06
'21
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MURATA News
Power inductors for 5G which offer improvements in Isat and RDC specifications
Murata announces availability of the DFE21CCN_EL series of power inductors for 5G smartphones. Intended for use in DC/DC converters and power management circuitry, these components signify major enhancements in operational performance parameters when compared to the company’s conventional inductors.
06
'21
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NEC Corporation News
DOCOMO and NEC successfully test 5G Standalone with base station
NTT DOCOMO, INC. (DOCOMO) and NEC Corporation (NEC) have succeeded in interoperability testing for 5G standalone (SA) using a 5G base station baseband unit (5G CU/DU) conforming to O-RAN open interface specifications and radio units (RUs) of different vendors.
06
'21
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ANSYS News
Ansys Empowers SPEC Innovations to Shoot for the Moon in NASA Challenge
SPEC Innovations cuts the cost and time of developing a digital twin of a lunar rover by 1,000% with Ansys’ simulation software.
06
'21
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Telit News
Telit’s LTE Cat 1 LE910S1-ELG with Embedded GNSS Receiver Enables High-Performance IoT Applications in Latin America
New all-in-one cellular LTE and GNSS module provides superior throughput, latency, mobility and voice support. Product covers all LATAM 4G and 2G Bands plus mainstream bands used in Europe and Asia, making it an ideal module for intercontinental deployments.
06
'21
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CEA Leti News
CEA-Leti Research Team Proposes New Approach for Next-Generation Memories with RRAM Energy-Storage Breakthrough
In a breakthrough that is expected to significantly advance in-memory energy-storage in resistive-RAM (RRAM) devices, CEA-Leti has proposed a “newfangled approach” that allows these devices to operate as energy-storage elements as well as memory, depending on the applied bias.
06
'21
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Melexis News
Pre-drivers MLX81340 and MLX81344 enable 500W LIN-based mechatronic module miniaturization
Melexis revealed new LIN BLDC-motor pre-drivers that combine small size with high performance and power capability for automotive mechatronic applications. The MLX81340 (32KB Flash) and MLX81344 (64KB Flash) integrate three channels of high-side and low-side drivers. They control external NFETs with up to 60nC capacitance to handle applications up to 500W.
06
'21
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Beckhoff News
Real-time-capable data communication via OPC UA from Beckhoff
Direct integration of OPC UA Pub/Sub communication into the TwinCAT 3 runtime paves the way for straightforward realisation of machine-to-machine (M2M) and device-to-cloud (D2C) scenarios based on the OPC UA Pub/Sub specification.
06
'21
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Rutronik News
Faster time to market with the new Development Kit "RDK2" from Rutronik
The new "RDK2" development kit from Rutronik is a complete solution for firmware and hardware developers. Based on the "RDK2", proof of concepts can be created quickly and the time-to-market of products is accelerated. The modular toolkit uses the PSoC62 microcontroller from Infineon Cypress and provides an excellent solution for applications in the Internet of Things, Industrial IoT (IoT, IIoT), Smart Wearables, and Smart Home.
06
'21
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Phoenix Contact News
