25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Anritsu News

AI Optimizes Antenna Performance in Real-World Conditions

Anritsu, SK Telecom, Postech and Bluetest validated AI-driven antenna optimization using OTA measurements, demonstrating throughput gains in 5G MIMO configurations.

Read more…

25 {{ "2026-03-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-25T00:00:00+00:00" | date "longDate" }}

Power Integrations News

Flyback ICs Extend Power Range to 440 W

Power Integrations introduces TOPSwitchGaN ICs to simplify high-power designs, enabling efficient flyback converters to replace complex resonant topologies in multiple applications.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

Critical Manufacturing

Critical Manufacturing showcases MES-driven platform at Hannover Messe 2026

Critical Manufacturing demonstrates AI-powered Industrial Operations Platform connecting MES, data and analytics for smarter manufacturing decisions.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics Starts China-Based STM32 MCU Production

Localized 40 nm microcontroller manufacturing enables dual supply chain resilience and consistent performance for electronics applications across China.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

High-Density Isolated Power Modules for Automotive and Data Infrastructure

Texas Instruments introduced isolated power modules using proprietary multichip packaging to increase power density and efficiency in electric vehicle and data center applications.

Read more…

24 {{ "2026-03-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-24T00:00:00+00:00" | date "longDate" }}

Zel Components News

Platform Expands Certified Component Distribution

Zel Components launches a digital platform to improve sourcing flexibility and enable engineers to evaluate certified electronic components across the UK and Europe.

Read more…

23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

NXP News

Imaging Radar Transceiver Advances ADAS Performance

NXP Semiconductors introduces an RFCMOS radar transceiver to enable scalable high-resolution imaging radar for Level 2+ to Level 4 automated driving.

Read more…

23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

Renesas News

GaN Power Conversion Enables 500W Charging Systems

Renesas Electronics introduces a GaN-based HWLLC platform to improve power density and efficiency in industrial and IoT power supply applications.

Read more…

23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

GaN Motor Control Reference Design for Compact High-Power Drives

STMicroelectronics introduces a GaN-based motor control platform to support efficient appliance motors and industrial automation drives with reduced thermal management requirements.

Read more…

23 {{ "2026-03-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-03-23T00:00:00+00:00" | date "longDate" }}

Parker News

Parker Launches New High Voltage Thermally Conductive Interface Pads

These high-performance interface pads provide up to 3.3 W/m-K thermal conductivity and 20 kV insulation while minimizing signal interference and energy loss in high-frequency power systems.

Read more…

Technical Articles

Electronic Design: What Is a Process Design Kit?

Case studies

Surface-mount production lines for automotive electronics manufacturing

White Paper

Artificial Intelligence is pushing data centers to new performance levels, making efficient cooling systems more critical than ever

AI Optimizes Antenna Performance in Real-World Conditions

Anritsu, SK Telecom, Postech and Bluetest validated AI-driven antenna optimization using OTA measurements, demonstrating throughput gains in 5G MIMO configurations.

Flyback ICs Extend Power Range to 440 W

Power Integrations introduces TOPSwitchGaN ICs to simplify high-power designs, enabling efficient flyback converters to replace complex resonant topologies in multiple applications.

Critical Manufacturing showcases MES-driven platform at Hannover Messe 2026

Critical Manufacturing demonstrates AI-powered Industrial Operations Platform connecting MES, data and analytics for smarter manufacturing decisions.

STMicroelectronics Starts China-Based STM32 MCU Production

Localized 40 nm microcontroller manufacturing enables dual supply chain resilience and consistent performance for electronics applications across China.

High-Density Isolated Power Modules for Automotive and Data Infrastructure

Texas Instruments introduced isolated power modules using proprietary multichip packaging to increase power density and efficiency in electric vehicle and data center applications.

Platform Expands Certified Component Distribution

Zel Components launches a digital platform to improve sourcing flexibility and enable engineers to evaluate certified electronic components across the UK and Europe.

Imaging Radar Transceiver Advances ADAS Performance

NXP Semiconductors introduces an RFCMOS radar transceiver to enable scalable high-resolution imaging radar for Level 2+ to Level 4 automated driving.

GaN Power Conversion Enables 500W Charging Systems

Renesas Electronics introduces a GaN-based HWLLC platform to improve power density and efficiency in industrial and IoT power supply applications.

GaN Motor Control Reference Design for Compact High-Power Drives

STMicroelectronics introduces a GaN-based motor control platform to support efficient appliance motors and industrial automation drives with reduced thermal management requirements.

Parker Launches New High Voltage Thermally Conductive Interface Pads

These high-performance interface pads provide up to 3.3 W/m-K thermal conductivity and 20 kV insulation while minimizing signal interference and energy loss in high-frequency power systems.

International