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Vishay News
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Rutronik Info
Rutronik at PCIM Europe – Hall 7, Booth 659
At PCIM Europe (11 to 13 June 2024) Rutronik will be exhibiting almost everything developers need to successfully implement their application projects in Hall 7, Booth 659.
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Keysight technologies News
KEYSIGHT SECURES NEW TEST CASE VALIDATIONS FOR NARROWBAND NON-TERRESTRIAL NETWORKS STANDARD
Test case validations include transmitter and receiver, demodulation, and radio resource management for narrowband internet of things over non-terrestrial networks.
30
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Softing Industrial Automation GmbH
dataFEED OPC Suite from Softing Industrial provides access to SINUMERIC 840D CNC machines
Softing Industrial Automation announces the release of the latest version V5.35 of dataFEED OPC Suite which offers comprehensive support for SINUMERIK 840D CNC machines as well as the integration of web services.
30
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Infineon News
Infineon and ETAS collaborate to optimize security of next-generation AURIX™ microcontrollers with ESCRYPT CycurHSM
As the automotive industry transitions to software-defined vehicles and new E/E architectures, the demand for high-performance hardware and robust cybersecurity solutions increases.
30
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HENSOLDT News
HENSOLDT delivers latest generation of EUV high-precision measuring device "Final Focus Metrology" for the first time
1µm FFM as optimised high-performance optics for the semiconductor industry.
29
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Vishay News
Vishay Intertechnology Automotive Grade IHDF Edge-Wound Inductor With Low 15.4 mm Max
Vishay Intertechnology has introduced a new Automotive Grade IHDF edge-wound, through-hole inductor with rated current up to 72 A and saturation currents up to 230 A.
29
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Leuze
Leuze: New Ultrasonic sensors
Thanks to an adjustable sound cone and small dead zone, the new Leuze ultrasonic sensors of the 420B and 412B series can be used for many different applications.
26
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ANSYS News
Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
Collaboration on TSMC’s COUPE silicon photonics platform dramatically speeds chip-to-chip and machine-to-machine communication for cloud, datacenters, HPC, and AI chips.
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Panasonic Industry News
