01 {{ "2022-04-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-04-01T00:00:00+00:00" | date "longDate" }}

Nowi Energy News

Nowi Launches New Chip with Extended Energy Harvesting Capabilities and New Power Management Features

Nowi, a Dutch semiconductor company specialised in energy harvesting and power management, launches today the newest addition to its portfolio with Diatom.

Read more…

01 {{ "2022-04-01T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-04-01T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Selected by VTT to Support Open Testing and Integration Facility in Finland

Keysight offers common open RAN software platforms and built-in test automation capabilities, which helps accelerate verification of components, sub-systems and end-to-end systems across the product workflow.

Read more…

31 {{ "2022-03-31T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-31T00:00:00+00:00" | date "longDate" }}

Rutronik Info

For a switchless design

The Capacitive Hidden Switch from Schurter now at Rutronik. Invisible and particularly hygienic: The Capacitive Hidden Switch (CHS) from Schurter functions entirely without mounting holes in the user interface and therefore can be attached in hidden places.

Read more…

31 {{ "2022-03-31T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-31T00:00:00+00:00" | date "longDate" }}

ST News

Wacom, STMicroelectronics, and CEVA Collaborate to Enhance the Digital Pen Experience

This collaboration brings the power of advanced 3D gesture, cursor, and motion control to the digital pen, unleashing a host of new applications and user convenience.

Read more…

31 {{ "2022-03-31T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-31T00:00:00+00:00" | date "longDate" }}

Mouser News

Mouser Electronics Signs Global Distribution Agreement with ISI to Deliver High-Performance PCIe XMC Modules

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, announces a new distribution agreement with Interconnect Systems International (ISI), a Molex company and leading supplier of signal processing and data acquisition solutions.

Read more…

31 {{ "2022-03-31T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-31T00:00:00+00:00" | date "longDate" }}

Danfoss News

SEMIKRON and Danfoss Silicon Power join forces to establish the ultimate partner in Power Electronics

SEMIKRON and Danfoss Silicon Power announced a merger today to create a joint business specialized in Power Electronics focusing on power semiconductor modules.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Congatec News

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Harwin News

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Harwin has introduced horizontal backshells for its Gecko-Screw-Lok (Gecko-SL) series of lightweight, high-reliability (Hi-Rel) connectors. These backshells ensure a fully EMI/RFI shielded connection for horizontal 1.25mm pitch board-to-cable connections. Previously Gecko EMI/RFI shielding was only available on vertical board-to-cable orientations.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Anritsu News

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

Read more…

30 {{ "2022-03-30T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-30T00:00:00+00:00" | date "longDate" }}

Arkema News

Our electroactive polymers showcased in journal SCIENCE

Piezotech^® electroactive polymers offer an infinite range of possibilities in organic electronics. To broaden the knowledge and development of these materials, Arkema collaborates with the world’s leading universities. Recent research led by Pennstate University (USA) was published in the prestigious American scientific journal SCIENCE showcasing these materials of the future.

Read more…

Technical Articles

Motion profile selection in precision motion control

Case studies

Deployable 5G networks enable tactical communications

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

Nowi Launches New Chip with Extended Energy Harvesting Capabilities and New Power Management Features

Nowi, a Dutch semiconductor company specialised in energy harvesting and power management, launches today the newest addition to its portfolio with Diatom.

Keysight Selected by VTT to Support Open Testing and Integration Facility in Finland

Keysight offers common open RAN software platforms and built-in test automation capabilities, which helps accelerate verification of components, sub-systems and end-to-end systems across the product workflow.

For a switchless design

The Capacitive Hidden Switch from Schurter now at Rutronik. Invisible and particularly hygienic: The Capacitive Hidden Switch (CHS) from Schurter functions entirely without mounting holes in the user interface and therefore can be attached in hidden places.

Wacom, STMicroelectronics, and CEVA Collaborate to Enhance the Digital Pen Experience

This collaboration brings the power of advanced 3D gesture, cursor, and motion control to the digital pen, unleashing a host of new applications and user convenience.

Mouser Electronics Signs Global Distribution Agreement with ISI to Deliver High-Performance PCIe XMC Modules

SEMIKRON and Danfoss Silicon Power join forces to establish the ultimate partner in Power Electronics

SEMIKRON and Danfoss Silicon Power announced a merger today to create a joint business specialized in Power Electronics focusing on power semiconductor modules.

CONGATEC INTRODUCES VEHICLE COMPUTING TECHNOLOGY FOR SMART MOBILITY AT INTERTRAFFIC AMSTERDAM

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

HARWIN ADDS MORE SHIELDING OPTIONS FOR GECKO HI-REL CONNECTORS

Latest EMITE and Anritsu solution ensures compatibility of LTE, WLAN and Bluetooth^®

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.

Our electroactive polymers showcased in journal SCIENCE

International

Technical Articles

Case studies

White Paper

Nowi, a Dutch semiconductor company specialised in energy harvesting and power management, launches today the newest addition to its portfolio with Diatom.

Keysight offers common open RAN software platforms and built-in test automation capabilities, which helps accelerate verification of components, sub-systems and end-to-end systems across the product workflow.

The Capacitive Hidden Switch from Schurter now at Rutronik. Invisible and particularly hygienic: The Capacitive Hidden Switch (CHS) from Schurter functions entirely without mounting holes in the user interface and therefore can be attached in hidden places.

This collaboration brings the power of advanced 3D gesture, cursor, and motion control to the digital pen, unleashing a host of new applications and user convenience.

SEMIKRON and Danfoss Silicon Power announced a merger today to create a joint business specialized in Power Electronics focusing on power semiconductor modules.

Congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new rugged vehicle computing platforms for smart mobility applications in the extended temperature range at Intertraffic Amsterdam, Hall 5/Booth 309.

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth® wireless technology.

International

EMITE and Anritsu Corporation are proud to announce their latest combined solution for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth^® wireless technology.