24
'22
Written on
Digi-Key News
24
'22
Written on
Keysight technologies News
Keysight Solutions Selected by Flexium to Deliver New Liquid Crystal Polymer Transceiver Applications
Joint effort improves mmWave test efficiency and accelerates innovation of 5G FR2, Non-Terrestrial Network, Autonomous Vehicle and E-band applications.
24
'22
Written on
Actia News
THE “ACTIA INSIDE” STRATEGY
All the features that make a vehicle “smart” require on-board systems. Systems management software is a major component of vehicle development costs. It is this creation of value that ACTIA wishes to promote by combining.
24
'22
Written on
NEC Corporation News
NEC and Fortinet enter global agreement to deliver end-to-end, high-performance security for 5G networks
NEC Corporation, a leader in the integration of IT and network technologies, and new windowFortinet®, a global leader in broad, integrated, and automated cybersecurity solutions, have entered a global agreement to jointly build secure 5G networks for communication service providers (CSPs).
24
'22
Written on
Phytec News
PHYTEC at VISION: The Smallest Embedded Cameras with S-Mount and an ISP Calibration Service for i.MX 8M Plus Projects
Professional image processing for series products: Phytec will showcase components and services for a fast and cost-effective way to market at the Vision Trade Fair (Stuttgart, October 04-06).
23
'22
Written on
Diodes Incorporated News
1.8V PCIe 4.0 ReDriver from Diodes Incorporated Extends PCB Trace Lengths While Minimizing Power Consumption
Diodes Incorporated has further strengthened its range of PCIe® solutions with the addition of a new high-speed data rate ReDriver device.
23
'22
Written on
Schaffner News
Schaffner adds innovative IEC connector with two locking systems to power connector range
Schaffner, the international leader in the fields of electromagnetic compatibility and power quality, announces the availability of the latest addition to its extensive range of IEC power connectors.
23
'22
Written on
Infineon News
Infineon expands supplier base for silicon carbide wafers / Supply agreement signed with US-based II-VI Incorporated
Infineon Technologies AG and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide (SiC) wafers.
23
'22
Written on
HARTING USA
3D-MID – minimized sensing high-tech within the patient
When it comes to miniaturization, the ideal partner is the leading 3D-MID supplier HARTING. The company is located in the innovative heart of the Swiss watch industry in Biel, which is also a growing hub for medical device technologies. This location was chosen with care, because in this region people have grown up in a world of micromechanics - generation after generation.
23
'22
Written on
Telit News
