TDK Corporation (TSE:6762) today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.
STMicroelectronics has announced new STM32Cube software packs and tools, as well as evaluation boards, to accelerate development with the latest STM32U5 microcontrollers (MCUs), which are now ready for mass-market applications with stock at authorized distributors.
The safe analog input module SAI 041 expands the modular S-DIAS Safety System. Four analog current inputs with a measurement range from 4-20 mA and a resolution of 16 bits, as well as the 24 V sensor supply are integrated into the 25 mm wide DIN rail module.
Sivers Semiconductors AB announces today the participation at SPIE Photonex + Vacuum Technologies in Glasgow, UK. The subsidiary, Sivers Photonics, will exhibit and speak at the event taking place from 28 – 30 September.
Prysmian Group highlights the impact of leveraging bend-insensitive fibres across the entire wavelength spectrum used by current and future PON technology.
Paragraf, the leader in the development and production of graphene electronic devices, has appointed Charles Platts as Chief Finance Officer. Charles will support Paragraf throughout its next phase of rapid growth, and beyond, bringing a strong commercial focus.
Vecow ECX-2400 AI Computing System targets demanding industrial applications with higher system reliability, lower power consumption and faster time-to-market - ideal Edge AI solution for lower total cost of ownership (TCO).
Joint effort accelerates the pace of 5G and electric vehicle innovation. Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, and National Central University Optical Sciences Center (NCUOSC) announced a collaboration to improve the design and test validation efficiency of gallium nitride (GaN) and silicon carbide (SiC) applications, accelerating the pace of 5G and electric vehicle (EV) innovation.
At productronica 2021 in Munich, Schmalz will show what handles sensitive electronic components and assembled PCBs gently and safely. Trade visitors will find these and other solutions for vacuum automation in electronics manufacturing in hall B3 at booth 301.