As aircraft evolve, the proportion of composite as a replacement for aluminium continues to increase. Souriau-Sunbank, a company of the EATON group and a major player in the aeronautics industry as a supplier of interconnection technologies, already offers a range of connectors made of composite material, recognised for its reliability and qualified according to the main standards in the sector, in particular the MIL-DTL-38999 Series III and EN3645 standards. In order to meet market demand, Souriau-Sunbank is now extending its composite range to include all EWIS (Electrical Wiring Interconnection Systems) accessories such as backshells, caps, transitions and shielding braids.
TDK Corporation presents the new B58703M1103A* temperature sensor − specially developed for demanding E-mobility applications, which call for high long-term stability. The NTC sensor is designed for a temperature range of -40°C to +150°C, whereby a temporary load of up to 200°C is permitted. At 25°C the rated resistance is 10 kΩ with a B25/100 value of 3625 K and a tolerance of ±1 percent.
Since 2014, Emitech has had its own international certification service called Emitech Certification. It has now been recognized as an NCB (National Certification Body).
Its compact size and low mass, coupled with its incredible robustness and resistance to shock and vibration have made SOURIAU's 8STA the connector of choice for racing teams at the highest level of the sport looking for the state-of-the-art to improve the electrical performance of their machines. These connectors are commonly used on steering boss systems, temperature and pressure sensors, data acquisition and electronic control systems and inside fuel tanks.
In an FDSOI CMOS processing breakthrough, CEA-Leti scientists have pushed fabrication thermal-process boundaries down to 500°C for CMOS integration, while showing strong performance gains especially in P-type metal-oxide-semiconductor (PMOS) logic devices.
For many premium consumer electronic devices, adoption of the latest connectors is essential. These devices must perform at their very best and have very little in the way of compromise, providing the users with a product that justifies the associated price tag.
In addition to its LED driver/controller die, integrated in smart ISELED LED modules, Inova Semiconductors offers the driver chip as a standalone solution. The standalone ISELED driver is now available in volume production and is AEC-Q100 qualified.
Trade shows are an essential part of communication with customers – this is where new technologies and innovative products are launched. As a result of the coronavirus, numerous trade fairs had to be cancelled or postponed since spring 2020. In the short term, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is therefore strengthening its own activities in the digitalization of sales and marketing activities. The semiconductor manufacturer is thus presenting two important trade show highlights on the internet in July: power semiconductors and sensors.
Intel introduced its 3rd Gen Intel® Xeon® Scalable processors and additions to its hardware and software AI portfolio, enabling customers to accelerate the development and use of artificial intelligence (AI) and analytics workloads running in data center, network and intelligent-edge environments.