05
'20
Written on
Röhm News
04
'20
Written on
Leuze
New type of contour measurement
With the new CMS 700i 3D contour measurement system, Leuze electronic is presenting a world’s first for volume measurements: a complete solution for the fault-free storage of goods that can be autonomously commissioned and maintained by the customers via WebConfig.
03
'20
Written on
ONSEMI news
ON Semiconductor Announces Innovative New USB-C PD 3.0 Controllers with Advanced Feature Sets and Enhanced Efficiency
New USB-C Power Delivery (PD) 3.0 Devices provide market-leading solutions for power adapter and battery charger applications.
03
'20
Written on
Elesa + Ganter News
Indexing plungers with position signal
Indexing plungers very often fulfill safety functions – but this is not the only time when it is important to obtain feedback about their position. With the new series GN 817.6, Elesa+Ganter now also allows automated status checks.
02
'20
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TDK News
New Data Book for aluminum electrolytic capacitors
TDK Corporation presents the fully revised Data Book for aluminum electrolytic capacitors with screw terminal, snap-in, axial and single-ended design.
02
'20
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Toshiba News
Toshiba announces new cutting-edge CMOS silicon on insulator process
New process will enhance the noise figure of RF switches and low noise amplifiers for 5G and Wi-Fi applications.
02
'20
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Stemmer imaging News
Easy 3D Plug & Play with Zivid One+
STEMMER IMAGING has extended its portfolio with the Zivid One+ 3D colour cameras from the Norwegian supplier Zivid since summer 2019. Our product manager Tim Huylebrouck describes his first experience with the 3D cameras.
02
'20
Written on
Hexagon AB News
Hexagon launches new entry-level optical CMM for the Asia-Pacific region
Captura is an easy to use CMM that provides multisensor measurement at an affordable price point.
28
'20
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Kontron News
COM-HPC - Higher performance for Computer-on-Modules
Peter Müller, Vice President Product Center Modules at Kontron, a leading global provider of IoT/Embedded Computing Technology (ECT), comments on the background to the development of the new Computer-On-Module standard COM-HPC:
28
'20
Written on
Congatec News
