Join the 155,000+ IMP followers

Electro Rent

Challenging economic headwinds put equipment investment strategies to the test

Electro Rent outlines how companies can combat the impacts of the current economic challenges and mitigate risks set out in several recent reports from prominent industry commentators. In light of current economic conditions predicted by numerous recent reports, electronic test equipment specialist Electro Rent has advice for any companies looking to mitigate this financial pressure when sourcing the equipment they need.

Ampleon News

Ampleon’s “New” standard for L Band, GaN-SiC HEMT

Ampleon will showcase at the European Microwave Week (held in Milan between 27 thru 29 September) our latest solutions and innovative products in GaN and LDMOS technologies. Among the products on display will be ones aimed at wireless infrastructure, avionics/defence, non-cellular communication, cooking/ defrosting, and ISM-related applications.

Mouser News

Mouser Dives into the Possibilities of Private 5G Networks in Fifth Empowering Innovation Together Episode

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announces the next chapter of its award-winning Empowering Innovation Together program.

ONSEMI News

onsemi Expands its Silicon Carbide Fab in the Czech Republic

onsemi, a leader in intelligent power and sensing technologies, today celebrated the inauguration of its expanded silicon carbide (SiC) fab in Roznov, Czech Republic. Multiple guests of honor attended the ribbon cutting ceremony led by Ministry of Industry and Trade Section Chief Zbyněk Pokorný, Governor of the Zlín Region Radim Holiš and City Mayor Jiří Pavlica as well as other local governmental dignitaries, signifying the importance of this event and manufacturing of semiconductors in the Czech Republic.

Siemens digital Industry Software News

Siemens collaborates with UMC to develop 3D integrated circuit hybrid bonding workflow

Siemens Digital Industries Software today announced it has collaborated with leading semiconductor foundry United Microelectronics (UMC) to develop and implement a new multi-chip 3D integrated circuit (IC) planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies. UMC plans to soon offer this new flow to its global roster of customers.

Join the 155,000+ IMP followers