Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the successful completion of acquisition of Celeno Communications (“Celeno”), the leading provider of smart, innovative Wi-Fi solutions, as of December 20, 2021.
NXP Semiconductors N.V. (NASDAQ : NXPI), a leading automotive semiconductor company, has announced a strategic partnership with Foxconn Industrial Internet Ltd., a subsidy company of Foxconn group, (FII;601138.SH) to transform the car into the ultimate edge device. NXP will provide FII with its comprehensive portfolio of automotive technologies.
Transfer Multisort Elektronik (TME), the Poland-based component distributor, has further strengthened its portfolio of supercapacitors with the addition of 15 new SPSCAP products.
Analog Devices, Inc. (ADI) today introduced a highly efficient multi-phase synchronous boost controller that regulates high-power Class-D amplifiers in automotive infotainment systems.
NEC Corporation (NEC; TSE: 6701) today announced it has provided packet core (5GC) and base stations (5G RUs, CU/DU) for the 5G standalone (SA)-based services that NTT DOCOMO, INC. (DOCOMO) launched commercially on December 13, 2021.
Arkema announces the project to double its UV curable resins production capacity at its Nansha plant in China. This expansion will support the fast-growing demand in Asia for cutting-edge solutions in electronics, driven by 5G technology, and in renewable energies.
Built on the leading TSMC N4 process, Dimensity 9000 brings full flagship performance and power-efficiency to smartphones. First MediaTek powered devices will be available in Q1 of 2022.