07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

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Southco

Southco’s Locking Solutions Drive Success for PAZTIR^®

Established in 2017 in the Netherlands, PAZTIR^® is a specialist in access management, track and trace and smart locking systems for urban delivery optimisation

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07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

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TE Connectivity News

TE Connectivity expands robust connector portfolio to meet reliability needs of complex vehicles

DT-XT sealed connector system features innovative, high-performance seal technology for commercial vehicle applications operating in harsh environments.

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07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-07T00:00:00+00:00" | date "longDate" }}

Intel News

Reinventing Chip Design from the Outside In

In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-07T00:00:00+00:00" | date "longDate" }}

Prysmian Group News

Prysmian Group protecting fibre networks and transmitted signals from hackers

Latest Industry Insight highlights the need for operators to leverage bend resistant solutions in order to fully secure network end-to-end.

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-07T00:00:00+00:00" | date "longDate" }}

TTI News

TTI receives European Distribution Award from Abracon

TTI, Inc., a specialist distributor of electronic components, has been presented with another major accolade.

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

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Sivers Semiconductors News

Sivers Semiconductors signs new reseller agreement for millimeter wave business in Japan

Sivers Semiconductors AB today announced that its subsidiary, Sivers Wireless, has signed a reseller agreement with Japanese electronics specialist Shoshin.

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07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

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Fraunhofer News

Terahertz technologies for visionary innovations in communications and sensor technology

n the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time.

Read more…

07 {{ "2021-06-07T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-07T00:00:00+00:00" | date "longDate" }}

ONSEMI News

ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021

Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.

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05 {{ "2021-06-05T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-06-05T00:00:00+00:00" | date "longDate" }}

Toshiba News

LATEST 1-FORM-B PHOTORELAY FROM TOSHIBA OFFERS 1.2A ON-STATE CURRENT RATING

Toshiba Electronics Europe GmbH (“Toshiba”) has further strengthened its extensive optoelectronics portfolio with the introduction of a new photorelay.

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04 {{ "2021-06-04T00:00:00+00:00" | date "MMM" }} '21

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NXP News

NXP's Trimension Ultra-Wideband Technology Helps Samsung Users Easily Find Their Misplaced Belongings

NXP's UWB and Bluetooth^® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.

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Case studies

Delta Powers Europe’s Largest Solar Park with 3,500 High-Efficiency Inverters

Southco’s Locking Solutions Drive Success for PAZTIR^®

Established in 2017 in the Netherlands, PAZTIR^® is a specialist in access management, track and trace and smart locking systems for urban delivery optimisation

TE Connectivity expands robust connector portfolio to meet reliability needs of complex vehicles

DT-XT sealed connector system features innovative, high-performance seal technology for commercial vehicle applications operating in harsh environments.

Reinventing Chip Design from the Outside In

In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’

Prysmian Group protecting fibre networks and transmitted signals from hackers

Latest Industry Insight highlights the need for operators to leverage bend resistant solutions in order to fully secure network end-to-end.

TTI receives European Distribution Award from Abracon

TTI, Inc., a specialist distributor of electronic components, has been presented with another major accolade.

Sivers Semiconductors signs new reseller agreement for millimeter wave business in Japan

Sivers Semiconductors AB today announced that its subsidiary, Sivers Wireless, has signed a reseller agreement with Japanese electronics specialist Shoshin.

Terahertz technologies for visionary innovations in communications and sensor technology

n the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time.

ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021

Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.

LATEST 1-FORM-B PHOTORELAY FROM TOSHIBA OFFERS 1.2A ON-STATE CURRENT RATING

Toshiba Electronics Europe GmbH (“Toshiba”) has further strengthened its extensive optoelectronics portfolio with the introduction of a new photorelay.

NXP's Trimension Ultra-Wideband Technology Helps Samsung Users Easily Find Their Misplaced Belongings

NXP's UWB and Bluetooth^® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.

International

Case studies

Established in 2017 in the Netherlands, PAZTIR® is a specialist in access management, track and trace and smart locking systems for urban delivery optimisation

DT-XT sealed connector system features innovative, high-performance seal technology for commercial vehicle applications operating in harsh environments.

In the first ‘Behind the Builders,’ Intel Fellow Johanna Swan explains how chip packaging went from a basic utility to ‘a real inflection point, maximizing performance per volume.’

Latest Industry Insight highlights the need for operators to leverage bend resistant solutions in order to fully secure network end-to-end.

TTI, Inc., a specialist distributor of electronic components, has been presented with another major accolade.

Sivers Semiconductors AB today announced that its subsidiary, Sivers Wireless, has signed a reseller agreement with Japanese electronics specialist Shoshin.

n the recently launched joint project "T-KOS" of the Research Fab Microelectronics Germany (FMD), terahertz technology is now to be developed synergistically for industry in the fields of communication and sensor technology for the first time.

Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.

Toshiba Electronics Europe GmbH (“Toshiba”) has further strengthened its extensive optoelectronics portfolio with the introduction of a new photorelay.

NXP's UWB and Bluetooth® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.

International

Established in 2017 in the Netherlands, PAZTIR^® is a specialist in access management, track and trace and smart locking systems for urban delivery optimisation

NXP's UWB and Bluetooth^® technologies work together to provide greater location accuracy for Samsung Galaxy SmartTag+.