The Snapdragon Dev Kit for Windows, powered by Snapdragon X Elite, is a compact-form-factor PC designed for Windows developers to take advantage of the next-gen AI PC capabilities of Snapdragon.
Infineon Technologies will provide silicon carbide (SiC) power modules HybridPACK Drive G2 CoolSiC & bare die products to Xiaomi EV for its recently announced SU7 until 2027.
STMicroelectronics has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications.
With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip.