04 {{ "2022-03-04T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-04T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core. Expands the RZ Family Portfolio by Adding to Existing Arm CPU Core–Based MPUs.

Read more…

04 {{ "2022-03-04T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-04T00:00:00+00:00" | date "longDate" }}

ST News

Automotive Door-Zone and Rear-Window Controller from STMicroelectronics Adds Power-Trunk/Tailgate Capability

STMicroelectronics is increasing the integration of automotive body electronics with the L99DZ200G door-zone system IC, which enables a single-chip front-drives-rear setup managing a front-door window, mirror, and lighting as well as the rear-window lift.

Read more…

04 {{ "2022-03-04T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-04T00:00:00+00:00" | date "longDate" }}

NXP News

NXP Powers Compal’s New Integrated Small Cell Solution to Address 5G Network Densification

NXP^® Semiconductors (NASDAQ: NXPI) today announced that NXP’s Layerscape^® and Layerscape Access family of processors have been chosen by Compal Electronics, one of the world's largest ODMs, to power its new 5G Integrated Small Cell (ISC) solution.

Read more…

04 {{ "2022-03-04T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-04T00:00:00+00:00" | date "longDate" }}

Adlinktech News

ADLINK and AUO Announce ‘Visualisation at the Edge’ EMEA Tech Forum

Two-day virtual event will explore the integration of edge computing and AI, industry trends and display technologies.

Read more…

04 {{ "2022-03-04T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-04T00:00:00+00:00" | date "longDate" }}

TDK News

4:1 input range 1.5 to 3W DC-DC converters operate at 100% load in +85°C ambient temperatures without airflow

TDK Corporation (TSE 6762) announces the introduction of 1.5 and 3W models to the TDK-Lambda CCG series of DC-DC converters which are capable of providing full load in ambient temperatures from -40 to +85°C with convection cooling.

Read more…

04 {{ "2022-03-04T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-04T00:00:00+00:00" | date "longDate" }}

Nexperia News

Nexperia to showcase power electronics innovations at APEC 2022

Live demos and expo talks on GaN FETs, SiC Diodes and MOSFETs provide focal points for event participation.

Read more…

03 {{ "2022-03-03T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-03T00:00:00+00:00" | date "longDate" }}

CMP Products Ltd

Fit for Offshore Renewables Granted Status Achieved by CMP

Leading manufacturer of cable glands, cleats and accessories, CMP Products, has been granted ‘Fit for Offshore Renewables’ (F4OR) status through ORE Catapult and Nuclear AMRC’s program

Read more…

03 {{ "2022-03-03T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-03T00:00:00+00:00" | date "longDate" }}

ViewSonic

ViewSonic’s myViewBoard EdTech Ecosystem Surpasses 5 million Users

ViewSonic Corp., a leading global provider of visual and education solutions, announced that the myViewBoard ecosystem, which was designed to digitalise the education industry, has just exceeded 5 million users, with the platform being used in more than 5,000 institutions around the world

Read more…

03 {{ "2022-03-03T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-03T00:00:00+00:00" | date "longDate" }}

ANSYS News

SiPearl Selects Ansys’ Power Signoff Solution for European Supercomputer Chip

SiPearl will apply Ansys’ industry-leading multiphysics platform to meet power and reliability goals on Europe’s new state-of-the-art microprocessor.

Read more…

03 {{ "2022-03-03T00:00:00+00:00" | date "MMM" }} '22

Written on {{ "2022-03-03T00:00:00+00:00" | date "longDate" }}

Sivers Semiconductors News

Sivers Semiconductors Announces Multiple New Products for Licensed 5G Bands at Mobile World Congress 2022

Sivers Semiconductors today announces the launch of multiple new products from the recently completed MixComm acquisition including 2nd generation beamformers, frequency converters, high-end fixed wireless access module.

Read more…

Technical Articles

Redefining Electrical Protection for Data Centers and Critical Infrastructure

Case studies

Surface-mount production lines for automotive electronics manufacturing

White Paper

How to Choose the Right Onboard Charger for Your Battery Pack: 5 Critical Design Considerations

Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core. Expands the RZ Family Portfolio by Adding to Existing Arm CPU Core–Based MPUs.

