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Dana Strengthens e-Propulsion Systems, Controls, Software, and Electronics Engineering Capabilities with Investment in Pi Innovo LLC

Dana Incorporated (NYSE: DAN) announced today that it has acquired a non-controlling stake in Pi Innovo LLC, a leader in embedded software solutions and electronics control units for the light vehicle, commercial vehicle, and off-highway markets.

Leti-cea News

CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies

​What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.

ZF News

ZF expands production of world leading advanced camera technology with new plant in Poland

ZF is expanding its manufacturing footprint for advanced Driver Assist Systems technologies with the launch of its new Electronics Plant in Częstochowa, Poland. The new facility and its 100 employees have initiated serial production of the company’s innovative S-Cam4.8 cameras.

ST News

STMicroelectronics Introduces World’s First All-in-One, Multi-Zone, Direct Time-of-Flight Module

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has extended its portfolio of FlightSense Time-of-Flight (ToF) sensors with the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene.

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