24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

Teledyne SP Devices

Teledyne SP Devices Introduces 12-bit 10 GSPS Digitizer

ADQ35 delivers dual-channel 5 GSPS sampling, 2.5 GHz bandwidth and GPU streaming up to 14 Gbyte/s for high-speed scientific and industrial data acquisition.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

IDS Imaging Development Systems GmbH

3D ToF and intelligent vision systems for precise, reliable intralogistics automation

IDS Showcases 3D ToF, Monitoring and AI Camera Technologies for Intralogistics at LogiMAT 2026.

Read more…

24 {{ "2026-02-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-24T00:00:00+00:00" | date "longDate" }}

Analog Devices News

Analog Devices showcases embedded sensing and control platforms

Demonstrations at Embedded World 2026 examine integrated simulation, networking and edge-level processing across robotics, industrial automation and digital health design workflows.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Telefonica News

Pan-European federated edge infrastructure demonstration at MWC 2026

Deutsche Telekom, Orange, Telefónica, TIM and Vodafone interconnected operator edge nodes to enable cross-network application deployment across Europe.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

MIkroe News

MIKROE Launches EnOcean 5 Click Board

Bidirectional ESP3 gateway enables low-power EnOcean connectivity for building automation systems.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Broadcom News

Broadcom Introduces BroadPeak Radio DFE SoC for 5G Advanced and 6G

Broadcom launches the BroadPeak BCM85021, a 5 nm integrated radio digital front-end SoC targeting massive MIMO and remote radio head applications across 400 MHz to 8.5 GHz.

Read more…

23 {{ "2026-02-23T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-23T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Technologies Introduces Infiniium XR8 Real-Time Oscilloscope

Keysight launches the Infiniium XR8 with new front-end ASICs and digital engine architecture to accelerate high-speed digital validation and compliance testing.

Read more…

20 {{ "2026-02-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-20T00:00:00+00:00" | date "longDate" }}

TDK News

High-Ripple DC Link Capacitors for EV Chargers

TDK Corporation expands its automotive power portfolio with two aluminum electrolytic capacitor series engineered for high-voltage on-board charger DC link stages.

Read more…

20 {{ "2026-02-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-20T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Software Targets 3DIC Interconnect Design Bottlenecks

New EDA workflow automates chiplet interconnect modelling and validation to support high-density semiconductor packaging used in AI and data centre hardware.

Read more…

20 {{ "2026-02-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-20T00:00:00+00:00" | date "longDate" }}

Seco News

SECO Presents MediaTek Edge AI Modules and HMIs

The new MediaTek-based embedded platforms enable local AI processing for industrial automation and medical device interfaces.

Read more…

Case studies

Früchte Jork puts new deep-freeze warehouse into operation

White Paper

Maximize Your Power System Efficiency

Teledyne SP Devices Introduces 12-bit 10 GSPS Digitizer

ADQ35 delivers dual-channel 5 GSPS sampling, 2.5 GHz bandwidth and GPU streaming up to 14 Gbyte/s for high-speed scientific and industrial data acquisition.

3D ToF and intelligent vision systems for precise, reliable intralogistics automation

IDS Showcases 3D ToF, Monitoring and AI Camera Technologies for Intralogistics at LogiMAT 2026.

Analog Devices showcases embedded sensing and control platforms

Demonstrations at Embedded World 2026 examine integrated simulation, networking and edge-level processing across robotics, industrial automation and digital health design workflows.

Pan-European federated edge infrastructure demonstration at MWC 2026

Deutsche Telekom, Orange, Telefónica, TIM and Vodafone interconnected operator edge nodes to enable cross-network application deployment across Europe.

MIKROE Launches EnOcean 5 Click Board

Bidirectional ESP3 gateway enables low-power EnOcean connectivity for building automation systems.

Broadcom Introduces BroadPeak Radio DFE SoC for 5G Advanced and 6G

Broadcom launches the BroadPeak BCM85021, a 5 nm integrated radio digital front-end SoC targeting massive MIMO and remote radio head applications across 400 MHz to 8.5 GHz.

Keysight Technologies Introduces Infiniium XR8 Real-Time Oscilloscope

Keysight launches the Infiniium XR8 with new front-end ASICs and digital engine architecture to accelerate high-speed digital validation and compliance testing.

High-Ripple DC Link Capacitors for EV Chargers

TDK Corporation expands its automotive power portfolio with two aluminum electrolytic capacitor series engineered for high-voltage on-board charger DC link stages.

Keysight Software Targets 3DIC Interconnect Design Bottlenecks

New EDA workflow automates chiplet interconnect modelling and validation to support high-density semiconductor packaging used in AI and data centre hardware.

SECO Presents MediaTek Edge AI Modules and HMIs

The new MediaTek-based embedded platforms enable local AI processing for industrial automation and medical device interfaces.

International