ROHM Semiconductor will present its analog and power architectures designed to support automotive electrification, industrial automation, and artificial intelligence data centers.
Kontron and Ennoconn are combining their regional production capabilities to provide original equipment manufacturers with a resilient digital supply chain for embedded systems.
Parker Chomerics integrates stainless-steel honeycomb structures to provide component protection and optimal thermal regulation for power-dense telecommunications equipment.
From October 21-22 in Berlin, Germany, Xaar presents high-viscosity fluid-deposition architectures for scalable manufacturing of printed and production electronics.
New thermal imaging camera delivers 1280 × 1024 HD resolution in the compact A-Series platform, providing a straightforward upgrade path for existing research and test environments.