07
'21
Written on
Maxim integrated News
07
'21
Written on
Impulse Embedded News
Impulse Embedded Announces New IIoT Gateway for Hazardous Environments from Axiomtek
ATEX/Class 1 Div. 2 certified rugged fanless gateway system suits Oil and Gas Systems.
07
'21
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Digi-key News
Digi-Key Electronics Enhances Online Returns and Order Issues Portal with Expanded Self-Service Options
Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has launched an enhanced online returns and order issues portal for customers.
07
'21
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inova Semiconductors News
ISELED Alliance welcomes two new members
The broad alliance for ISELED technology continues to grow: Joysonquin and Keboda Technology generate new ideas in decorative trims and LED lighting electronics
06
'21
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HARTING Europe
The highest level of physical protection for POS terminals – with the help of 3D-MID
Point-of-sale terminals (POS) are not sufficiently protected against physical attacks. Attackers can access sensitive data (such as credit card number and PIN codes) using probes or mini-drills. An additional security element in the security caps of the terminals can reliably prevent such attacks.
06
'21
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AT&S News
1 MM² IN SIZE AND 1 GRAM IN WEIGHT
AT&S technology enables the world's smallest digicam.
06
'21
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MTM POWER News
DECENTRALISED POWER SUPPLY PERFECTLY SUITABLE FOR "ON MACHINE" APPLICATIONS
With vacuum encapsulated technology, MTM Power's focus is on encapsulated, robust, long-living, temperature-resistant and absolutely maintenance-free modules.
06
'21
Written on
Anritsu News
Anritsu and Samsung Extend Collaboration to Deliver Latest 5G Release 16 Technology
Anritsu Corporation is pleased to announce that it has successfully verified a number of key 3GPP Release 16 features using its Radio Communication Test Station MT8000A in combination with Samsung Electronics’ System LSI Business latest 5G Exynos Modem.
06
'21
Written on
Intel News
The Revolutions that Led to Chips Made Like Quilts
‘Behind the Builders:’ Intel Fellow Ravi Mahajan found packaging technologies were improving on a disturbingly straight line, inspiring an approach that was simple in concept but hard to pull off.
06
'21
Written on
Nexperia News
