30
'22
Written on
Infineon News
30
'22
Written on
Nexcom News
VTC 1031 and nROK 1031 Compact PCs Pave Way for Vehicle and Railway Applications
In modern society, providing high-speed public wireless communication is significant in fulfilling commuters’ busy lifestyles. NEXCOM responds by introducing the VTC 1031 and nROK 1031, their compact mid-range vehicle and railway PCs respectively.
30
'22
Written on
ST News
STMicroelectronics reveals 100-Watt wireless power receiver for fastest Qi-compliant charging
Unique high-power capability boosts mobile user experience, brings new opportunities for medical devices and smart industrial technology.
30
'22
Written on
Congatec News
Congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant.
30
'22
Written on
Kontron News
Kontron and Napatech collaborate on optimized platform for 5G User Plane Function in telco edge data centers and private networks
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT) and of cloud and carrier-class integrated infrastructure platforms, and NapatechTM (OSLO: NAPA.OL).
29
'22
Written on
Allied Electronics & Automation News
Allied Electronics & Automation Announces the new RS DesignSpark Accelerate Incubator Program
Based at the RS DesignSpark Innovation Center in Bryan-College Station, Texas, the new incubator program will provide startup companies involved in hardware and software solutions relevant to RS Group markets and technologies with a significant slate of benefits, including up to $50,000 of in-kind funding.
29
'22
Written on
Infineon News
German Federal Printing Office, Fraunhofer and Infineon demonstrate for the first time electronic passport security for the quantum computer era
Quantum computers could become a serious threat to the security of documents such as electronic passports before the present decade is over.
29
'22
Written on
ST News
STMicroelectronics achieves EMVCo certification for biometric-payment platform, cutting time-to-market for card issuers
ST’s complete certified technology platform combines embedded secure element and ultra-low-power general-purpose microcontroller for cost-effective and robust protection.
29
'22
Written on
Texas Instruments News
TI expands space-grade product portfolio with radiation-hardened and radiation-tolerant plastic packages for missions from new space to deep space
Engineers can use new ADCs and power semiconductors to increase thermal efficiency and reduce system size and weight while meeting radiation and reliability requirements.
29
'22
Written on
Qualcomm News
