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Intel News

INTEL ACCELERATES PROCESS AND PACKAGING INNOVATIONS

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

TDK News

INDUCTORS: TDK EXPANDS ITS RANGE OF COUPLED INDUCTORS

TDK Corporation (TSE:6762) has extended its range of coupled inductors to include the new EPCOS series B82472D6*. The nine series types cover an inductance range of 2 x 2.2 µH to 2 x 47 µH and are designed for maximum rated currents of 1.1 A to 4.3 A.

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