09
'23
Written on
Nexcom News
09
'23
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Telit News
Telit Cinterion 5G FN980 and FN990 Series Data Cards Validated for Use with NVIDIA Jetson Xavier and Jetson Orin
Telit Cinterion, a global leader in the internet of things (IoT), today announced it has completed verification of its 5G FN980 and FN990 series data cards for use with NVIDIA® Jetson AGX Xavier, Jetson AGX Orin and Jetson Orin NX modules.
09
'23
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Infineon News
Infineon TRAVEO T2G Cluster and Altia CloudWare software platform for display applications to be showcased at CES 2023
Infineon Technologies AG and Altia, an international leader in graphical user interface (GUI) design and development tools, has announced their cooperation.
09
'23
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ams OSRAM News
ams OSRAM releases industry leading 0.5Mpixel global shutter CMOS image sensors to save space and power in wearable and mobile devices
Ams OSRAM, a global leader in optical solutions, today extended its Mira family of pipelined, high- sensitivity, global shutter CMOS image sensors with the launch of the 2.3mm x 2.8mm, 0.5Mpixel Mira050.
06
'23
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CEVA News
CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution
CEVA, Inc, the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, has announced that Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, has licensed and deployed the CEVA-XC4500 Communication Processor and CEVA-BX1 Digital Signal Controller in its 3rd generation V2X chipsets, TEKTON3 and SECTON3.
06
'23
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U Blox News
U-blox LTE-M module fully certified in Japan
U-blox, a global provider of leading positioning and wireless communication technologies and services, announced the certification of its SARA-R5 series on all the Japan MNOs’ LTE-M networks.
06
'23
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Renesas News
Renesas Announces Its First Wi-Fi Development Kit with Support for New Matter Protocol
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has announced its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth® Low-Energy and IEEE 802.15.4 (Thread) products, including products from recently acquired Dialog Semiconductor and Celeno Communications.
06
'23
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Anritsu News
Anritsu Field Master Pro MS2090A Wins Fierce Innovation Award, Telecom Edition in T&M Category
Anritsu Company announces that its Field Master Pro MS2090A real-time spectrum analyzer has been named the winner in the Network Test & Measurement category Fierce Innovation Award, Telecom Edition 2022.
06
'23
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TDK News
TDK collaborates with Texas Instruments on new i3 Micro Module, the world’s first sensor module with built-in edge AI and wireless mesh connectivity
TDK Corporation has announced the TDK i3 Micro Module, the world’s first module with built-in edge AI and wireless mesh connectivity capability.
06
'23
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IAR Systems News
