11
'21
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FLUKE News
11
'21
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Vision Components News
embedded world: Vision Components presents smallest embedded vision system
Probably the world's smallest embedded vision system – fully integrated in one board and hardly bigger than an image sensor module: VC picoSmart from Vision Components will premiere at embedded world 2021 DIGITAL (March 1–5).
11
'21
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ST News
Complete Energy-Meter Evaluation Board from STMicroelectronics Combines Low-Cost Sensors and Robust Galvanic Isolation
Accelerates time to market leveraging ST’s long expertise in utility and industrial metering applications.
11
'21
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Mouser News
NOW AT MOUSER: LAIRD CONNECTIVITY STERLING-LWB5+ WI-FI & BLUETOOTH MODULES FOR NEXT-GENERATION IOT APPLICATIONS
Mouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, is now stocking the new Sterling-LWB5+ modules from Laird Connectivity. The modules deliver Wi-Fi 5 (802.11ac) and Bluetooth® 5.1 communications to next-generation Internet of Things (IoT) devices such as battery-powered medical devices, industrial IoT sensors, rugged handheld devices, and other connectivity solutions.
10
'21
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CEA Leti News
CEA-Leti Team Paves the Way for Massive Integration of Qubits, Critical for Achieving Quantum Supremacy
CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.
10
'21
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Röhm News
NEW 5TH GEN P-CHANNEL MOSFETS DELIVER CLASS-LEADING LOW ON RESISTANCE
Broad 24-model lineup with withstand voltages of -40V/-60V ideal for large consumer and industrial equipment.
10
'21
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Renesas News
RENESAS UPDATES POPULAR R-CAR V3H WITH IMPROVED DEEP LEARNING PERFORMANCE FOR LATEST NCAP REQUIREMENTS INCLUDING DRIVER AND OCCUPANT MONITORING SYSTEMS
Today, Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced an update of its state-of the-art R-Car V3H system-on-chip (SoC) to deliver significantly improved deep learning performance for smart camera applications, including driver and occupant monitoring systems (DMS / OMS), automotive front cameras, surround view, and auto parking for high-volume vehicles up to Level 2+. The updated SoC combines sensor fusion on the real-time domain with up to ASIL C metrics and an architecture optimized for smart computer vision. It offers OEMs and Tier 1s a high-performance, low-power solution that supports the latest NCAP 2020 requirements as well as the roadmap to NCAP 2025 3 Stars at competitive system costs.
09
'21
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Toshiba News
TOSHIBA INTRODUCES HIGH-CURRENT PHOTORELAY OPTIMISED FOR INDUSTRIAL IMPLEMENTATION
100V rated device in compact DIP4 package covers wide control range.
09
'21
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CEA Leti News
CEA-Leti Announces EU Project to Create Dynamically Programmable Wireless 6G Environments
RISE-6G Collaboration Will Develop Technology for Reconfigurable Intelligent Surfaces and Ensure Energy Efficiency, Localization Accuracy and Privacy.
09
'21
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Anritsu News
