08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon named CES 2023 “Innovation Awards Honoree” for three different products: EXCELON F-RAM, XENSIV CSK and Smart Alarm System

Infineon Technologies AG has been named a CES^® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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ANSYS News

Ansys Announces GlobalFoundries Certification of Semiconductor Tools for GF 22FDX^® Platform

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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Qualcomm News

New Qualcomm Compact Macro 5G RAN platform optimizes mmWave investments

Introducing a powerful combination of small cell and macro cell innovation.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-08T00:00:00+00:00" | date "longDate" }}

KLA News

KLA Launches Revolutionary X-Ray Metrology System

New Axion^® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics simplifies sustainable product design with USB Type-C^® Power Delivery software for STM32 microcontrollers

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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ST News

STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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Provertha News

New PROVERTHA M12 angle adapters for X/D conversion save space in tight installation spaces

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

Read more…

08 {{ "2022-12-08T00:00:00+00:00" | date "MMM" }} '22

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VSITECH News

VSI launches the first automotive industry-standard high-speed SerDes silicon

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

Read more…

07 {{ "2022-12-07T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-12-07T00:00:00+00:00" | date "longDate" }}

Belfuse News

Bel Power Solutions Unveil High-Voltage Fuses for eMobility

Bel Power Solutions, a Bel group company, today announced the availability of a new line of automotive fuses, most suitable for eMobility applications seen in electric vehicles (EVs), hybrid vehicles, and electrical energy storage (EES).

Read more…

07 {{ "2022-12-07T00:00:00+00:00" | date "MMM" }} '22

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TDK News

High power density 7.5kW 1U programmable DC power supply series extended with six new output configurations

TDK Corporation announces the introduction of six new models to the 7.5kW TDK-Lambda GENESYS+ series of high power density programmable DC power supplies.

Read more…

Technical Articles

Satellite monitoring systems for real-time RF intelligence

Case studies

AI-Based Image Processing for Multi-Chamber Lamp Testing

Infineon named CES 2023 “Innovation Awards Honoree” for three different products: EXCELON F-RAM, XENSIV CSK and Smart Alarm System

Infineon Technologies AG has been named a CES^® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

Ansys Announces GlobalFoundries Certification of Semiconductor Tools for GF 22FDX^® Platform

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

New Qualcomm Compact Macro 5G RAN platform optimizes mmWave investments

Introducing a powerful combination of small cell and macro cell innovation.

KLA Launches Revolutionary X-Ray Metrology System

New Axion^® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

STMicroelectronics simplifies sustainable product design with USB Type-C^® Power Delivery software for STM32 microcontrollers

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

STMicroelectronics boosts EV performance and driving range with new silicon-carbide power modules

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

New PROVERTHA M12 angle adapters for X/D conversion save space in tight installation spaces

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

VSI launches the first automotive industry-standard high-speed SerDes silicon

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

Bel Power Solutions Unveil High-Voltage Fuses for eMobility

Bel Power Solutions, a Bel group company, today announced the availability of a new line of automotive fuses, most suitable for eMobility applications seen in electric vehicles (EVs), hybrid vehicles, and electrical energy storage (EES).

High power density 7.5kW 1U programmable DC power supply series extended with six new output configurations

TDK Corporation announces the introduction of six new models to the 7.5kW TDK-Lambda GENESYS+ series of high power density programmable DC power supplies.

International

Technical Articles

Case studies

Infineon Technologies AG has been named a CES® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

Foundry certification enables GF 22FDX customers to validate their chip designs’ power integrity and reliability with Ansys golden signoff tools.

Introducing a powerful combination of small cell and macro cell innovation.

New Axion® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.

Hyundai Motor Company has chosen ST’s highly efficient ACEPACK DRIVE power modules for multiple models of its E-GMP vehicle platform.

Provertha has expanded its robust adapter solutions in protection class IP 67 with compact, angled versions, which can be used to implement angled M12 plug-in connections from X to D coding and vice versa without additional cabling.

VSI, a developer of high-speed communication semiconductors for vehicles, have introduced the industry's first commercial serializer/deserializer (SerDes) solution that complies with the Automotive SerDes Alliance (ASA) standard.

Bel Power Solutions, a Bel group company, today announced the availability of a new line of automotive fuses, most suitable for eMobility applications seen in electric vehicles (EVs), hybrid vehicles, and electrical energy storage (EES).

TDK Corporation announces the introduction of six new models to the 7.5kW TDK-Lambda GENESYS+ series of high power density programmable DC power supplies.

International

Infineon Technologies AG has been named a CES^® 2023 “Innovation Awards Honoree” for three products including its EXCELON F-RAM, XENSIV Connected Sensor Kit (CSK) and Smart Alarm System (SAS) for smart homes.

New Axion^® T2000 Extends Advanced Metrology Portfolio That Addresses Vertical Scaling Challenges in Memory Chip Manufacturing.

STMicroelectronics’ latest X-CUBE-TCPP software pack enhances the Company’s portfolio of USB Type-C^® port-protection ICs and STM32 interface IP (intellectual property) to simplify product designs leveraging the USB Power Delivery specification.