14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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MIkroe News

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

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CUI devices News

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

LEMO

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Congatec News

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Cadence News

Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

Read more…

14 {{ "2021-07-14T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-14T00:00:00+00:00" | date "longDate" }}

Conrad News

New contact-free clamp meters from Fluke

Fluke 377 FC, 378 FC Non-Contact Voltage True-rms AC/DC Clamp Meters with iFlex.

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

TDK News

Aluminum electrolytic capacitors: TDK offers a new screw terminal series with high current capability and long service life

TDK Corporation (TSE:6762) presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals.

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

Erni News

SMC SECURE LOCK CONNECTORS

The SMC family with a 1.27 mm pitch is also recommended for demanding, often spatially confined applications in the automotive sector. And the development continues – as the SMC Secure Lock shows.

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

Renesas News

New Renesas Solution For Automotive Cameras Enables High-Definition Video Using Low-Cost Cables and Connectors

Automotive HD Link (AHL) Complements Other Renesas Products in Auto Safety Systems; Includes Unique Control Channel That Initializes, Programs and Monitors the Camera Function.

Read more…

13 {{ "2021-07-13T00:00:00+00:00" | date "MMM" }} '21

Written on {{ "2021-07-13T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment

SK hynix Inc. (or “the Company”, www.skhynix.com) announced that it has started this month mass production of the 8 Gigabit (Gb) *LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.

Read more…

Market Overview

Everything You Need to Know About FPGAs

Technical Articles

Basler Enhances Probe Card Inspection with Advanced Vision & Autofocus Solutions

MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

60 W Power-Only USB Type C Receptacle Features Vertical Orientation

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

Standard self-latching multipole connectors with alignment key

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

NEW ULTRA-RUGGED 11TH GEN INTEL^® CORE^® CONGATEC MODULES WITH SOLDERED RAM

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification for Advanced Consumer, 5G and Automotive Designs

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

New contact-free clamp meters from Fluke

Fluke 377 FC, 378 FC Non-Contact Voltage True-rms AC/DC Clamp Meters with iFlex.

Aluminum electrolytic capacitors: TDK offers a new screw terminal series with high current capability and long service life

TDK Corporation (TSE:6762) presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals.

SMC SECURE LOCK CONNECTORS

The SMC family with a 1.27 mm pitch is also recommended for demanding, often spatially confined applications in the automotive sector. And the development continues – as the SMC Secure Lock shows.

New Renesas Solution For Automotive Cameras Enables High-Definition Video Using Low-Cost Cables and Connectors

Automotive HD Link (AHL) Complements Other Renesas Products in Auto Safety Systems; Includes Unique Control Channel That Initializes, Programs and Monitors the Camera Function.

SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment

SK hynix Inc. (or “the Company”, www.skhynix.com) announced that it has started this month mass production of the 8 Gigabit (Gb) *LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.

International

Market Overview

Technical Articles

FUSION for PIC v8 includes Wi-Fi debugging, Click peripheral sockets, SiBRAIN MCU sockets plus display options.

CUI Devices’ Interconnect Group announced the continued expansion of their power-only USB Type C receptacle line with the introduction of a vertically-oriented model.

The LEMO B Series offers a modular, ergonomic, rugged and reliable circular multipole connector for applications needing quick and secure Push-Pull latching. Making it an ideal choice for test and measurement, instrumentation, medical devices, research and audio/video applications.

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.

Collaboration enables mutual customers to easily adopt the integrated Cadence digital full flow, which offers leading implementation and signoff technology for ultra-low power designs.

Fluke 377 FC, 378 FC Non-Contact Voltage True-rms AC/DC Clamp Meters with iFlex.

TDK Corporation (TSE:6762) presents the EPCOS aluminum electrolytic capacitors B43706* and B43726* series with screw terminals.

The SMC family with a 1.27 mm pitch is also recommended for demanding, often spatially confined applications in the automotive sector. And the development continues – as the SMC Secure Lock shows.

Automotive HD Link (AHL) Complements Other Renesas Products in Auto Safety Systems; Includes Unique Control Channel That Initializes, Programs and Monitors the Camera Function.

SK hynix Inc. (or “the Company”, www.skhynix.com) announced that it has started this month mass production of the 8 Gigabit (Gb) *LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology.

International

Congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel^® Core^® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance.