27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

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Cyntec

Cyntec Release Its Product Portfolio for Battery Junction Box Application at The Battery Show Europe 2026

Cyntec, a global leader in power magnetics and current sensing solutions, will showcase next generation automotive-grade modular components for Battery Junction Box (BJB) at The Battery Show Europe 2026 in Stuttgart from 9th to 11th June.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

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TDK News

Rotary Position Sensors for Next Generation Automotive Actuators

TDK Corporation introduced a single-die Hall-effect position sensor designed to meet automotive safety requirements for electronic braking and steering control systems.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

Improved energy efficiency for high-demand applications

700V PowerGaN devices from STMicroelectronics improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications.

Read more…

27 {{ "2026-05-27T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-27T00:00:00+00:00" | date "longDate" }}

Broadcom News

Integrated Neural Processing Units For High Speed Fiber Gateways

Broadcom announces first edge artificial intelligence gateway system on chip with unified optical and wireless connectivity.

Read more…

26 {{ "2026-05-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-26T00:00:00+00:00" | date "longDate" }}

Exxelia

Exxelia Launches CF-PP140 Capacitors for Extreme Conditions

New polypropylene film capacitors deliver compact high-energy performance and reliable operation in demanding high-temperature, mission-critical industrial applications.

Read more…

26 {{ "2026-05-26T00:00:00+00:00" | date "MMM" }} '26

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Infineon News

Power Semiconductors for AI, Robotics, and Energy Infrastructure

Infineon will present semiconductor platforms at PCIM Europe 2026 targeting data center power conversion, industrial automation, electromobility, and resilient power infrastructure.

Read more…

26 {{ "2026-05-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-26T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

SiC Power Semiconductors for Electrified Systems

ROHM will present power conversion technologies at PCIM Europe 2026 for electric mobility, industrial power systems, renewable energy, and AI infrastructure.

Read more…

26 {{ "2026-05-26T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-26T00:00:00+00:00" | date "longDate" }}

Cyntec

Cyntec Showcases Automotive Electrification Solutions at PCIM Europe 2026

The company will present new high-power-density magnetics, EMI filters, and current sensing technologies designed to support AI-driven vehicle architectures, battery management systems, and next-generation xEV platforms.

Read more…

25 {{ "2026-05-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-25T00:00:00+00:00" | date "longDate" }}

HIKMICRO

HIKMICRO Highlights Strategic Value of Acoustic Imaging in Automotive Manufacturing

Visualizing Invisible Losses.

Read more…

25 {{ "2026-05-25T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-05-25T00:00:00+00:00" | date "longDate" }}

Keysight technologies News

Keysight Technologies Launches Breakthrough EOE Simulation Solution

The unified workflow enables engineers to simulate complete electrical-optical-electrical signal chains, catching cross-domain issues and accelerating design tradeoffs for next-generation AI infrastructure.

Read more…

Technical Articles

Nanocrystalline Core Inductors for High-Frequency Power Converters

Case studies

Automated Semiconductor Reliability Testing

Cyntec Release Its Product Portfolio for Battery Junction Box Application at The Battery Show Europe 2026

Cyntec, a global leader in power magnetics and current sensing solutions, will showcase next generation automotive-grade modular components for Battery Junction Box (BJB) at The Battery Show Europe 2026 in Stuttgart from 9th to 11th June.

Rotary Position Sensors for Next Generation Automotive Actuators

TDK Corporation introduced a single-die Hall-effect position sensor designed to meet automotive safety requirements for electronic braking and steering control systems.

Improved energy efficiency for high-demand applications

700V PowerGaN devices from STMicroelectronics improve energy efficiency and enable more compact power designs for AI servers, robotics, industrial systems and advanced consumer applications.

Integrated Neural Processing Units For High Speed Fiber Gateways

Broadcom announces first edge artificial intelligence gateway system on chip with unified optical and wireless connectivity.

Exxelia Launches CF-PP140 Capacitors for Extreme Conditions

New polypropylene film capacitors deliver compact high-energy performance and reliable operation in demanding high-temperature, mission-critical industrial applications.

Power Semiconductors for AI, Robotics, and Energy Infrastructure

Infineon will present semiconductor platforms at PCIM Europe 2026 targeting data center power conversion, industrial automation, electromobility, and resilient power infrastructure.

SiC Power Semiconductors for Electrified Systems

ROHM will present power conversion technologies at PCIM Europe 2026 for electric mobility, industrial power systems, renewable energy, and AI infrastructure.

Cyntec Showcases Automotive Electrification Solutions at PCIM Europe 2026

The company will present new high-power-density magnetics, EMI filters, and current sensing technologies designed to support AI-driven vehicle architectures, battery management systems, and next-generation xEV platforms.

HIKMICRO Highlights Strategic Value of Acoustic Imaging in Automotive Manufacturing

Visualizing Invisible Losses.

Keysight Technologies Launches Breakthrough EOE Simulation Solution

The unified workflow enables engineers to simulate complete electrical-optical-electrical signal chains, catching cross-domain issues and accelerating design tradeoffs for next-generation AI infrastructure.

International