28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

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Vishay News

Vishay Intertechnology Unveils Cutting-Edge 80 V Symmetric Dual MOSFET for Enhanced Power Density and Efficiency

Vishay Intertechnology introduced a new 80 V symmetric dual n-channel power MOSFET that combines high and low side TrenchFET^® Gen IV MOSFETs in a single 3.3 mm by 3.3 mm PowerPAIR^® 3x3FS package.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

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Infineon News

Infineon advances automotive and industrial solutions with newly launched CoolSiC™ MOSFET 750 V G1 product family

Infineon Technologies AG introduces the 750V G1 discrete CoolSiC™ MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications.

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28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

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Alps Alpine News

Alps Alpine Commences External Sales of ICs, Starting from a High-Sensitivity Capacitive Sensor IC

Applicable to a Wide Range of Applications Including Touchless Operation, Automotive Touch Panels, and Liquid Level Sensors.

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28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

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Rohm Semiconductors News

ROHM's EcoGaN™ has been adopted in the 45W Output USB-C Charger C4 Duo from Innergie, a brand of Delta

ROHM has announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie, a brand of Delta.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

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Bulgin News

Bulgin introduces innovative expanded beam fiber optic connector technology

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

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28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

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Microchip News

Microchip Launches dsPIC^® DSC-Based Integrated Motor Drivers

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

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28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

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Nexperia News

Nexperia broadens its range of discrete FET solutions at APEC 2024

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

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28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Power Integrations News

Power Integrations Launches InnoMux-2, a New Switcher IC Family With Multiple, Independently Regulated Outputs

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Qualcomm News

QUALCOMM PRESENTS GROUNDBREAKING INNOVATIONS AT MWC BARCELONA

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

Read more…

28 {{ "2024-02-28T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-02-28T00:00:00+00:00" | date "longDate" }}

Mediatek News

MEDIATEK UNVEILS T300 5G REDCAP PLATFORM FOR IOT AND EXTREMELY LOW-POWER DEVICES

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

Read more…

Vishay Intertechnology introduced a new 80 V symmetric dual n-channel power MOSFET that combines high and low side TrenchFET® Gen IV MOSFETs in a single 3.3 mm by 3.3 mm PowerPAIR® 3x3FS package.

Infineon Technologies AG introduces the 750V G1 discrete CoolSiC™ MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications.

Applicable to a Wide Range of Applications Including Touchless Operation, Automotive Touch Panels, and Liquid Level Sensors.

ROHM has announced the adoption of its 650V GaN device (EcoGaN™) in the C4 Duo, a 45W output USB-C charger from Innergie, a brand of Delta.

Bulgin – a leading manufacturer of environmentally sealed connectors and components – has recently launched a patented* new expanded beam fiber optic connector and cable management system.

A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market.

Leveraging R&D expertise to deliver space-saving PoE ASFETs and EMC-optimized NextPowerS3 MOSFETs.

New GaN-based ICs combine AC-DC and DC-DC stages into a single power converter; cut power system losses by up to 50 percent.

Groundbreaking advancements in AI, 5G, and Wi-Fi will spearhead a new era of intelligent computing everywhere.

The industry’s first 5G RedCap RF-SoC offers fantastic power efficiency in a highly integrated modem.

International

Vishay Intertechnology introduced a new 80 V symmetric dual n-channel power MOSFET that combines high and low side TrenchFET^® Gen IV MOSFETs in a single 3.3 mm by 3.3 mm PowerPAIR^® 3x3FS package.