Automotive Door-Zone and Rear-Window Controller from STMicroelectronics Adds Power-Trunk/Tailgate Capability

STMicroelectronics is increasing the integration of automotive body electronics with the L99DZ200G door-zone system IC, which enables a single-chip front-drives-rear setup managing a front-door window, mirror, and lighting as well as the rear-window lift.

NXP Powers Compal’s New Integrated Small Cell Solution to Address 5G Network Densification

NXP^® Semiconductors (NASDAQ: NXPI) today announced that NXP’s Layerscape^® and Layerscape Access family of processors have been chosen by Compal Electronics, one of the world's largest ODMs, to power its new 5G Integrated Small Cell (ISC) solution.

ADLINK and AUO Announce ‘Visualisation at the Edge’ EMEA Tech Forum

Two-day virtual event will explore the integration of edge computing and AI, industry trends and display technologies.

4:1 input range 1.5 to 3W DC-DC converters operate at 100% load in +85°C ambient temperatures without airflow

TDK Corporation (TSE 6762) announces the introduction of 1.5 and 3W models to the TDK-Lambda CCG series of DC-DC converters which are capable of providing full load in ambient temperatures from -40 to +85°C with convection cooling.

Nexperia to showcase power electronics innovations at APEC 2022

Live demos and expo talks on GaN FETs, SiC Diodes and MOSFETs provide focal points for event participation.

Fit for Offshore Renewables Granted Status Achieved by CMP

Leading manufacturer of cable glands, cleats and accessories, CMP Products, has been granted ‘Fit for Offshore Renewables’ (F4OR) status through ORE Catapult and Nuclear AMRC’s program

ViewSonic’s myViewBoard EdTech Ecosystem Surpasses 5 million Users

ViewSonic Corp., a leading global provider of visual and education solutions, announced that the myViewBoard ecosystem, which was designed to digitalise the education industry, has just exceeded 5 million users, with the platform being used in more than 5,000 institutions around the world

SiPearl Selects Ansys’ Power Signoff Solution for European Supercomputer Chip

SiPearl will apply Ansys’ industry-leading multiphysics platform to meet power and reliability goals on Europe’s new state-of-the-art microprocessor.

Sivers Semiconductors Announces Multiple New Products for Licensed 5G Bands at Mobile World Congress 2022

Sivers Semiconductors today announces the launch of multiple new products from the recently completed MixComm acquisition including 2nd generation beamformers, frequency converters, high-end fixed wireless access module.

International

Technical Articles

Case studies

White Paper

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core. Expands the RZ Family Portfolio by Adding to Existing Arm CPU Core–Based MPUs.

STMicroelectronics is increasing the integration of automotive body electronics with the L99DZ200G door-zone system IC, which enables a single-chip front-drives-rear setup managing a front-door window, mirror, and lighting as well as the rear-window lift.

NXP® Semiconductors (NASDAQ: NXPI) today announced that NXP’s Layerscape® and Layerscape Access family of processors have been chosen by Compal Electronics, one of the world's largest ODMs, to power its new 5G Integrated Small Cell (ISC) solution.

Two-day virtual event will explore the integration of edge computing and AI, industry trends and display technologies.

TDK Corporation (TSE 6762) announces the introduction of 1.5 and 3W models to the TDK-Lambda CCG series of DC-DC converters which are capable of providing full load in ambient temperatures from -40 to +85°C with convection cooling.

Live demos and expo talks on GaN FETs, SiC Diodes and MOSFETs provide focal points for event participation.

Leading manufacturer of cable glands, cleats and accessories, CMP Products, has been granted ‘Fit for Offshore Renewables’ (F4OR) status through ORE Catapult and Nuclear AMRC’s program

ViewSonic Corp., a leading global provider of visual and education solutions, announced that the myViewBoard ecosystem, which was designed to digitalise the education industry, has just exceeded 5 million users, with the platform being used in more than 5,000 institutions around the world

SiPearl will apply Ansys’ industry-leading multiphysics platform to meet power and reliability goals on Europe’s new state-of-the-art microprocessor.

Sivers Semiconductors today announces the launch of multiple new products from the recently completed MixComm acquisition including 2nd generation beamformers, frequency converters, high-end fixed wireless access module.

International

NXP^® Semiconductors (NASDAQ: NXPI) today announced that NXP’s Layerscape^® and Layerscape Access family of processors have been chosen by Compal Electronics, one of the world's largest ODMs, to power its new 5G Integrated Small Cell (ISC) solution.