28
'24
Written on
dSPACE News
27
'24
Written on
Harman News
HARMAN Works With Qualcomm to Drive Automotive Innovation with New Ready Connect 5G TCU for Connected Cars
HARMAN has launched the HARMAN Ready Connect 5G Telematics Control Unit, utilizing Qualcomm Technologies' Snapdragon® Digital Chassis™ connected car technologies to revolutionize the automotive connectivity landscape.
27
'24
Written on
Wearin'
Wearin provides advancing Police Safety with IoT and AI-Enabled Tactical Vests
The innovative connected tactical vest project uses artificial intelligence (AI) for its abnormal-situation detection system and can transmit this warning to a command center via the Internet of Things (IoT).
27
'24
Written on
Infineon News
INFINEON UNVEILS HIGH-DENSITY POWER MODULES FOR AI DATA CENTRES
Infineon TDM2254xD vertical power modules deliver best-in-class electrical and thermal efficiency with high power density and quality.
26
'24
Written on
Sivers Semiconductors News
Sivers Semiconductors launches new 28 GHz 5G mmWave RF Module at Mobile World Congress 2024
Sivers Semiconductors AB has launched its new low-cost Radio Frequency Module BFM02803, covering 5G FR2 mmWave bands N257, N258, and N261 from 24.25 GHz to 29.5 GHz.
26
'24
Written on
Kontron News
Performance Uplift for High-End Edge Computing Platforms with the Latest Intel® Xeon® D-2800 and D-1800 Processors
Kontron introduces the COM-HPC® Server Module COMh-sdID based on the Intel® Xeon® D-2800 processor, along with the COMh-sdIL and the COM-Express® basic featuring the Intel® Xeon® D-1800 processor.
26
'24
Written on
Sivers Semiconductors News
Sivers Semiconductors showcasing the broadest mmWave portfolio on the market at Mobile World Congress 2024
Sivers Semiconductors will showcase its industry-leading mmWave portfolio of 5GmmWave, unlicensed 5G, and satellite communications products at Mobile World Congress (MWC) 2024 in Barcelona.
26
'24
Written on
Renesas News
Renesas Develops New AI Accelerator for Lightweight AI Models and Embedded Processor Technology to Enable Real-Time Processing
Renesas Electronics Corporation has developed embedded processor technology that enhances the speed and power efficiency of microprocessor units (MPUs) for advanced vision AI.
26
'24
Written on
Samsung News
SAMSUNG ELECTRONICS COLLABORATES WITH ARM ON OPTIMIZED NEXT-GEN CORTEX-X CPU
The collaboration accelerates access to newest Arm CPU, enabling new class of SoCs with Generative AI capabilities.
26
'24
Written on
Telit News
