06
'21
Written on
Melexis News
06
'21
Written on
CEA Leti News
CEA-Leti Research Team Proposes New Approach for Next-Generation Memories with RRAM Energy-Storage Breakthrough
In a breakthrough that is expected to significantly advance in-memory energy-storage in resistive-RAM (RRAM) devices, CEA-Leti has proposed a “newfangled approach” that allows these devices to operate as energy-storage elements as well as memory, depending on the applied bias.
06
'21
Written on
Telit News
Telit’s LTE Cat 1 LE910S1-ELG with Embedded GNSS Receiver Enables High-Performance IoT Applications in Latin America
New all-in-one cellular LTE and GNSS module provides superior throughput, latency, mobility and voice support. Product covers all LATAM 4G and 2G Bands plus mainstream bands used in Europe and Asia, making it an ideal module for intercontinental deployments.
06
'21
Written on
ANSYS News
Ansys Empowers SPEC Innovations to Shoot for the Moon in NASA Challenge
SPEC Innovations cuts the cost and time of developing a digital twin of a lunar rover by 1,000% with Ansys’ simulation software.
06
'21
Written on
NEC Corporation News
DOCOMO and NEC successfully test 5G Standalone with base station
NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have succeeded in interoperability testing for 5G standalone (SA) using a 5G base station baseband unit (5G CU/DU) conforming to O-RAN open interface specifications and radio units (RUs) of different vendors.
06
'21
Written on
MURATA News
Power inductors for 5G which offer improvements in Isat and RDC specifications
Murata announces availability of the DFE21CCN_EL series of power inductors for 5G smartphones. Intended for use in DC/DC converters and power management circuitry, these components signify major enhancements in operational performance parameters when compared to the company’s conventional inductors.
04
'21
Written on
Kontron News
KONTRON’S ACE FLIGHT 4783 DUAL MODEM MODMAN IS NOW FLIGHT-QUALIFIED
Kontron, a leading global provider of embedded computing Inflight Entertainment and Connectivity (IFE&C) solutions, today announces the first flight and qualification of the ACE Flight 4783 Dual Modem MODMAN.
03
'21
Written on
Samsung News
Samsung Introduces Three New Logic Solutions to Power the Next Generation of Automobiles
Samsung adds 5G connectivity with the Exynos Auto T5123, performance with the Exynos Auto V7 and reliability with the ASIL-B certified power management IC for automobiles.
03
'21
Written on
Toshiba News
Toshiba Releases High Peak Output Current Photocouplers in Thin Packages for Driving IGBTs/MOSFETs Gates
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has introduced two photocouplers, “TLP5705H” and “TLP5702H,” housed in a thin SO6L package, for use as insulated gate drivers for small to medium capacity IGBTs/MOSFETs. Volume shipments start today.
03
'21
Written on
Analog Devices News
