12
'20
Written on
Mouser News
12
'20
Written on
Molex News
Molex Expands Innovative Line of NearStack High-Speed Cable Assembly Solutions to Help Customers Maximize System Performance
New NearStack 100 Ohm and 85 Ohm Solutions Address Growing Need for Increased Signal Demands.
12
'20
Written on
Toshiba News
World's First Development and Demonstration of a Quantum Cryptographic Communication Technology Applied System for Genomic Medicine
Quantum cryptographic communication technology allows for completely secure real-time transmission of genome analysis data and transfer of online expert panel data.
12
'20
Written on
APPLIED MATERIALS INC. News
APPLIED MATERIALS INTRODUCES NEW SYM3® ETCH SYSTEM FOR ADVANCED MEMORY AND LOGIC CHIPS
Applied Materials, Inc. today announced a new addition to its highly successful Centris® Sym3® etch product family that now enables chipmakers to precisely pattern and shape ever-smaller features in leading-edge memory and logic chips.
10
'20
Written on
Leuze
Leuze is focused on “yellow”
In the field of automation technology, the colour yellow stands for safety at work. The safety expert Leuze, as a developer and provider of safety sensors, safety solutions and safety services for the entire life cycle of a machine, is now further increasing focus of the company’s safety competence in its business activities with a dedicated division. Leuze emphasizes this with the motto, “Safety at Leuze”.
10
'20
Written on
Keysight technologies News
Keysight Works with Qualcomm to Enable the Global Certification Forum to Activate Certification of C-V2X Test Plan
Keysight’s conformance test solution offers unique support for radio frequency and radio resource management performance validation of C-V2X devices.
09
'20
Written on
TDK News
Surge protection: Failsafe chip varistors for automotive battery lines
TDK Corporation presents a new range of Open Mode chip varistors for electronic automotive assemblies that are directly connected to the battery.
07
'20
Written on
VIA Tech News
VIA Accelerates Artificial Intelligence and Machine Learning Education for Schools with VIA Pixetto
VIA Technologies, Inc. today announced the launch of the VIA Pixetto vision sensor, an intuitive and engaging platform for teaching Artificial Intelligence and Machine Learning to students aged twelve and above.
07
'20
Written on
TDK News
TDK announces ultra-high AOP Analog MEMS microphone, ICS-40638
TDK Corporation introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port surface‐mount package.
07
'20
Written on
MURATA News
