Dana Incorporated (NYSE: DAN) announced today that it has acquired a non-controlling stake in Pi Innovo LLC, a leader in embedded software solutions and electronics control units for the light vehicle, commercial vehicle, and off-highway markets.
What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.
ZF is expanding its manufacturing footprint for advanced Driver Assist Systems technologies with the launch of its new Electronics Plant in Częstochowa, Poland. The new facility and its 100 employees have initiated serial production of the company’s innovative S-Cam4.8 cameras.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has extended its portfolio of FlightSense Time-of-Flight (ToF) sensors with the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene.