Can the telecoms industry boost sustainability? Although not the biggest culprit of heightened carbon emissions and waste production by far, the telecommunications industry must still make its operations, products and services more sustainable.
Siemens Digital Industries Software announced it has enabled several of its leading electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules and integrated circuit (IC) design in the cloud.
Keysight Technologies, Inc. delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, and Proventia Oy, an internationally operating Finnish technology company that provides solutions in the engine, machine and vehicle industries to combat climate change, have collaborated to improve electric vehicle (EV) battery test solutions.
The AEC-Q200 certified high temperature chip resistor ERJH series and the new ZU series of Electrolytic Polymer Hybrid Capacitors with outstanding ripple current and temperature features.
TDK Corporation (TSE:6762) announces the portfolio expansion of its Micronas direct-angle Hall-effect sensor family with the HAR 3927**. This product uses proprietary 3D HAL® pixel-cell technology and addresses the need for ISO 26262-compliant development. The new sensor comes with both a ratiometric analog output as well as a digital SENT interface according to SAE J2716 rev. 4.
The MediaTek Pentonic smart TV series is built on MediaTek’s innovative technologies in display, audio, AI, broadcasting and connectivity. All-in-one flagship chip integrates powerful AI-engines, MEMC, VVC decoding and picture-in-picture technology.
The Connectivity Standards Alliance (CSA), an organization with over 400 companies working together to simplify and harmonize the Internet of Things (IoT) through technology standards, and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a world leader in semiconductor solutions, today announced Infineon will be joining the Alliance’s Board of Directors as a Promoter Member.
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched a high voltage transistor output automotive photocoupler, “TLX9188,” for isolated signal communication in automotive equipment, including electric mobility vehicles. Volume shipments start today.
ROHM has recently been certified as a preferred supplier of SiC power solutions by United Automotive Electronic Systems Co., Ltd., (UAES), a Chinese Tier 1 comprehensive automotive manufacturer.