05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

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Synopsys News

Synopsys Empowers European Semiconductor Innovators with Advanced Chip Design Tools

Startups and researchers across Europe gain streamlined access to industry-leading EDA solutions through EuroCDP to accelerate next-generation silicon innovation from concept to production.

Read more…

05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

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Liebherr News

Liebherr showcases battery technology & edge AI solutions at electronica 2026

The portfolio includes a 30,000 W/kg battery system, LiRISE IoT gateways and integrated electronics development, testing and manufacturing services.

Read more…

05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-05T00:00:00+00:00" | date "longDate" }}

Kingston News

Embedded Storage Architectures for Edge Computing and Industrial Automation

Kingston Technology presents its comprehensive portfolio of industrial storage and DRAM modules designed to support robust IoT environments at electronica 2026.

Read more…

05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-05T00:00:00+00:00" | date "longDate" }}

Same Sky Devices News

Same Sky introduces compact piano DIP switches for IoT applications

The new SMT and through-hole series offer low profiles and fine pitches for space-constrained designs.

Read more…

05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-05T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon debuts RISC-V based AURIX RC1 microcontrollers for software-defined vehicles

The hybrid MCU/MPU platform scales across automotive domains, integrating advanced edge AI, multi-Gigabit Ethernet, and post-quantum cryptography readiness.

Read more…

05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-05T00:00:00+00:00" | date "longDate" }}

Element Six News

Element Six and Entegris partner on diamond semiconductor packaging

The collaboration targets thermal bottlenecks in AI GPUs and RF devices via advanced wafer-level integration.

Read more…

05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-05T00:00:00+00:00" | date "longDate" }}

Aetina

Aetina Brings Aetina Edge AI Powered by NVIDIA from Farm to City at SCEWC 2026

Integrated with NVIDIA Jetson Thor, NVIDIA Jetson Orin, next-generation in-vehicle AI and ecosystem collaborations bring real-time intelligence to agriculture, factories, mobility and urban infrastructure.

Read more…

05 {{ "2026-11-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-05T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics launches STM32H7P MCUs with embedded edge-AI and DSP acceleration

The Cortex-M7 based microcontrollers integrate dedicated NPU and HSP hardware to optimize digital power and industrial control systems.

Read more…

04 {{ "2026-11-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-04T00:00:00+00:00" | date "longDate" }}

Tria Technologies News

Compact Computing Module Targets Industrial Edge AI

Tria Technologies introduces the Tria C6C-PLH COM Express module, resolving edge computing constraints in industrial automation.

Read more…

04 {{ "2026-11-04T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-11-04T00:00:00+00:00" | date "longDate" }}

Samtec News

High-Speed FPGA Connectivity for Edge Embedded Systems

Samtec high-speed connectors and Adiuvo Engineering Explorer Board at electronica 2026 in Munich, Germany, November 10–13, 2026.

Read more…

Technical Articles

75 GB/s Data Acquisition to Disk

Case studies

Deployment of Micro-ATX Industrial Server Motherboards

Synopsys Empowers European Semiconductor Innovators with Advanced Chip Design Tools

Startups and researchers across Europe gain streamlined access to industry-leading EDA solutions through EuroCDP to accelerate next-generation silicon innovation from concept to production.

Liebherr showcases battery technology & edge AI solutions at electronica 2026

The portfolio includes a 30,000 W/kg battery system, LiRISE IoT gateways and integrated electronics development, testing and manufacturing services.

Embedded Storage Architectures for Edge Computing and Industrial Automation

Kingston Technology presents its comprehensive portfolio of industrial storage and DRAM modules designed to support robust IoT environments at electronica 2026.

Same Sky introduces compact piano DIP switches for IoT applications

The new SMT and through-hole series offer low profiles and fine pitches for space-constrained designs.

Infineon debuts RISC-V based AURIX RC1 microcontrollers for software-defined vehicles

The hybrid MCU/MPU platform scales across automotive domains, integrating advanced edge AI, multi-Gigabit Ethernet, and post-quantum cryptography readiness.

Element Six and Entegris partner on diamond semiconductor packaging

The collaboration targets thermal bottlenecks in AI GPUs and RF devices via advanced wafer-level integration.

Aetina Brings Aetina Edge AI Powered by NVIDIA from Farm to City at SCEWC 2026

Integrated with NVIDIA Jetson Thor, NVIDIA Jetson Orin, next-generation in-vehicle AI and ecosystem collaborations bring real-time intelligence to agriculture, factories, mobility and urban infrastructure.

STMicroelectronics launches STM32H7P MCUs with embedded edge-AI and DSP acceleration

The Cortex-M7 based microcontrollers integrate dedicated NPU and HSP hardware to optimize digital power and industrial control systems.

Compact Computing Module Targets Industrial Edge AI

Tria Technologies introduces the Tria C6C-PLH COM Express module, resolving edge computing constraints in industrial automation.

High-Speed FPGA Connectivity for Edge Embedded Systems

Samtec high-speed connectors and Adiuvo Engineering Explorer Board at electronica 2026 in Munich, Germany, November 10–13, 2026.

International