29
'21
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Sigmatek News
28
'21
Written on
Huber+Suhner News
HUBER+SUHNER LAUNCHES SYLFA HD, A NEXT-GENERATION FRONT ACCESS FIBER MANAGEMENT SYSTEM
HUBER+SUHNER has launched SYLFA HD, a new front access solution to its comprehensive portfolio of scalable fiber management systems.
28
'21
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Infineon News
EasyPACK CoolSiC MOSFET module supports fast-switching DC-link voltage of 1500 V for solar systems and ESS applications
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched a new EasyPACK 2B module in the company’s 1200 V family.
28
'21
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Kontron News
D3713-V/R mITX Motherboard - Product of the Year 2021
D3713-V/R mITX Motherboard selected from the German magazine Computer&Automation for product of the year.
28
'21
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CEVA News
CEVA Lauded by Frost & Sullivan for Addressing the Challenges of Connected Devices with Its Smart Sensing MotionEngine Software
CEVA’s versatile and highly precise sensor fusion solution ensures an optimum customer experience in diverse consumer electronics and industrial markets.
28
'21
Written on
MURATA News
Ultra-compact and highly responsive PTC thermistor solution for space-limited designs
Murata has expanded its portfolio of positive temperature coefficient (PTC) surface-mount chip thermistors for overheat sensing by introducing the PRF03BB541NB7RL.
28
'21
Written on
Digi-key News
Digi-Key Electronics Announces New Global Distribution Partnership with ArkX Laboratories
Digi-Key Electronics, which offers the world's largest selection of electronic components in stock for immediate shipment, announced that it has secured a global distribution partnership with ArkX Laboratories to offer their Advanced Far-field Voice Capture AFE module and development kit for voice-enabled IoT products.
28
'21
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CUI devices News
CUI Devices Adds Slide Switches Product Line to Switches Portfolio
CUI Devices’ Switches Group today announced the addition of slide switches to its product portfolio.
28
'21
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SILINA
SILINA curve CMOS Imaging Sensors at industrial scale
SILINA, a deeptech startup in microelectronics, brings a real paradigm shift to the imaging industry by curving the imaging sensors. Curved sensor technology is being developed for many years but was limited to single-chip manufacturing processes, until now. SILINA has been developing a unique technology which enables to curve hundreds of imaging sensors at the same time, offering new perspectives in the design of cameras, from high volume to niche markets.
27
'21
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ESCHA News
