30
'22
Written on
Digi-Key News
30
'22
Written on
Arkema News
Our electroactive polymers showcased in journal SCIENCE
Piezotech® electroactive polymers offer an infinite range of possibilities in organic electronics. To broaden the knowledge and development of these materials, Arkema collaborates with the world’s leading universities. Recent research led by Pennstate University (USA) was published in the prestigious American scientific journal SCIENCE showcasing these materials of the future.
30
'22
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Anritsu News
Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth®
EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth® wireless technology.
30
'22
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Harwin News
HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS
Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations.
30
'22
Written on
Congatec News
CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM
Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.
29
'22
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WM5G News
Deciphering Open RAN – Exploring the opportunities of open access connectivity in the 5G era
As connectivity is evolving, Open RAN (Radio Access Network) has rapidly become a hot topic for the 5G industry and the players within it.
29
'22
Written on
Digi-Key News
Digi-Key Electronics and Analog Devices to Host Webinar on New Edge Artificial Intelligence Use Cases
Digi-Key Electronics, which offers the world’s largest selection of electronic components in stock for immediate shipment, will host a webinar in collaboration with Analog Devices, Inc.
29
'22
Written on
ST News
STMicroelectronics reveals 2.5V rad-hard digital-to-analog converter for next-generation satellite applications
The STMicroelectronics RHRDAC121 radiation-hardened digital-to-analog converter (DAC) operates down to 2.5V for use in modern, low-power system designs that older 3.3V parts cannot support.
28
'22
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Nexperia News
Nexperia officially launches new Dallas design center
Nexperia today announced the official launch of its new design center in Dallas, Texas. Having recently celebrated its 5th anniversary as an independent company, this development marks another major step towards Nexperia’s stated goal of becoming a world leader in essential semiconductors by 2030. First R&D Facility in North America enables entry to power management IC market.
28
'22
Written on
Intel News
