28
'20
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Maxim integrated News
28
'20
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ST News
STMicroelectronics Introduces World’s First All-in-One, Multi-Zone, Direct Time-of-Flight Module
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has extended its portfolio of FlightSense Time-of-Flight (ToF) sensors with the world’s first 64-zone device that breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene.
28
'20
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ZF News
ZF expands production of world leading advanced camera technology with new plant in Poland
ZF is expanding its manufacturing footprint for advanced Driver Assist Systems technologies with the launch of its new Electronics Plant in Częstochowa, Poland. The new facility and its 100 employees have initiated serial production of the company’s innovative S-Cam4.8 cameras.
28
'20
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Infineon News
State-of-the-art photography results and immersive AR experiences: Infineon and pmd offer 3D-imager with longest range in the market
Gaming, virtual e-Commerce, 3D online education: Augmented Reality (AR) applications with three-dimensional depth sensors link the real with the digital world and are strongly demanded.
28
'20
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TEKTRONIX News
Tektronix Introduces Second Generation IsoVu Isolated Oscilloscope Probes
New TIVP Series Probes Offer Smaller Size and More Capabilities. Bringing Cutting Edge Isolated Measurements to Entire Power System Design Market.
28
'20
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OSRAM News
Larger selection of light colors for even more applications: PrevaLED BRICK HP LED modules
Whether in street, outdoor or industrial lighting: There is an increasing trend towards using different color temperatures in state-of-the-art lighting applications.
28
'20
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Renesas News
Renesas Shifts Mobility System Development Into High Gear With Its New Online Market Place for R-Car SoC
Offers Developers Quick Access to Evaluation Software and Documentation to Jump Start Evaluation and Speed Time to Market.
28
'20
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Leti-cea News
CEA-Leti Announces Collaboration with Intel to Advance Chip Design Through Cutting-Edge 3D Packaging Technologies
What's new: CEA-Leti today announced a new collaboration with Intel on advanced 3D and packaging technologies for processors to advance chip design. The research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and on new bonding and stacking technologies for3D ICs, especially for making high performance computing (HPC) applications.
28
'20
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Advantech News
Advantech’s High Performance FLEX Series of Flush Mounting Industrial Touch Monitors Speeds Integration into Kiosk and Self-Service Applications
Advantech’s High Performance FLEX Series of Flush Mounting Industrial Touch Monitors Speeds Integration into Kiosk and Self-Service Applications.
27
'20
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PEI-Genesis New
