STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Metalenz Inc., the pioneer in meta-surface design and commercialization, today announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications.
Telit, a global enabler of the Internet of Things (IoT), today announced an expansion of its partnership with Hi-Mix Eletrônicos S/A, an Electronic Manufacturing Service (EMS) provider in Brazil, to include production of LTE modules.
NXP Semiconductors N.V. (NASDAQ: NXPI), a world leader in automotive processing, and TSMC (TWSE: 2330, NYSE: TSM) today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16 nanometer (nm) FinFET process technology.
When you think of asset management, what image first comes to mind? A pallet? A box? In reality, IoT asset management technologies are used for so much more than tracking goods through manufacturing and supply chain.
Latest version of the professional development toolchain IAR Embedded Workbench for Arm supports the versatile Raspberry Pi Pico development board based on a dual-core Arm Cortex-M0+ processor with a wide range of I/O options enabling endless possible applications.
CML Microcircuits is pleased to confirm it will be attending the Live IEEE International Microwave Symposium (IMS) in Atlanta, Georgia, between 7th and 10th June (Booth 1341. Throughout the event, visitors can learn more about the first products in CML’s new SµRF family (Semiconductor Microwave RF). IMS delegates visiting in person can also get up close with the SµRF evaluation modules.