03
'22
Written on
Hitachi News
03
'22
Written on
Inova Semiconductors News
F.A.Z.-Institut again honours Inova Semiconductors as innovation leader in Germany
In its current study, "Germany's Innovation Leaders 2022", the F.A.Z.-Institut – a subsidiary of the Frankfurter Allgemeine Zeitung – once again counts the Munich-based semiconductor company among the leading innovation drivers.
03
'22
Written on
Rutronik Info
Optimized storage solutions from Solidigm complement Rutronik's product portfolio
Rutronik Elektronische Bauelemente GmbH and Solidigm, a global provider of NAND flash and SSD products, have signed a worldwide distribution agreement. The agreement covers Solidigm's entire product portfolio and is already effective.
03
'22
Written on
CEA Leti News
CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
Paper at ECTC Presents Success With Self-Assembly Process That Uses Capillary Forces Of Water to Align Dies on Target Devices for Possible Memory, HPC and Photonic Applications.
03
'22
Written on
Intel News
Intel RealSense Depth Camera D435f
New Infrared Pass Filters for Better Range Performance. The Intel RealSense Depth Camera D435f addresses challenges for autonomous mobile robots.
03
'22
Written on
Keysight technologies News
Keysight Test Solutions Selected by NTU Singapore to Advance 6G Technology Based on Terahertz Frequencies
Enables leading research university to validate electronic-photonic hybrid approach used to support tera bit per second data rates.
02
'22
Written on
Mouser News
Mouser Electronics Recognised As Global Distributor of the Year by Littelfuse for Fifth Consecutive Year
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, proudly announces that it has received the 2021 Global High-Service Distributor of the Year award from Littelfuse, an industrial technology manufacturing company empowering a sustainable, connected, and safer world.
02
'22
Written on
PEPPERL+FUCHS PROCESS AUTOMATION
ecom instruments at the Hannover Messe 2022: Smart Devices for the Digitalization of Hazardous Areas
For a long time, hazardous areas remained untouched by digitalization because any mobile devices used must meet the strict requirements of explosion protection due to the risks in such areas. With intrinsically safe smart devices, the Pepperl+Fuchs brand ecom instruments is bringing digital transformation to hazardous areas.
01
'22
Written on
Intel News
Accelerated Innovations for Sustainable, Open HPC
This year, Intel has committed to achieve net-zero greenhouse gas emissions in our global operations by 2040 and to develop more sustainable technology solutions. Keeping up with the insatiable demands for computing while creating a sustainable future is one of the biggest challenges for high performance computing (HPC). While daunting, it is achievable if we address every part of the HPC compute stack – silicon, software, and systems.
01
'22
Written on
Renesas News
