19
'20
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Stratasys News
18
'20
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Mouser News
Mouser Electronics Now Shipping ams TCS3430 Dev Kit for Tristimulus Color and ALS Sensor
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the TCS3430 evaluation kit from ams.
18
'20
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ST News
STMicroelectronics Teams with Microsoft® to Boost Development of Smart, Connected Devices Leveraging STM32Cube Ecosystem
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has signed an agreement with Microsoft to simplify and accelerate the development of smart-appliance controllers and other Internet-of-Things (IoT) devices.
18
'20
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Recabuk News
Back to basics on computer-on-modules
Infographic highlights key differences and benefits of COMs.
17
'20
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Gefran News
The future of industrial electric heating is already here: Gefran presents the new GPC and GSLM series
In heat treatment applications, the accurate control of electric heating loads enables a precise and efficient temperature control, with a consequent positive impact in terms of energy saving.
17
'20
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Rohm Semiconductors News
New EMARMOUR™ 2 Channel High-Speed Op Amp
ROHM introduces the availability of a “2 channel high-speed ground sense CMOS op amp”, BD77502FVM, optimized for consumer and industrial equipment requiring high-speed sensing – such as industrial measurement and control systems.
17
'20
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AMS News
World-class Augmented Hearing technology from ams enables Nuheara’s latest smart hearing buds to enhance the user’s hearing ability
ams (SIX: AMS), a leading worldwide supplier of high-performance sensor solutions, today disclosed that its Active Noise Cancellation (ANC) chip technology provides the personalized noise attenuation in the new IQbuds2 MAX product from Nuheara, marketed by Nuheara as ‘the world’s most advanced hearing bud.’
17
'20
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CEA Leti News
CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM
CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks.
17
'20
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TDK News
Inductors: TDK releases compact flat wire SMT high-current chokes
TDK Corporation (TSE: 6762) has extended its portfolio of EPCOS ERU SMT power inductors with the ERU16 choke series, comprised of ten different types. The inductance values of the new B82559B*A016 series, which replaces the former B82559A*A016 series, extend from 1.0 µH to 30 µH, and their saturation currents range from 10.3 A DC to 40.4 A DC at 25 °C.
17
'20
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ST News
