26 {{ "2024-03-26T00:00:00+00:00" | date "MMM" }} '24

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Rutronik Info

Rutronik offers Li-MnO2 button cells in customizable blister packs from EEMB

The CR2032 lithium manganese dioxide cells from EEMB are available in blister packs of 5, which depending on the project volume can be customized according to customer specifications.

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26 {{ "2024-03-26T00:00:00+00:00" | date "MMM" }} '24

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CoreTigo

Emerson and CoreTigo Improve Sustainability and Save Costs with Wireless Air Treatment Solution

Emerson collaborates with CoreTigo on wireless industrial automation technologies to address compressed air management challenges, reducing energy waste and CO2 emissions, and improving maintenance efficiency.

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26 {{ "2024-03-26T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon presents innovative semiconductor and microcontroller solutions for a greener future at embedded world 2024

Decarbonization and digitalization are the two central challenges of our time, but they rely on new and advanced technologies.

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26 {{ "2024-03-26T00:00:00+00:00" | date "MMM" }} '24

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Phytec News

Phytec at the embedded world: New embedded standard FPSC and SOMs with NXP i.MX 95 and i.MX 8M Plus

Phytec unveils the new solder module standard FPSC - Future Proof Solder Core at the embedded world, alongside with the two System on Modules, phyCORE-i.MX 95 and phyCORE-i.MX 8M Plus, which adhere to this standard.

Read more…

26 {{ "2024-03-26T00:00:00+00:00" | date "MMM" }} '24

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Toshiba News

TOSHIBA INTRODUCES A PAIR OF AUTOMOTIVE N-CHANNEL MOSFETS TO EXPAND RANGE

New devices in L-TOGL™ package offer excellent thermal performance.

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26 {{ "2024-03-26T00:00:00+00:00" | date "MMM" }} '24

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Mitsubishi Electric News

MITSUBISHI ELECTRIC TO SHIP SAMPLES OF DFB-CAN WITH BUILT-IN WAVELENGTH MONITOR

Small-package TO-56CAN will contribute to miniaturized, low-power consumption of optical transceiver modules.

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22 {{ "2024-03-22T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon extends its XDP™ digital power protection controller family with the XDP700-002, the industry's first wide input voltage hot-swap controller for telecom infrastructure

Infineon is expanding its XDP™ digital power protection controller product family with the XDP700-002, the industry's first -48 V wide input voltage digital hot-swap controller with a programmable safe operating area control designed for telecom infrastructure.

Read more…

22 {{ "2024-03-22T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-22T00:00:00+00:00" | date "longDate" }}

TDK News

Class I & II industrial 10 to 50W power supplies feature low output noise, long field life and Class B EMI

TDK Corporation announces the introduction of the ZWS-C series of 10, 15, 30 and 50W rated industrial AC-DC power supplies.

Read more…

22 {{ "2024-03-22T00:00:00+00:00" | date "MMM" }} '24

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Congatec News

Congatec welcomes publication of COM-HPC Carrier Design Guide Rev. 2.2

COM-HPC Mini specification is now complete.

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22 {{ "2024-03-22T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-03-22T00:00:00+00:00" | date "longDate" }}

Kontron News

Kontron updates its High Performance Box PC with Intel^® Core™ Processors of the 14th Generation

KBox B-201/202-RPL: Increased computing performance with a compact design and maximum expandability.

Read more…

The CR2032 lithium manganese dioxide cells from EEMB are available in blister packs of 5, which depending on the project volume can be customized according to customer specifications.

Emerson collaborates with CoreTigo on wireless industrial automation technologies to address compressed air management challenges, reducing energy waste and CO2 emissions, and improving maintenance efficiency.

Decarbonization and digitalization are the two central challenges of our time, but they rely on new and advanced technologies.

Phytec unveils the new solder module standard FPSC - Future Proof Solder Core at the embedded world, alongside with the two System on Modules, phyCORE-i.MX 95 and phyCORE-i.MX 8M Plus, which adhere to this standard.

New devices in L-TOGL™ package offer excellent thermal performance.

Small-package TO-56CAN will contribute to miniaturized, low-power consumption of optical transceiver modules.

Infineon is expanding its XDP™ digital power protection controller product family with the XDP700-002, the industry's first -48 V wide input voltage digital hot-swap controller with a programmable safe operating area control designed for telecom infrastructure.

TDK Corporation announces the introduction of the ZWS-C series of 10, 15, 30 and 50W rated industrial AC-DC power supplies.

COM-HPC Mini specification is now complete.

KBox B-201/202-RPL: Increased computing performance with a compact design and maximum expandability.

International