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Cadence News

Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards

Cadence achieves recognition for joint development of N3 design infrastructure, 3D-IC design productivity solution, timing signoff in the cloud design solution and DSP IP.

Telit News

Telit Arduino Turnkey IoT Innovation Kit Enables Fast, Inexpensive LTE IoT Application Development

Featuring the Telit ME310 module, the new Charlie kit includes full coverage of NB-IoT and Cat M1 LTE bands, GNSS antenna with LNA and a Bosch accelerometer. The Arduino IDE-compatible microprocessor enables easy programmability, and the compact MKR form factor supports a wide variety of Arduino shields.

ST News

STMicroelectronics Works with Alifax on Rapid, Cost-Efficient Point-of-Care Medical Testing

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Alifax S.r.l, a producer of clinical diagnostic instrumentation, have worked together on a rapid, cost-efficient portable solution that will be available from Alifax, for point-of-care molecular diagnostic detection using highly reliable real-time Polymerase Chain Reactions (PCR) to amplify genetic material (RNA and DNA1) in patient samples.

Toshiba News

COMPACT LOW ON-RESISTANCE MOSFET DEVICES FROM TOSHIBA SIGNIFICANTLY ENHANCE BATTERY PACK OPERATION

Toshiba Electronics Europe GmbH (“Toshiba”) has further expanded its comprehensive portfolio of power saving N-channel MOSFETs with the introduction of the SSM6N951L. Leveraging the company’s advanced power semiconductor process expertise and cutting-edge IP, this 12V-rated commondrain device exhibits numerous industry-leading operational performance parameters.

Infineon News

Infineon adds 40 V device in PQFN to its OptiMOS Source-Down power MOSFET family

Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) tackles this challenge by focusing on system innovation with enhancements on the component level.

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