Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched "TLP241B," a high-current photorelay in a DIP4 package for industrial equipment such as programmable logic controllers and I/O interfaces. Samples and production quantities are available now.
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a 650 V CoolSiC Hybrid IGBT portfolio in a discrete package with 650 V blocking voltage.
Embedded systems specialist Recab UK is now supporting engineers to develop more sophisticated embedded computing projects with the availability of Diamond Systems’ Floyd GPGPU products.
ams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, is proud to announce that it has been named winner of the IoT Breakthrough Award in the category of IoT Wearables Innovation of the Year for the AS7038RB, an ultra-thin sensor offering blood oxygen monitoring capability for earbuds, patches, and other wearable devices.
NXP Semiconductors N.V. (NASDAQ: NXPI), a global provider of secure Internet-of-Things (IoT) embedded solutions serving customers across a broad spectrum of applications and markets, today introduced its new EdgeLock 2GO IoT service platform for easy, secure deployment and management of IoT devices and services.
Innodisk recently announced its industrial-grade DRAM modules for FPGA (field-programmable gate array) applications that open the door to new opportunities for system integrators and network operators.