Collaboration validates high-fidelity RF modeling against real-world data to de-risk massive MIMO deployment, accelerating 5G-Advanced evolution and building confidence for AI-native 6G research and innovation.
Arrow Electronics and Infineon introduce a 240W USB-C reference design, streamlining development for battery-powered motor applications with advanced power delivery and integrated control features.
STMicroelectronics and Qualcomm Technologies integrate motion sensing and secure NFC technologies into the Snapdragon Wear Elite platform to enable low-power AI processing and contactless services in wearable devices.
The industry's first 32Gb LPDDR5X die enables 1.33x more capacity, 2.3x faster LLM inference, and 3x better efficiency while significantly reducing power and footprint.
PentaG-NTN modem subsystem supports LEO and MEO satellite connectivity and accelerates development of standards-based 5G non-terrestrial network terminals.
Licensing TSMC’s 650V GaN process technology enables in-house wafer fabrication at ROHM Hamamatsu, strengthening supply continuity for high-voltage AI server and EV power systems.