06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Congatec News

High-Performance Embedded Compute Modules with Scalable AI Acceleration

Congatec's new modules with Intel Core Ultra Series 3 processors deliver embedded AI and high-speed I/O for automation, robotics, smart cities, and retail.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Kontron News

3.5-inch single board computer for industrial edge AI

Kontron introduces a compact SBC platform built on Intel Core Ultra architecture to support low-latency AI, graphics, and real-time processing at the edge.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Vecow News

Vecow Introduces Stackable Edge AI PC Based on Intel Core Ultra Series 3

The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Contrinex News

Contrinex Expands Digital Distance Sensors for Flexible Automation

Smart digital measurement sensors from Contrinex combine high-resolution distance sensing with configurable outputs and diagnostics to support modular automation, IIoT integration, and predictive maintenance strategies.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Mediatek News

MediaTek Advances Wi-Fi 8 Reliability for High-Density Connected Devices

The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.

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06 {{ "2026-01-06T00:00:00+00:00" | date "MMM" }} '26

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Innolux News

MicroLED and N3D enable cross-domain display ecosystems

Innolux presents next-generation display technologies integrating MicroLED and naked-eye 3D to support retail, cockpit, and smart device applications at CES 2026.

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05 {{ "2026-01-05T00:00:00+00:00" | date "MMM" }} '26

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Exxelia

Exxelia unveils Smart Integrated Magnetics for space power

Custom high-efficiency magnetic solution for compact, reliable space DC-DC power conversion.

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05 {{ "2026-01-05T00:00:00+00:00" | date "MMM" }} '26

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Digi-Key News

Edge Processing Enables Faster Millimeter-Wave Scanning

Integrated signal-processing architecture adopted to accelerate millimeter-wave imaging for security screening, reducing data load and enabling near real-time analysis.

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05 {{ "2026-01-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-01-05T00:00:00+00:00" | date "longDate" }}

Infineon News

Zone controller kit supports software-defined vehicle architectures

Infineon Technologies and Flex introduce a modular development platform to accelerate zone-based E/E architectures for software-defined vehicles.

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31 {{ "2025-12-31T00:00:00+00:00" | date "MMM" }} '25

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Digi-Key News

Dual-Core Embedded Platform for AI and Real-Time Control

DigiKey distributes Arduino’s UNO Q, a dual-processor development board bridging embedded control and edge AI workloads.

Read more…

Congatec's new modules with Intel Core Ultra Series 3 processors deliver embedded AI and high-speed I/O for automation, robotics, smart cities, and retail.

Kontron introduces a compact SBC platform built on Intel Core Ultra architecture to support low-latency AI, graphics, and real-time processing at the edge.

The TGS-2000 Series expands Vecow’s embedded portfolio with a modular, industrial-grade AI PC designed for computer vision, edge inference, and scalable accelerator-based deployments.

Smart digital measurement sensors from Contrinex combine high-resolution distance sensing with configurable outputs and diagnostics to support modular automation, IIoT integration, and predictive maintenance strategies.

The Filogic 8000 platform targets interference resilience, coordinated access point operation, and low-latency performance to support AI-driven, multi-device environments across consumer and enterprise networks.

Innolux presents next-generation display technologies integrating MicroLED and naked-eye 3D to support retail, cockpit, and smart device applications at CES 2026.

Custom high-efficiency magnetic solution for compact, reliable space DC-DC power conversion.

Integrated signal-processing architecture adopted to accelerate millimeter-wave imaging for security screening, reducing data load and enabling near real-time analysis.

Infineon Technologies and Flex introduce a modular development platform to accelerate zone-based E/E architectures for software-defined vehicles.

DigiKey distributes Arduino’s UNO Q, a dual-processor development board bridging embedded control and edge AI workloads.

International