26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

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Renesas News

Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing

Renesas Electronics Corporation has developed embedded processor technology that enhances the speed and power efficiency of microprocessor units (MPUs) for advanced vision AI.

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26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

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Samsung News

SAMSUNG ELECTRONICS COLLABORATES WITH ARM ON OPTIMIZED NEXT-GEN CORTEX-X CPU

The collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.

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26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

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Telit News

TELIT CINTERION TO TRANSFORM IOT CONNECTIVITY WITH 5G REDCAP INTEGRATION

The state-of-the-art 5G RedCap modules and devices sampled at MWC Barcelona will be available for commercial purchase during the second half of 2024.

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26 {{ "2024-02-26T00:00:00+00:00" | date "MMM" }} '24

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Keysight technologies News

KEYSIGHT VERIFIES AUTOTALKS’ 5G NEW RADIO VEHICLE-TO-EVERYTHING SYSTEM-ON-A-CHIP

The solution provided physical layer verification testing against 3GPP Release 16 Sidelink standards.

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23 {{ "2024-02-23T00:00:00+00:00" | date "MMM" }} '24

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U Blox News

u-blox releases versatile Wi-Fi 6 module for the mass market

NORA-W4 is highly reliable, and the most cost-effective single-band Wi-Fi 6 module ideal for battery-operated devices.

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23 {{ "2024-02-23T00:00:00+00:00" | date "MMM" }} '24

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Intel News

INTEL LAUNCHES WORLD’S FIRST SYSTEMS FOUNDRY DESIGNED FOR THE AI ERA

Intel announces expanded process roadmap, customers and ecosystem partners to deliver on its ambition to be the No. 2 foundry by 2030.

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22 {{ "2024-02-22T00:00:00+00:00" | date "MMM" }} '24

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Rohm Semiconductors News

New Thermal Printhead Provides Clear Printing at High Speeds Even on a Single-Cell Li-ion Battery

Novel design contributes to greater miniaturization, lighter weight, and improved energy savings.

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22 {{ "2024-02-22T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon introduces the OPTIGA™ Trust M MTR, making it easy to add Matter and security to smart home devices

In a world of increasing connectivity and the growing popularity of the Internet of Things, it is important to simplify interoperability across connected devices and to enhance their security and reliability. The Matter standard 1 was created precisely for this purpose.

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22 {{ "2024-02-22T00:00:00+00:00" | date "MMM" }} '24

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Nordic Semiconductor News

Nordic Semiconductor expands nRF91 Series with nRF9151 SiP

The nRF9151 offers enhanced power options and a reduced footprint for advanced cellular IoT and DECT NR+ applications.

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22 {{ "2024-02-22T00:00:00+00:00" | date "MMM" }} '24

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Renesas News

Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs

High-speed Circuit Technologies and Silicon Measurement Results of MCU Test Chip Presented in ISSCC 2024.

Read more…

Renesas Electronics Corporation has developed embedded processor technology that enhances the speed and power efficiency of microprocessor units (MPUs) for advanced vision AI.

The collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.

The state-of-the-art 5G RedCap modules and devices sampled at MWC Barcelona will be available for commercial purchase during the second half of 2024.

The solution provided physical layer verification testing against 3GPP Release 16 Sidelink standards.

NORA-W4 is highly reliable, and the most cost-effective single-band Wi-Fi 6 module ideal for battery-operated devices.

Intel announces expanded process roadmap, customers and ecosystem partners to deliver on its ambition to be the No. 2 foundry by 2030.

Novel design contributes to greater miniaturization, lighter weight, and improved energy savings.

In a world of increasing connectivity and the growing popularity of the Internet of Things, it is important to simplify interoperability across connected devices and to enhance their security and reliability. The Matter standard 1 was created precisely for this purpose.

The nRF9151 offers enhanced power options and a reduced footprint for advanced cellular IoT and DECT NR+ applications.

High-speed Circuit Technologies and Silicon Measurement Results of MCU Test Chip Presented in ISSCC 2024.

International