performance 12-port, 24-lane device, it can be used in edge computing, data storage, communications infrastructure, and incorporated into host bus adaptors (HBAs), industrial controllers, and network routers.
ROHM has signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen Electric Industrial Co., Ltd., (Imasen) for inverters and SiC power modules to be used in the electric drive units of electric vehicles, including e-Axle.