27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

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Aetina

Aetina Demonstrates Edge AI Platforms for Robotics, Vision AI and Enterprise Automation at COMPUTEX 2026

Live demonstrations featuring NVIDIA-based edge AI systems, robotic automation, lightweight VLM deployment and agentic AI workflows will showcase real-time AI processing at the edge.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

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Microchip News

Microchip Unveils mSiC Power Modules For AI Data Centers

Microchip's new 3.3 kV HV-D3 mSiC power modules accelerate solid-state transformer adoption to deliver efficient, direct medium-voltage power for AI hyperscale facilities and heavy industrial applications.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

SK Hynix News

SK hynix Introduces iHBM Cooling for AI Memory

iHBM is a thermal management solution integrating cooling elements into HBM packages to improve AI chip stability.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

Cyntec

Cyntec Release Its Product Portfolio for Battery Junction Box Application at The Battery Show Europe 2026

Cyntec, a global leader in power magnetics and current sensing solutions, will showcase next generation automotive-grade modular components for Battery Junction Box (BJB) at The Battery Show Europe 2026 in Stuttgart from 9th to 11th June.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

TDK News

Rotary Position Sensors for Next Generation Automotive Actuators

TDK Corporation introduced a single-die Hall-effect position sensor designed to meet automotive safety requirements for electronic braking and steering control systems.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Improved energy efficiency for high-demand applications

700V PowerGaN devices from STMicroelectronics improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

Broadcom News

Integrated Neural Processing Units For High Speed Fiber Gateways

Broadcom announces first edge artificial intelligence gateway system on chip with unified optical and wireless connectivity.

Read more…

26 {{ "2026-05-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-26T00:00:00+00:00" | date "longDate" }}

Exxelia

Exxelia Launches CF-PP140 Capacitors for Extreme Conditions

New polypropylene film capacitors deliver compact high-energy performance and reliable operation in demanding high-temperature, mission-critical industrial applications.

Read more…

26 {{ "2026-05-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-26T00:00:00+00:00" | date "longDate" }}

Infineon News

Power Semiconductors for AI, Robotics, and Energy Infrastructure

Infineon will present semiconductor platforms at PCIM Europe 2026 targeting data center power conversion, industrial automation, electromobility, and resilient power infrastructure.

Read more…

26 {{ "2026-05-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-26T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

SiC Power Semiconductors for Electrified Systems

ROHM will present power conversion technologies at PCIM Europe 2026 for electric mobility, industrial power systems, renewable energy, and AI infrastructure.

Read more…

Market Overview

Overview of Silicon Carbide (SiC) Electronic Components and Modules Announced in the First Half of 2026

Technical Articles

Nanocrystalline Core Inductors for High-Frequency Power Converters

Case studies

Automated Semiconductor Reliability Testing

Aetina Demonstrates Edge AI Platforms for Robotics, Vision AI and Enterprise Automation at COMPUTEX 2026

Live demonstrations featuring NVIDIA-based edge AI systems, robotic automation, lightweight VLM deployment and agentic AI workflows will showcase real-time AI processing at the edge.

Microchip Unveils mSiC Power Modules For AI Data Centers

Microchip's new 3.3 kV HV-D3 mSiC power modules accelerate solid-state transformer adoption to deliver efficient, direct medium-voltage power for AI hyperscale facilities and heavy industrial applications.

SK hynix Introduces iHBM Cooling for AI Memory

iHBM is a thermal management solution integrating cooling elements into HBM packages to improve AI chip stability.

Cyntec Release Its Product Portfolio for Battery Junction Box Application at The Battery Show Europe 2026

Cyntec, a global leader in power magnetics and current sensing solutions, will showcase next generation automotive-grade modular components for Battery Junction Box (BJB) at The Battery Show Europe 2026 in Stuttgart from 9th to 11th June.

Rotary Position Sensors for Next Generation Automotive Actuators

TDK Corporation introduced a single-die Hall-effect position sensor designed to meet automotive safety requirements for electronic braking and steering control systems.

Improved energy efficiency for high-demand applications

700V PowerGaN devices from STMicroelectronics improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications.

Integrated Neural Processing Units For High Speed Fiber Gateways

Broadcom announces first edge artificial intelligence gateway system on chip with unified optical and wireless connectivity.

Exxelia Launches CF-PP140 Capacitors for Extreme Conditions

New polypropylene film capacitors deliver compact high-energy performance and reliable operation in demanding high-temperature, mission-critical industrial applications.

Power Semiconductors for AI, Robotics, and Energy Infrastructure

Infineon will present semiconductor platforms at PCIM Europe 2026 targeting data center power conversion, industrial automation, electromobility, and resilient power infrastructure.

SiC Power Semiconductors for Electrified Systems

ROHM will present power conversion technologies at PCIM Europe 2026 for electric mobility, industrial power systems, renewable energy, and AI infrastructure.

International