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Melexis News
24
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TEKTRONIX News
Tektronix’ Virtual Technology & Optical Innovation Week 28th September – 2nd October 2020
Showcasing New Innovations in Optical Measurements, VIP events & meetings, virtual webinars by keynote speakers & application specialists.
24
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Infineon News
Project Scale4Edge launched as part of flagship initiative “Trustworthy Electronics” of the German Ministry of Education and Research
The goal is to create a scalable ecosystem for special processors for the Internet of Things.
24
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TDK News
TDK-Lambda announces £11.5m investment to redevelop its manufacturing facility in Ilfracombe, UK
TDK Corporation (TSE 6762) announces an £11.5m investment package to redevelop its TDK-Lambda manufacturing facility in Ilfracombe, UK. The investment, which will be staged over the next three and a half years, will enable the company to increase production capacity by 50%.
24
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XILINX News
Xilinx and Continental Collaborate to Create Auto Industry’s First Production-Ready 4D Imaging Radar for Autonomous Driving
Xilinx, Inc. and Continental announced that Xilinx will power Continental’s new Advanced Radar Sensor (ARS) 540 with the Zynq® UltraScale+ MPSoC platform, creating the automotive industry’s first production-ready 4D imaging radar. The collaboration enables newly-produced vehicles equipped with the ARS540 to realize SAE J3016 Level 2 functionalities and will pave the way toward Level 5 autonomous driving systems.
23
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Vaisala News
Vaisala introduces a groundbreaking method for detecting power transformer air leaks
The new method, based on measuring total pressure of all dissolved gases in the power transformer insulation oil, will help customers detect and repair any air leaks early. This can extend the lifetime of a transformer and lead to significant cost savings.
23
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SICK News
SICK and Microsoft have a vision of the future - Both technology companies combine their strengths in 3DToF technology
SICK AG (SICK) is working with Microsoft Corp. (Microsoft) to enable the development of commercial industrial 3D cameras and related solutions, which will be compatible with a Microsoft ecosystem built on top of Microsoft depth, Intelligent Cloud, and Intelligent Edge platforms. Selected customers are already testing SICK cameras that incorporate Microsoft ToF depth technology.
23
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Molex News
BittWare Boosts Wireless Application Performance with RFSoC-based Acquisition Card
BittWare, a Molex company, the leading supplier of enterprise-class products featuring FPGA technology, today announces the RFX-8440 data acquisition card featuring the Zynq UltraScale+ RFSoC (Radio Frequency System-on-Chip), from Xilinx, Inc.
23
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LEMO
A new LEMO production site is inaugurated!
The new REDEL 2 production site, at 400m from the main site (St-Croix, Switzerland), was officially inaugurated on 3rd September 2020.
23
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Mouser News
