NEC Corporation (NEC; TSE: 6701) announced today that it has joined the Telecom Infra Project’s (TIP) Phoenix initiative. Phoenix is managed by TIP's Open Optical and Packet Transport (OOPT) Project Group and seeks to develop a 400G transponder for open and disaggregated high-capacity DWDM networks.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a world-first automotive satellite-navigation chip that delivers high-quality position data needed by advanced driving systems.
Compliance Suite for STM32 includes security development tools and practical guidance, delivering a shrink-wrapped solution for organizations to ensure security assurance in their IoT applications.
The Challenge: Harsh environment applications require rugged and reliable components able to withstand adverse conditions that standard commercial connectors and cable assemblies typically cannot endure. Connector contaminants are the leading cause of power loss and signal degradation, often requiring the continuous need for cleaning.
Ansys’ collaboration with Samsung Foundry delivers industry-leading power integrity and electromigration signoff solutions for low-power mobile and high-performance computing applications.
Due to the current occurrence of infections in Germany and Bavaria, the German connectivity specialist ESCHA had to cancel their attendance in this year’s «SPS smart production solutions» trade-show, taking place in Nuremberg from 23 to 25 November 2021.
"We made this decision with a heavy heart. Physical participation in the SPS is not justifiable in view of the dramatic rise in the number of Corona infections, particularly in Bavaria and neighbouring states (Länder)," as Philip Harting, CEO of the HARTING Technology Group, explained today. "The welfare of our employees and the welfare of our customers is the most important factor."
Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), announced today it has forged a strategic technology partnership with leading AI (Artificial Intelligence) chipmaker Hailo to offer next generation AI edge inference solutions. The advanced Hailo-8 AI processor, performing at 26 tera-operations per second (TOPS) at a typical power consumption of less than 2.5 watts, enables edge devices to run at performance levels previously only possible in the cloud. The strategic collaboration offers customers a new level of high-performance, scalable AI-edge application-ready platforms for a wide range of market segments such as Industry 4.0, smart cities, smart retail and more.
Almost 150 languages are derived from Latin. But despite similarities in form, differences in letter combination mean this isn't sufficient to enable interlanguage comprehension. The same goes for processing plants; converting signals generated in the plant into an understandable form for control systems is a challenge. The answer? Signal conditioning.