STMicroelectronics’ STGAP2HS is a compact, high-voltage gate driver for applications that require up to 6kV galvanic isolation between the gate-driving channel and the low-voltage control and interface circuitry.
Latest versions of the security development tools Embedded Trust and C-Trust includes support for next-generation device technology, assisting companies in protecting their applications throughout the entire product lifecycle.
Vision Components presents various new camera modules that combine high image quality and frame rates with the advantages of the MIPI CSI-2 interface and consist of the sensor board and a fully integrated MIPI adapter board.
MAX17320 2 to 4 series cell Li-ion fuel gauge IC is industry’s first to monitor self-discharge during operation while extending battery life with highest accuracy and lowest quiescent current.
Flex Power Modules announces the formation of a strategic partnership with Shenzhen Eprotek Technology Co., Ltd (trading as Eprotek) to strengthen the supply and sales support of its products in China, particularly with industrial power solutions for test equipment and automation.
ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today launches an automotive-qualified capacitive sensor which en- hances the safety of assisted driving systems in road vehicles.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Quanta Computer, a world-leading notebook computer manufacturer, have agreed on a joint effort to develop a reference design for augmented-reality (AR) smart glasses. Based on ST’s Laser-Beam Scanning technology and Quanta’s AR eyewear design and manufacturing capabilities, the AR-glasses reference design will enable faster development of OEM products.
Fischer Connectors is enhancing the integration capability of its versatile plug & use Fischer Freedom Series. The product line has been extended with new products and accessories allowing design engineers to further optimize cable management in line with their SWaP (size, weight and power) requirements, and integrate low-profile connectors, cable assemblies and active devices easily into all sorts of materials, even the most flexible of fabrics.