06 {{ "2025-01-06T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-01-06T00:00:00+00:00" | date "longDate" }}

Nexcom News

Nexcom's new XPPC xx-10N97 balances power & performance for logistics & self-service applications

The new XPPC 16-10N97 and XPPC 10-10N97 feature Intel processors for robust performance, fanless designs for silent operation, 16:9 widescreens, and diverse I/O connectivity.

Read more…

06 {{ "2025-01-06T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-01-06T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon and Flex showcase zone controller design platform for software-defined vehicles

Infineon Technologies AG and Flex, a diversified global manufacturer and Infineon's new preferred automotive design partner, are showcasing the new Flex Modular Zone Controller design platform for software-defined vehicles at CES 2025.

Read more…

06 {{ "2025-01-06T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-01-06T00:00:00+00:00" | date "longDate" }}

NeuroBlade News

NeuroBlade Empowers Accelerated Next-Gen Data Analytics on New Amazon Elastic Compute Cloud F2 Instances

NeuroBlade has partnered with Amazon EC2 F2 instances, powered by AMD FPGA and EPYC CPU technologies, to enhance performance and efficiency in cloud-native data analytics workloads.

Read more…

03 {{ "2025-01-03T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-01-03T00:00:00+00:00" | date "longDate" }}

Lane Electronics News

Lane Electronics Presents High-Reliability Connectors at Electronics Live 2025

Lane Electronics is showcasing cutting-edge electronic component technology and solutions for diverse industries at Electronics Live 2025, held at the National Conference Centre, Birmingham, on January 22.

Read more…

02 {{ "2025-01-02T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-01-02T00:00:00+00:00" | date "longDate" }}

intelec News

Revolutionizing PCB Manufacturing with AI-Powered Quality Inspection

How Huseyn Gasimov's Automated Visual Inspection Prototype is Transforming Production Processes.

Read more…

02 {{ "2025-01-02T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-01-02T00:00:00+00:00" | date "longDate" }}

Mediatek News

MediaTek Unveils Dimensity 8400, the First All Big Core Chip for Premium Smartphones

The All Big Core CPU is paired with a powerful NPU to accelerate Gen-AI tasks, along with MediaTek’s new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI applications.

Read more…

26 {{ "2024-12-26T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-26T00:00:00+00:00" | date "longDate" }}

Electro Rent

Electro Rent Appoints New Chief Revenue Officer

Alan Mayer joins test equipment services leader Electro Rent, leveraging a best-in-class go-to-market strategy and customer success background to drive growth.

Read more…

25 {{ "2024-12-25T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-25T00:00:00+00:00" | date "longDate" }}

Mitsubishi Electric News

Mitsubishi Electric to Ship Samples of S1-Series HVIGBT Module

The S1-Series HVIGBT Module is designed for extra powerful and efficient inverter systems of railways, electric power systems and more.

Read more…

23 {{ "2024-12-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-23T00:00:00+00:00" | date "longDate" }}

MURATA News

Murata’s Type 1SC-NTN Module Achieves Skylo FCC & CE L-Band Certification

Murata Manufacturing announces that its Type 1SC-NTN module has received Skylo FCC and CE L-band certification for dual-mode cellular and non-terrestrial network functionality.

Read more…

23 {{ "2024-12-23T00:00:00+00:00" | date "MMM" }} '24

Written on {{ "2024-12-23T00:00:00+00:00" | date "longDate" }}

Nordic Semiconductor News

Nordic Semiconductor to showcase Thingy:91 X cellular IoT prototyping platform at CES 2025

CES 2025 visitors can see Nordic’s Thingy:91 X cellular IoT prototyping platform and next-generation, ultra-low power nRF54 Series SoCs alongside Kigen Remote SIM Provisioning demonstration on the Venetian Expo Campus, Level 2, Booth 53029.

Read more…

The new XPPC 16-10N97 and XPPC 10-10N97 feature Intel processors for robust performance, fanless designs for silent operation, 16:9 widescreens, and diverse I/O connectivity.

Infineon Technologies AG and Flex, a diversified global manufacturer and Infineon's new preferred automotive design partner, are showcasing the new Flex Modular Zone Controller design platform for software-defined vehicles at CES 2025.

NeuroBlade has partnered with Amazon EC2 F2 instances, powered by AMD FPGA and EPYC CPU technologies, to enhance performance and efficiency in cloud-native data analytics workloads.

Lane Electronics is showcasing cutting-edge electronic component technology and solutions for diverse industries at Electronics Live 2025, held at the National Conference Centre, Birmingham, on January 22.

How Huseyn Gasimov's Automated Visual Inspection Prototype is Transforming Production Processes.

The All Big Core CPU is paired with a powerful NPU to accelerate Gen-AI tasks, along with MediaTek’s new Dimensity Agentic AI Engine (DAE) that turns traditional AI applications into sophisticated agentic AI applications.

Alan Mayer joins test equipment services leader Electro Rent, leveraging a best-in-class go-to-market strategy and customer success background to drive growth.

The S1-Series HVIGBT Module is designed for extra powerful and efficient inverter systems of railways, electric power systems and more.

Murata Manufacturing announces that its Type 1SC-NTN module has received Skylo FCC and CE L-band certification for dual-mode cellular and non-terrestrial network functionality.

CES 2025 visitors can see Nordic’s Thingy:91 X cellular IoT prototyping platform and next-generation, ultra-low power nRF54 Series SoCs alongside Kigen Remote SIM Provisioning demonstration on the Venetian Expo Campus, Level 2, Booth 53029.

International