ROHM has developed a new Wi-SUN FAN (Field Area Network) module for infrastructure applications, capable of connecting up to 1,000 nodes in a mesh network.
Flex Power Modules introduces the PKU4913D, the latest variant in its PKU-D series of analog DC/DC converters in the sixteenth brick format. The new converter delivers excellent electrical and thermal performance at an affordable cost.
As 5G devices and networks start to roll-out, we hear a great deal about the potential of 5G technology for exciting new applications. 5G networks have enormous implications for autonomous vehicles, emergency services, and industrial IoT use cases, where localization accuracy and reliability are critical.
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched “MG800FXF2YMS3,” a silicon carbide (SiC) MOSFET module integrating newly developed dual channel SiC MOSFET chips with ratings of 3300V and 800A, for industrial applications. Volume production will start in May 2021.