11
'24
Written on
ASUS News
10
'24
Written on
Phytec News
Second Phytec Development Kit with the NXP i.MX 93
Phytec has released the phyBOARD-Nash i.MX 93 Rapid Development Kit, another addition to their development kit lineup featuring the i.MX 93 processor.
10
'24
Written on
TDK News
0-20V to 0-1500V programmable power supplies can be configured in 20U high 19”racking cabinets to deliver 90kW
TDK Corporation announces the introduction of 90kW rated GSPS 20U 19-inch racking cabinets to the TDK-Lambda GENESYS+™ series of programmable DC power supplies.
10
'24
Written on
Vector News
Testing Steer-By-Wire Systems With Test Benches From Vector and MdynamiX
Vector Informatik and MdynamiX are now jointly offering test benches for steer-by-wire or conventional steering systems.
10
'24
Written on
Anritsu News
Anritsu Collaborates with LITEON to Verify 5G O-RAN Performance Testing
MT8000A/MX773000PC Test Solution Speeds Up O-RU Verification and Reduces Costs.
10
'24
Written on
Rutronik Info
Flexible and high-performance modules for the European IoT market: VIA Technologies, Inc. and Rutronik expand partnership
Rutronik a global leader in the design and development of intelligent automotive, industrial, building, and edge solutions, expand their partnership for the European Market.
10
'24
Written on
Congatec News
CONGATEC PRESENTS NEW SMARC MODULES ON THE BASIS OF THE NXP I.MX 95 PROCESSOR SERIES
congatec modules set new benchmarks for secure edge AI applications.
09
'24
Written on
IDS Imaging Development Systems GmbH
IDS product preview for VISION 2024, the world's leading trade fair for machine vision
IDS will be presenting innovations in all product areas at booth 8C60.
09
'24
Written on
HighTec News
AURIX TC4x MCAL Evaluation Bundle from HighTec Provides Simplicity to Manage AUTOSAR Complexity
HighTec EDV-Systeme GmbH, in collaboration with Infineon Technologies AG, announces the release of the AURIX TC4x MCAL Evaluation Bundle.
09
'24
Written on
VIA Tech News
