STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is offering a solution to accelerate the market introduction of new Bluetooth® LE and 802.15.4 based IoT devices with a miniature, ready-to-use STM32 wireless microcontroller (MCU) module.
The longer the coronavirus pandemic lasts, the more important it is to stay safe and healthy in everyday life. Hygiene measures, such as wearing a facemask or socially distancing, help safeguard against the spread of germs. But light in the right wavelength also makes an enormous contribution to fighting viruses.
TDK Corporation (TSE: 6762) announces the release of Tronics AXO®315, a miniature high performance 1-axis closed-loop MEMS accelerometer with a 24-bit digital SPI interface and SMD package that reaches quartz sensors performances, outperforms commercial MEMS sensors, and eases integration.
In Q1 2021, the revolutionary new Zivid Two 3D camera will be available from STEMMER IMAGING. The Zivid Two is a natural successor to the industry-leading Zivid One+ range of cameras.
Automotive supplier receives award for innovative overall approach consisting of matrix LED headlamps, electronics for light control, sensor technology and software.
Commercial partnership under new DARPA Toolbox initiative provides DARPA researchers with access to CEVA’s portfolio of wireless connectivity and smart sensing IPs.
Optimized for long battery life and reliable connectivity, even when IoT devices are deep inside buildings, such as utility meters and medical wearables. The two Telit modules are the first Qualcomm®9205-based modules to complete Telstra certification, enabling a new generation of ultra-compact LTE-M and NB-IoT devices.