07
'24
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AMD News
07
'24
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STMicroelectronics News
STMICROELECTRONICS REVEALS HIGH-PERFORMANCE, STATE-OF-THE-ART WIRELESS MICROCONTROLLERS
Highly integrated chips support multiple wireless technologies and the latest security standards, perfectly addressing requirements for smart industrial, medical, and consumer devices.
06
'24
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Vishay News
Vishay Intertechnology Inrush Current Limiting PTC Thermistors Increase Performance in Active Charge and Discharge Circuits
For Automotive and Industrial Applications, Self-Protecting Devices Combine R25 Values to 1 kΩ With High Voltages to 1200 VDC and Energy Handling to 240 J.
06
'24
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IMD Technologies
IMDT LAUNCHES NEW SOM AND SBC WITH THE LATEST RENESAS RZ/V2H SOC FOR HIGH-PERFORMANCE ROBOTIC APPLICATIONS WITH VISION-AI AND REAL-TIME CONTROL
The V2H-based SOM (system-on-module) and SBC (single-board-computer) boast a Quad Cortex®-A55 (1.8GHz) CPU and an integrated AI accelerator, DRP-AI3, optimized for a range of AI-driven vision applications.
06
'24
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IDS Imaging Development Systems GmbH
IDS is the first industrial camera manufacturer to offer the Sony sensor IMX662 in both colour and mono
The new uEye+ XCP and XLS cameras perform particularly well in low-light applications.
06
'24
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Rohde & Schwarz
Rohde & Schwarz at EMV 2024: Outstanding T&M solutions from the market leader in EMC
At the EMV show 2024 in Cologne, Rohde & Schwarz showcases a comprehensive range of EMC test and measurement solutions – ranging from standalone instruments and software to application-specific systems. The company dedicates a large part of the booth to demonstrations that show EMI compliance testing, EMC test automation, EMS immunity test, EMI debugging and EMF. The Rohde & Schwarz solutions are on display from March 12 to 14, 2024 at the Cologne exhibition center, hall 11.1, booth 106.
06
'24
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Infineon News
Infineon introduces CoolSiC™ MOSFET G2, the next generation of silicon carbide technology for high-performance systems that drive decarbonization
Infineon Technologies AG opens a new chapter in power systems and energy conversion and introduces the next generation of silicon carbide (SiC) MOSFET trench technology.
06
'24
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Samsung News
SAMSUNG DEVELOPS INDUSTRY-FIRST 36GB HBM3E 12H DRAM
HBM3E 12H achieves industry’s largest capacity HBM with groundbreaking 12-layer stack, raising both performance and capacity by more than 50%.
05
'24
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MIkroe News
Shield enables Click boards to be added to Red Pitaya ‘Swiss Army Penknife’ engineering platform
MIKROE unlocks even more possibilities for engineering and programming projects.
05
'24
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Qualcomm News
