SECO introduces an order-ready human–machine interface designed to shorten development cycles and support scalable edge computing across industrial and regulated environments.
Avnet ASIC and Bar-Ilan University are establishing a joint R&D hub to develop 2.5D and 3D chiplet integration based on advanced foundry nodes for European semiconductor applications.
Siemens EDA software is being deployed by Toshiba Electronic Devices & Storage Corporation to strengthen power device, analog, and mixed-signal semiconductor development.
Conrad expands its test and measurement range with a clamp meter designed for high-current, high-voltage applications in photovoltaics, e-mobility, and industrial electrical maintenance.
IAR extends its embedded development platform to support automotive-grade RISC-V processor IP, enabling certified software development for safety-critical vehicle systems.
The MLX90296 linear Hall-effect sensor combines ultra-low power consumption, digital filtering, and compact packaging to support precise motion sensing in battery-powered applications.