03
'22
Written on
Keysight technologies News
01
'22
Written on
Mouser News
Mouser Electronics Receives TDK’s Top Global, Europe, North America Distribution Awards
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is proud to announce that it has received three top distribution awards from TDK.
01
'22
Written on
KEMET News
KEMET Introduces 1,000 V AC/DC AEC-Q200 Common Mode Choke Solution for EMI Suppression in Harsh Environments
With a nanocrystalline metal core, SCF-XV achieves higher inductance and impedance values, a broader frequency response, and a smaller footprint than other common mode chokes currently available.
01
'22
Written on
PCI-SIG News
PCI-SIG® Announces PCI Express® 7.0 Specification to Reach 128 GT/s
The upcoming PCI Express specification is targeted for release in 2025.
01
'22
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Copper Mountain Technologies News
Copper Mountain Technologies Release Compact VNAs with Improved Performance
Copper Mountain Technologies is excited to announce the unveiling of its Multiport USB VNAs during IMS2022 in Denver, Colorado. SN5090 vector network analyzers are a competitively priced, versatile multiport solution with excellent dynamic range and measurement speed available in 6-, 8-, 10-, 12-, 14-, and 16-port configurations.
01
'22
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Infineon News
Infineon to strengthen its leading expertise as IoT solution provider by acquiring verification expert NoBug in Romania and Serbia
Infineon Technologies acquired NoBug Consulting SRL (Romania) and NoBug d.o.o. (Serbia). Founded in 1998, NoBug is a privately owned engineering company providing verification and design services for all the digital functionalities of semiconductor products. With approximately 120 engineers, NoBug Consulting SRL and NoBug d.o.o. are represented in Bucharest, Brașov, Iași (all Romania) and Belgrade (Serbia).
01
'22
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Fischer Elektronik News
SMD HEATSINKS ON TAPE & REEL
The demands for efficient heat dissipation of electronic devices on the PCB have not been reduced. The increased complexity of the assemblies, as well as the combination of individual functional modules into one component, lead to an unwelcome and, in the long run, harmful power loss on the PCB, which is directly converted into heat.
30
'22
Written on
ST News
STMicroelectronics releases next-generation Bluetooth® system-on-chip, enhanced with latest positioning capabilities
STMicroelectronics has introduced its third-generation Bluetooth® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications.
30
'22
Written on
Intel News
Intel Foundry Services Forms Alliance to Enable Design in the Cloud
IFS Cloud Alliance harnesses the power of massive compute scalability to improve chip design efficiency and accelerate time-to-market for foundry customers.
30
'22
Written on
Hitachi News
