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SOURIAU – SUNBANK Connection Technologies

Souriau-Sunbank extends its range of composite solutions to all EWIS accessories

As aircraft evolve, the proportion of composite as a replacement for aluminium continues to increase. Souriau-Sunbank, a company of the EATON group and a major player in the aeronautics industry as a supplier of interconnection technologies, already offers a range of connectors made of composite material, recognised for its reliability and qualified according to the main standards in the sector, in particular the MIL-DTL-38999 Series III and EN3645 standards. In order to meet market demand, Souriau-Sunbank is now extending its composite range to include all EWIS (Electrical Wiring Interconnection Systems) accessories such as backshells, caps, transitions and shielding braids.

TDK News

NTC thermistors: Robust temperature sensor for E-mobility

TDK Corporation presents the new B58703M1103A* temperature sensor − specially developed for demanding E-mobility applications, which call for high long-term stability. The NTC sensor is designed for a temperature range of -40°C to +150°C, whereby a temporary load of up to 200°C is permitted. At 25°C the rated resistance is 10 kΩ with a B25/100 value of 3625 K and a tolerance of ±1 percent.

SOURIAU – SUNBANK Connection Technologies

The SOURIAU 8STA series, a benchmark for high-performance connectors in the world of motorsport

Its compact size and low mass, coupled with its incredible robustness and resistance to shock and vibration have made SOURIAU's 8STA the connector of choice for racing teams at the highest level of the sport looking for the state-of-the-art to improve the electrical performance of their machines. These connectors are commonly used on steering boss systems, temperature and pressure sensors, data acquisition and electronic control systems and inside fuel tanks.

CEA Leti News

CEA-Leti Scientists Demonstrate CMOS Device Fabrication at 500°C, Paving the Way to High-Performance 3D Monolithic CMOS Integration

In an FDSOI CMOS processing breakthrough, CEA-Leti scientists have pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains especially in P-type metal-oxide-semiconductor (PMOS) logic devices.

GCT News

Shielded USB Connections for Superior Sound

For many premium consumer electronic devices, adoption of the latest connectors is essential. These devices must perform at their very best and have very little in the way of compromise, providing the users with a product that justifies the associated price tag.

inova Semiconductors News

Inova Semiconductors provides standalone ISELED LED driver & controller in volume production and AEC-Q100 qualified

In addition to its LED driver/controller die, integrated in smart ISELED LED modules, Inova Semiconductors offers the driver chip as a standalone solution. The standalone ISELED driver is now available in volume production and is AEC-Q100 qualified.

Infineon News

Infineon goes digital – Chip manufacturer invites to a virtual tour of its trade shows

Trade shows are an essential part of communication with customers – this is where new technologies and innovative products are launched. As a result of the coronavirus, numerous trade fairs had to be cancelled or postponed since spring 2020. In the short term, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is therefore strengthening its own activities in the digitalization of sales and marketing activities. The semiconductor manufacturer is thus presenting two important trade show highlights on the internet in July: power semiconductors and sensors.

Intel News

Intel Announces Unmatched AI and Analytics Platform with New Processor, Memory, Storage and FPGA Solutions

Intel introduced its 3rd Gen Intel® Xeon® Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of artificial intelligence (AI) and analytics workloads running in data center, network and intelligent-edge environments.

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