ASRock Industrial is pleased to introduce a range of upgrades in industrial motherboards powered by 13th Gen Intel® Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads, supporting Intel® W680, Q670, and H610 chipsets.
Rubycon complements the range of extremely compact components with guaranteed high-temperature resistance and long service life. This ranges from 3,000 (MXK), 5,000 (VXK), 7,000 (GXK) and 10,000 hours (NXK) at ambient temperatures up to 105 °C.
Innodisk is leading the way and launching new InnoEx Virtual I/O Expansion Module, which helps global industries efficiently deploy various AI smart applications through the integration of software and hardware using virtual I/O expansion technology.
Aethertek selected Keysight Open RAN Studio to test the end-to-end performance of its radio frequency front-end modules and millimeter wave phase array antennas.
The BMR473 digital non-isolated PoL converter from Flex Power Modules is now available in a surface-mount format with solder bump terminations. This new mechanical version is also suitable for reverse mounting during reflow-soldering.
The DDR5 product for servers using 1anm, the fourth generation of the 10nm process technology, has been validated on the 4th Gen Intel® Xeon® Scalable processor for the first time in the industry’s history.
Built with a market-leading 5nm controller and seventh-generation V-NAND, the PM9C1a will enable a new level of everyday PC efficiency, while also handling demanding computing and gaming tasks.
Infineon Technologies AG is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021.