Qualcomm Technologies introduces the Dragonwing MBM platform family for broadband devices combining 5G connectivity, advanced multimedia processing and integrated AI capabilities.
Infineon Technologies coordinates a 62-partner initiative to develop advanced power electronics systems utilizing heterogeneous integration and chiplet architectures for industrial applications.
Keysight Technologies has expanded its PCIe 7.0 test portfolio with a new receiver stress-test calibration solution for AI and data center applications.
Swissbit AG introduces a new PCIe Gen4 SSD family for embedded systems, combining low power consumption, industrial endurance, and configurable storage options for mixed and write-intensive workloads.
A configurable automotive power management architecture combining PMIC and DrMOS components is designed to support scalable SoC platforms in ADAS, cockpit, and vision systems.
TDK Corporation introduces a compact 3A power module designed to support next generation optical transceivers and artificial intelligence edge computing infrastructure.
Fraunhofer IPMS has developed a quasi-monolithic integration method utilizing structured silicon pockets to embed chiplets for advanced heterogeneous semiconductor manufacturing.