18
'20
Written on
Vision Components News
18
'20
Written on
FLIR Systems Trading Belgium BVBA
FLIR Systems Releases New Blackfly S Machine Vision USB3 Camera with Sony’s Pregius S Sensor
Featuring the Newest Sony Pregius Sensor Generation, Pregius S, the Latest Blackfly S Model Provides Significantly Higher Resolution, Superior Imaging Quality, and Low-Light Performance
18
'20
Written on
KEMET News
KEMET Advances Its Latest Environmental Sensor Solutions for Industrial Applications
Pyroelectric passive infrared (PIR) sensors allow for easy integration, configuration and more design-in possibilities.
18
'20
Written on
Draeger News
New multi-gas detector X-act 7000
– Concentrations of hazardous substances in the ambientair at the workplace should not exceed specified limit values. Monitoring these sometimes very low values is a demanding task. The focus of the Dräger Xact 7000, in combination with the Dräger MicroTubes for different gases and vapors, is to measure carcinogenic and toxic substances in the lower ppb range.
17
'20
Written on
TDK News
TDK announces world’s lowest-power PDM microphone, T3902
T3902 is a 64.5dB SNR/120dB AOP digital microphone in a 3.5 x 2.65 x 0.98 mm package, optimized for mobile devices, wearables, headsets, TV remotes and more.
17
'20
Written on
Infineon News
Danfoss secures capacities for electro-mobility chips at Infineon
In view of the long-term growing market demand for power semiconductors for electric cars, Danfoss A/S and Infineon Technologies AG have signed a multi-year volume agreement. Infineon will supply chipsets of IGBTs and diodes to the Danfoss Silicon Power business unit. The chips are mainly used in power modules for inverters that control the motors in electric vehicles.
17
'20
Written on
CEA Leti News
CEA-Leti Demonstrates Breakthrough Architecture for HPC Devices Using Gate-All-Around Nanosheet Fabrication Process
Virtual Presentation During VLSI 2020 Details Transistors' Performance And Power-Use Advantages Versus FinFET Devices.
17
'20
Written on
Mitsubishi Electric News
Mitsubishi Electric to Launch N-series 1200V SiC-MOSFET
Low power consumption and miniaturization of power-supply systems, such as EV on-board chargers.
16
'20
Written on
Cadence News
Cadence Collaborates with TSMC and Microsoft to Reduce Semiconductor Design Timing Signoff Schedules with the Cloud
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the results of a three-way collaboration with TSMC and Microsoft focused on utilizing cloud infrastructure to reduce semiconductor design signoff schedules. Through this collaboration, common customers will have an accelerated path to complete timing signoff by adopting the Cadence® Tempus Timing Signoff Solution and the Quantus Extraction Solution using TSMC technologies on the Microsoft Azure Cloud with the Cadence CloudBurst Platform.
16
'20
Written on
Fraunhofer News
