Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned.
Building on a longstanding relationship, Ansys (NASDAQ: ANSS) today announced a multiyear agreement with Seagate Technology to expand Seagate’s use of Ansys’ simulation solutions worldwide.
Future-oriented key technologies in microelectronics and microsystems technology (MST) will be presented at the MST Congress in Ludwigsburg from November 8 to 10, 2021. The Fraunhofer Institute for Photonic Microsystems IPMS will participate at the joint booth of the Research Fab Microelectronics Germany (FMD). In numerous lectures and poster sessions, the institute will present current results and developments from the fields of intelligent MEMS-based sensor and actuator technology for applications in medical technology, chemical analytics and Industry 4.0.
Programmable, flexible safety is a key component of intelligent machine design. With S-DIAS Safety from SIGMATEK, the user has a slim economic solution that meets the highest safety standards (SIL 3, PL e).
SensiML Corporation, a leading developer of AI tools for building intelligent Internet of Things (IoT) endpoints, today announced that it has teamed with onsemi to deliver a complete machine learning solution for autonomous sensor data processing and predictive modeling.
Support for the latest Arm Cortex-M55 processor in IAR Embedded Workbench provides strong tools support for the new family and ensures future innovation in embedded applications.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has joined the FiRa Consortium as a Contributor member to support the expansion of the UWB ecosystem. FiRa is dedicated to developing and widely disseminating ultra-wideband (UWB) technology for secured fine ranging and positioning capabilities in a wide range of applications.