CEA-Leti scientists have opened a pathway to large-scale integration of Si-spin qubits using existing flip-chip processes with die-to-wafer 3D-interconnect technologies developed in-house.
Today, Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced an update of its state-of the-art R-Car V3H system-on-chip (SoC) to deliver significantly improved deep learning performance for smart camera applications, including driver and occupant monitoring systems (DMS / OMS), automotive front cameras, surround view, and auto parking for high-volume vehicles up to Level 2+. The updated SoC combines sensor fusion on the real-time domain with up to ASIL C metrics and an architecture optimized for smart computer vision. It offers OEMs and Tier 1s a high-performance, low-power solution that supports the latest NCAP 2020 requirements as well as the roadmap to NCAP 2025 3 Stars at competitive system costs.
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, has created a new resource site dedicated to RISC-V, an open-source instruction set architecture (ISA).
Zero-backlash jaw couplings from Ruland have high dampening capabilities, can accommodate all forms of misalignment, and are highly customizable. They are well-suited for servo motors that are often used in precise positioning applications found in semiconductor, solar, medical and robotics.