30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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FTDI Chip News

FTDI Introduces Evaluation Board to Accompany its Latest Generation of USB Power Delivery ICs

To back up the company’s expertise in creating advanced semiconductor technology for USB power delivery purposes, FTDI Chip has now announced a new development solution.

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30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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Tracopower News

TMW Series- AC/DC Power Supply for medical, household and industrial applications

Fully encapsulated, dust resistant, and waterproof (IP68 certified).

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30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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Renishaw News

Hardware and software enhancements for Renishaw's Equator gauging systems to be revealed at EMO Milano 2021

Renishaw will showcase new hardware and software enhancements for the Equator gauging system at EMO Milano 2021 (hall 5, stand C14).

Read more…

30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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Keysight technologies News

Keysight, Xilinx and Cisco Showcase Solutions that Support Smooth Migration from 4G LTE Networks to 5G Open RAN

Integrated O-RAN validation solutions demonstrate end-to-end interoperability and performance of multi-vendor network architectures

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30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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Texas Instruments News

Texas Instruments new TI-84 Plus CE Python graphing calculator introduces students to programming

Available for back to school, the newest TI graphing calculator brings popular Python programming language to the classroom.

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30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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Toshiba News

TOSHIBA RELEASE ARM^® CORTEX^®-M4 MICROCONTROLLERS FOR MOTOR CONTROL

New devices are first products in the TXZ+ family.

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30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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Cognex News

Cognex VisionPro Software Breaks Down Barriers Between Deep Learning and Traditional Vision

Two major new releases deliver advanced vision tools and tighter deep learning integration in a high-performance platform.

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30 {{ "2021-07-30T00:00:00+00:00" | date "MMM" }} '21

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ZEISS News

ZEISS Applies Artificial Intelligence to 3D X-ray Microscope Reconstruction Technologies

Up to 10x higher throughput plus even better image quality with new DeepRecon Pro and PhaseEvolve modules from ZEISS.

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29 {{ "2021-07-29T00:00:00+00:00" | date "MMM" }} '21

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Ni News

NI Unlocks the Power of Test Data and Software at NI Connect

NI unveils product advancements in software-connected systems that fuel innovation across the product life cycle.

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29 {{ "2021-07-29T00:00:00+00:00" | date "MMM" }} '21

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Intel News

INTEL ACCELERATES PROCESS AND PACKAGING INNOVATIONS

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

Read more…

To back up the company’s expertise in creating advanced semiconductor technology for USB power delivery purposes, FTDI Chip has now announced a new development solution.

Fully encapsulated, dust resistant, and waterproof (IP68 certified).

Renishaw will showcase new hardware and software enhancements for the Equator gauging system at EMO Milano 2021 (hall 5, stand C14).

Integrated O-RAN validation solutions demonstrate end-to-end interoperability and performance of multi-vendor network architectures

Available for back to school, the newest TI graphing calculator brings popular Python programming language to the classroom.

New devices are first products in the TXZ+ family.

Two major new releases deliver advanced vision tools and tighter deep learning integration in a high-performance platform.

Up to 10x higher throughput plus even better image quality with new DeepRecon Pro and PhaseEvolve modules from ZEISS.

NI unveils product advancements in software-connected systems that fuel innovation across the product life cycle.

International