14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-09-14T00:00:00+00:00" | date "longDate" }}

ST News

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications

STMicroelectronics has announced the first multi-zone FlightSense time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products.

Read more…

14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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TDK News

TDK offers new stray-field compensated 3D HAL^® sensors with redundancy function and digital output interfaces

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*.

Read more…

14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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TEKTRONIX News

Tektronix Introduces New Features in CalWeb^® Asset Management Software

Next-Gen Version Streamlines Management of Fleets of Test & Measurement Equipment for Calibration and Repair Services.

Read more…

14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-09-14T00:00:00+00:00" | date "longDate" }}

Cliffuk News

Make fast and secure connections with Single-pole Spring Terminals from Cliff Electronics

Rugged and reliable connectors for high-end audio equipment, test equipment and pyrotechnics.

Read more…

14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-09-14T00:00:00+00:00" | date "longDate" }}

Green HIlls News

Green Hills Software to Provide INTEGRITY-178 tuMP RTOS for Military GPS User Equipment

Green Hills Software has announced the selection of the INTEGRITY^®-178 tuMP real-time operating system (RTOS) by Raytheon Intelligence & Space (RI&S) for their offering of the Military Global Positioning System User Equipment (MGUE) Increment (Inc) 2 Miniature Serial Interface (MSI) with Next-Generation Application Specific Integrated Circuit (ASIC).

Read more…

14 {{ "2021-09-14T00:00:00+00:00" | date "MMM" }} '21

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ARROW News

Arrow Electronics offers RBZ Robot Design's System-on-Modules

SIMPLIA SoMs feature NXP^® Semiconductors processors and extensive IoT connectivity options. The SoMs are compatible with each other which means that the designs are scalable in both performance and connectivity.

Read more…

13 {{ "2021-09-13T00:00:00+00:00" | date "MMM" }} '21

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PANASONIC ELECTRIC WORKS News

20 pins, two rows - and no smarter way for high power connections

Panasonic Industry launches the new double-row CF2 board-to-FPC connector.

Read more…

13 {{ "2021-09-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-09-13T00:00:00+00:00" | date "longDate" }}

Fluke Process Instruments

Fluke Process Instruments Debuts New Datapaq^® Furnace Tracking Systems for Demanding Heat Treat Applications

The new thermal profiling solutions feature new sealed quench thermal barriers and IP67 rated data logger.

Read more…

13 {{ "2021-09-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-09-13T00:00:00+00:00" | date "longDate" }}

APPLIED MATERIALS INC. News

APPLIED MATERIALS INTRODUCES NEW TECHNOLOGIES AND CAPABILITIES FOR ACCELERATING THE SEMICONDUCTOR INDUSTRY’S HETEROGENEOUS INTEGRATION ROADMAP

Applied Materials, Inc. introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps for heterogeneous chip design and integration.

Read more…

13 {{ "2021-09-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-09-13T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

NEC Expands its Collaboration with AWS in Areas Including Global 5G and Digital Government

NEC Corporation (NEC; 6701) has expanded its collaboration with Amazon Web Services, Inc. (AWS) in areas that include global 5G and the digital government in support of accelerating digital transformation for customers.

Read more…

Technical Articles

ROHM Develops a New Op Amp that Minimizes Current Consumption

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications

STMicroelectronics has announced the first multi-zone FlightSense time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products.

TDK offers new stray-field compensated 3D HAL^® sensors with redundancy function and digital output interfaces

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*.

Tektronix Introduces New Features in CalWeb^® Asset Management Software

Next-Gen Version Streamlines Management of Fleets of Test & Measurement Equipment for Calibration and Repair Services.

Make fast and secure connections with Single-pole Spring Terminals from Cliff Electronics

Rugged and reliable connectors for high-end audio equipment, test equipment and pyrotechnics.

Green Hills Software to Provide INTEGRITY-178 tuMP RTOS for Military GPS User Equipment

Arrow Electronics offers RBZ Robot Design's System-on-Modules

SIMPLIA SoMs feature NXP^® Semiconductors processors and extensive IoT connectivity options. The SoMs are compatible with each other which means that the designs are scalable in both performance and connectivity.

20 pins, two rows - and no smarter way for high power connections

Panasonic Industry launches the new double-row CF2 board-to-FPC connector.

Fluke Process Instruments Debuts New Datapaq^® Furnace Tracking Systems for Demanding Heat Treat Applications

The new thermal profiling solutions feature new sealed quench thermal barriers and IP67 rated data logger.

APPLIED MATERIALS INTRODUCES NEW TECHNOLOGIES AND CAPABILITIES FOR ACCELERATING THE SEMICONDUCTOR INDUSTRY’S HETEROGENEOUS INTEGRATION ROADMAP

Applied Materials, Inc. introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps for heterogeneous chip design and integration.

NEC Expands its Collaboration with AWS in Areas Including Global 5G and Digital Government

NEC Corporation (NEC; 6701) has expanded its collaboration with Amazon Web Services, Inc. (AWS) in areas that include global 5G and the digital government in support of accelerating digital transformation for customers.

International

Technical Articles

STMicroelectronics has announced the first multi-zone FlightSense time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full spectrum of consumer and industrial products.

TDK Corporation (TSE:6762) expands its Micronas 3D HAL® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*.

Next-Gen Version Streamlines Management of Fleets of Test & Measurement Equipment for Calibration and Repair Services.

Rugged and reliable connectors for high-end audio equipment, test equipment and pyrotechnics.

SIMPLIA SoMs feature NXP® Semiconductors processors and extensive IoT connectivity options. The SoMs are compatible with each other which means that the designs are scalable in both performance and connectivity.

Panasonic Industry launches the new double-row CF2 board-to-FPC connector.

The new thermal profiling solutions feature new sealed quench thermal barriers and IP67 rated data logger.

Applied Materials, Inc. introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps for heterogeneous chip design and integration.

NEC Corporation (NEC; 6701) has expanded its collaboration with Amazon Web Services, Inc. (AWS) in areas that include global 5G and the digital government in support of accelerating digital transformation for customers.

International

TDK Corporation (TSE:6762) expands its Micronas 3D HAL^® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*.

SIMPLIA SoMs feature NXP^® Semiconductors processors and extensive IoT connectivity options. The SoMs are compatible with each other which means that the designs are scalable in both performance and connectivity.