30
'22
Written on
ST News
30
'22
Written on
ONSEMI News
onsemi to Show Best-In-Class Image Sensing at VISION
onsemi, a leader in intelligent power and sensing technologies, will showcase its latest image sensing technology at VISION – the world’s leading trade fair for machine vision – at booth 10G30.
29
'22
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Panasonic Industry News
Panasonic Industry launches new Bluetooth® Low Energy module with 512 kB flash for cost-effective applications that still require high performance
Panasonic Industry Europe has extended its range of Bluetooth® LE modules with the launch of the PAN1782, which targets cost-effective applications that still require high performance, including professional lighting, asset tracking, smart home, advanced wearables, and higher value IoT applications.
29
'22
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Tektronix News
Tektronix Showcases New and Innovative, Precise and Easy-to-Operate Technology Solutions at electronica 2022
Tektronix, Inc., a leading global equipment and software manufacturer delivering innovative, precise and easy-to-operate test, measurement and monitoring solutions, has today announced its participation at this year’s electronica 2022 exhibition, taking place in Munich from November 15-18.
29
'22
Written on
DTP
Fundamental Thermoelectric Technology Patent Granted to DTP Thermoelectrics
First-of-its-kind system enables a new class of solid-state thermal management systems that is currently only possible with bulkier, mechanical alternatives.
28
'22
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Diodes Incorporated News
Low-Power 1.8V, 2.5Gbps, 4 Data Lane ReDriver from Diodes Incorporated Supports MIPI D-PHY Protocols
Diodes Incorporated today announced the latest addition to its broad portfolio of ReDrivers with the release of a 1.8V low-power, 4 data lanes 2.5Gbps ReDriver.
28
'22
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Siemens News
Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi-die solution
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
28
'22
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Renesas News
Renesas’ ClockMatrix System Synchronizer Delivers Class D Compliance for O-RAN S-Plane Requirements
ClockMatrix Device Provides Synchronization and Software Solution for the AMD RFSoC DFE Development Platform and O-RU Reference Design.
28
'22
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Rutronik Info
State-of-the-art sensor fusion with the Rutronik Adapter Board RAB1
Rutronik System Solutions' board family gets a new addition with the RAB1 - Sensorfusion. The adapter board offers its own platform that allows machine learning (ML) based sensor fusion, which forms the basis and the future of artificial intelligence (AI). Equipped with the highest performance sensors from Infineon, Bosch SE, and Sensirion.
28
'22
Written on
TDK News
