NXP® Semiconductors (NASDAQ: NXPI) today announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases, and supports the new groundbreaking Matter connectivity protocol.
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), announces new boards and modules featuring the 12th Gen Intel® Core processors (Codename Alderlake-S series) for the Internet of Things. Kontron will update the current mini-ITX, µATX and ATX motherboards with this new processor series, and has also selected it as the 1st platform to adopt the new PICMG® COM-HPC®/Client form factor, as it serves best new technology trends set by COM-HPC® client specification.
As the global market leader in automotive semiconductors, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) continues its innovation path to shape future mobility.
NXP® Semiconductors (NASDAQ: NXPI) has announced two updates to its industry leading automotive radar portfolio, now designed-in at 20 top global OEMs. The industry’s first dedicated 16nm imaging radar processor, the NXP S32R45, has been released into mass production, with initial customer ramp-up starting in the first half 2022.
Mobileye announces the new EyeQ® Ultra system-on-chip for autonomous vehicles and expanded relationships with major automakers, including Ford, Volkswagen Group and Geely’s ZEEKR brand. Intel launches the 12th Gen Intel® Core i9-12900HK – the world’s best gaming laptop platform1 – and delivers the new P-series product line for ultra-portable, enthusiast-class performance. Intel ships high-performance discrete graphics to customers and announces more than 50 Alchemist design wins.
Congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems.