03
'22
Written on
ViewSonic
03
'22
Written on
ANSYS News
SiPearl Selects Ansys’ Power Signoff Solution for European Supercomputer Chip
SiPearl will apply Ansys’ industry-leading multiphysics platform to meet power and reliability goals on Europe’s new state-of-the-art microprocessor.
03
'22
Written on
Sivers Semiconductors News
Sivers Semiconductors Announces Multiple New Products for Licensed 5G Bands at Mobile World Congress 2022
Sivers Semiconductors today announces the launch of multiple new products from the recently completed MixComm acquisition including 2nd generation beamformers, frequency converters, high-end fixed wireless access module.
03
'22
Written on
Inova Semiconductors News
Inova Semiconductors named one of Germany's most innovative companies in various studies by Capital and CHIP
Two independent studies once again rank Inova Semiconductors as one of the most innovative companies in Germany.
03
'22
Written on
PANASONIC ELECTRIC WORKS News
CC you soon: Discover the world’s smallest 1b type MOSFET relay
PANASONIC INDUSTRY EXTENDS SUCCESSFUL CC SERIES OF ITS PHOTOMOS® TSON PACKS WITH AN UNRIVALLED COMPACT AND CAPACITIVE COUPLED 1B TYPE.
02
'22
Written on
Paragraf News
Paragraf raises $60m as graphene-based electronics company sets sights on international growth
The funding round, which includes current investors Parkwalk and Amadeus, will enable the business to increase its technological capacity globally and enhance its R&D capabilities.
02
'22
Written on
Sivers Semiconductors News
Sivers Semiconductors and KREEMO Announce the World’s First Metaverse 360o 5G module
KREEMO and Sivers Semiconductors announced that they had succeeded in developing the world’s first high performance 5G module with a 360o coverage for metaverse at MWC 2022.
02
'22
Written on
ST News
Advanced MEMS sensors from STMicroelectronics power-up the Onlife era
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications and a top manufacturer of micro-electro-mechanical systems (MEMS), is introducing its third generation of MEMS sensors.
02
'22
Written on
NEC Corporation News
NTT DOCOMO and NEC are Onboarding 5G SA Core Using Energy-efficient and High-performance AWS Cloud Computing Services
NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have launched a proof-of-concept (PoC) testing to run NEC's 5G core network (5GC) service in a hybrid cloud environment that leverages the Amazon Web Services (AWS) cloud using end-to-end cloud-native network architecture.
02
'22
Written on
Anritsu News
