21
'21
Written on
E-Consystems News
21
'21
Written on
TTI News
TTI honoured by Molex with 2020 European Distributor of the Year awards
TTI, Inc., a leading specialty distributor of electronic components, has again been honoured by Molex with Distributor of the Year awards.
19
'21
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ST News
STMicroelectronics Helps Lierda Develop Low-Power Bluetooth Module for Wireless Solutions
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that a new low-power Bluetooth module from Lierda Science & Technology Group Co. Ltd, a hi-tech enterprise that provides IoT system and smart product solutions in China, uses an ST STM32WB55* Bluetooth® LE (BLE) microcontroller (MCU).
19
'21
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Ficosa News
FICOSA REACHES THE MILESTONE OF MORE THAN 6 MILLION REAR-VIEW CAMERAS SOLD
These good results and its commitment to R&D consolidate the company as a benchmark in vision systems.
18
'21
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E-Peas News
E-PEAS Introduces Versatile New Buck-Boost ICs for Highly Efficient Energy Harvesting from Solar & RF/Vibrational Sources
Expanding its portfolio of advanced power management ICs (PMICs) for energy harvesting applications, e-peas announces the availability of two new devices adding complementary features to previously released products.
18
'21
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Bihl + Wiedemann News
IO-LINK WITH BIHL+WIEDEMANN: EASY, FLEXIBLE & COST-EFFICIENT
Do you already use the manufacturer-independent IO-Link interface to connect sensors and actuators to the control system level? Bihl+Wiedemann IO-Link solutions are user-friendly and cost-saving at the same time. With ASi-5, it is possible to integrate any IO-Link device into ASi and to configure it with up to 32 bytes of process data.
18
'21
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Renesas News
Renesas Unlocks Personalized Air Quality Experiences With Ultra-Low Power ZMOD4510 Outdoor Air Quality Sensor Platform
Enhanced Platform Delivers Selective Ozone Detection, Miniature Sensor, and a IP67 Waterproof Package for Wearables, Smartphones, and Industrial Monitoring Devices.
18
'21
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APPLIED MATERIALS INC. News
APPLIED MATERIALS BREAKTHROUGH IN CHIP WIRING ENABLES LOGIC SCALING TO 3NM AND BEYOND
Applied Materials, Inc. today unveiled a new way to engineer the wiring of advanced logic chips that enables scaling to the 3nm node and beyond.
18
'21
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Samsung News
5G for all – LPDDR5 uMCP opening up next-generation smartphone
LPDDR5 uMCP is giving the performance boost needed as high and mid-range smartphones enter the 5G space.
18
'21
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TDK News
