10
'19
Written on
Ametek News
06
'19
Written on
ST News
Complete USB Type-C Port-Protection IC from STMicroelectronics Simplifies Connectivity Upgrade for Mass-Market Devices
Designers can easily migrate small electronic devices from legacy USB® Micro-A or Micro-B interconnects to the latest Type-C style with the STMicroelectronics TCPP01-M12 port protector, which satisfies all protection requirements for USB-C™ connections.
06
'19
Written on
Ametek News
Creaform Launches HandySCAN AEROPACK for the Aerospace Industry
Creaform, a worldwide leader in portable and automated 3D measurement solutions, announced today the release of HandySCAN AEROPACK, a 3D scanning solution suite that addresses the specific challenges of aircraft quality control, such as assessing damage from hailstorms or aircraft incidents as well as flap and spoiler inspections.
05
'19
Written on
Vishay News
Vishay Intertechnology 2 A to 12 A Synchronous Buck Regulators in Compact 5x5 PowerPAK® Package Offer Peak Efficiencies of 98 %
Providing Wide Input Voltage Ranges From 4.5 V to 60 V, Versatile Devices Feature Internal Compensation to Reduce External Components.
04
'19
Written on
Leuze
Leuze electronic gave trade show visitors opportunity to experience sensor systems up close
From November 26 to 28 at smart production solutions (SPS), Leuze electronic demonstrated its technological competence in the areas of safety at work, smart factory and intralogistics and let trade show visitors experience sensor systems up close using live demos.
04
'19
Written on
Vision Components News
iREX2019 robotics show: MIPI camera modules & embedded vision
Camera boards and embedded vision systems for robotic vision applications.
04
'19
Written on
Toshiba News
Toshiba Releases its First eFuse, an Electronic Fuse that can be Repeatedly Used
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six products that support various functions needed for circuit protection in power supply lines. Shipments of two products in the lineup start today.
04
'19
Written on
ST News
STMicroelectronics Adds Support for LoRaWAN® Firmware Update Over The Air in the STM32Cube Ecosystem
STMicroelectronics has enhanced its STM32* LoRaWAN® software expansion package for developers (I-CUBE-LRWAN ) to support the latest Firmware Update Over The Air (FUOTA) specifications.
04
'19
Written on
PEPPERL+FUCHS FACTORY AUTOMATION
IO-Link master with OPC UA
Seamless Communication from the Field Level to the Cloud
03
'19
Written on
Vega News
