06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

Microchip News

Direct 800V DC Rack Power Conversion

Microchip and Navitas introduced an 800V-to-6V DC reference platform using GaN devices and digital signal controllers to solve AI server thermal limits.

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06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

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Samtec News

High-Performance Interconnect Solutions for Digital Infrastructure

Samtec presented advanced interconnect systems at electronica India 2026 to address signal integrity challenges in modern computing and industrial automation networks.

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06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

BASF News

Polyarylethersulfone Thermoplastics for High-Density Electrical and Electronic Assemblies

BASF expands its Ultrason polyarylethersulfone portfolio to improve thermal management and signal integrity in data centers and e-mobility.

Read more…

06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

Omnivision News

High-Speed 2.2-Micron Global Shutter CMOS Sensor Optimizes Machine Vision

OMNIVISION introduces a high-resolution, stacked backside-illuminated image sensor designed to reduce power consumption and motion artifacts in automated industrial environments.

Read more…

06 {{ "2026-10-06T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-06T00:00:00+00:00" | date "longDate" }}

Rutronik News

Silicon Carbide Solid-State Relays Target High-Voltage Test Automation

Rutronik announces the distribution of OMRON semiconductor switching components designed to manage elevated electrical loads within electromobility and automated testing architectures.

Read more…

05 {{ "2026-10-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-05T00:00:00+00:00" | date "longDate" }}

Synopsys News

AI-Powered Electronic Design Automation for Custom Semiconductors

Synopsys expands industrial collaborations to integrate foundational models into hardware engineering workflows and optimize complex integrated circuit architectures.

Read more…

05 {{ "2026-10-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-05T00:00:00+00:00" | date "longDate" }}

Northrop Grumman News

Gallium Nitride RF Chip Architecture Advances High-Frequency Systems

Northrop Grumman developed the FORTITUDE microchip to resolve radio frequency spectrum congestion across defense and commercial telecommunications infrastructure.

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05 {{ "2026-10-05T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-05T00:00:00+00:00" | date "longDate" }}

AMD News

Space-Grade Adaptive SoC for In-Orbit Processing

AMD Versal AI Core XQRVC1902 samples in an enhanced space-grade package designed for long-duration processing and extreme orbital reliability challenges.

Read more…

02 {{ "2026-10-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-02T00:00:00+00:00" | date "longDate" }}

SINTRONES News

Edge computing architectures for automated defect detection

SINTRONES introduces a series of rugged AI platforms designed to manage thermal loads and process high-bandwidth visual data in precision manufacturing environments.

Read more…

02 {{ "2026-10-02T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-10-02T00:00:00+00:00" | date "longDate" }}

Texas Instruments News

TI expands Zephyr RTOS support across its embedded hardware portfolio

Unified Zephyr platform supports TI MCUs, MPUs and wireless devices, enabling code portability, security updates and streamlined development across hardware.

Read more…

Market Overview

Quantum Electronics Moves Toward Commercialization

Technical Articles

Why data center security is a substation problem, not a fence problem

Case studies

Ultra-Fast AI Inference at 10 GSPS Detects Particle Pile-Up in Real Time

Direct 800V DC Rack Power Conversion

Microchip and Navitas introduced an 800V-to-6V DC reference platform using GaN devices and digital signal controllers to solve AI server thermal limits.

High-Performance Interconnect Solutions for Digital Infrastructure

Samtec presented advanced interconnect systems at electronica India 2026 to address signal integrity challenges in modern computing and industrial automation networks.

Polyarylethersulfone Thermoplastics for High-Density Electrical and Electronic Assemblies

BASF expands its Ultrason polyarylethersulfone portfolio to improve thermal management and signal integrity in data centers and e-mobility.

High-Speed 2.2-Micron Global Shutter CMOS Sensor Optimizes Machine Vision

OMNIVISION introduces a high-resolution, stacked backside-illuminated image sensor designed to reduce power consumption and motion artifacts in automated industrial environments.

Silicon Carbide Solid-State Relays Target High-Voltage Test Automation

Rutronik announces the distribution of OMRON semiconductor switching components designed to manage elevated electrical loads within electromobility and automated testing architectures.

AI-Powered Electronic Design Automation for Custom Semiconductors

Synopsys expands industrial collaborations to integrate foundational models into hardware engineering workflows and optimize complex integrated circuit architectures.

Gallium Nitride RF Chip Architecture Advances High-Frequency Systems

Northrop Grumman developed the FORTITUDE microchip to resolve radio frequency spectrum congestion across defense and commercial telecommunications infrastructure.

Space-Grade Adaptive SoC for In-Orbit Processing

AMD Versal AI Core XQRVC1902 samples in an enhanced space-grade package designed for long-duration processing and extreme orbital reliability challenges.

Edge computing architectures for automated defect detection

SINTRONES introduces a series of rugged AI platforms designed to manage thermal loads and process high-bandwidth visual data in precision manufacturing environments.

TI expands Zephyr RTOS support across its embedded hardware portfolio

Unified Zephyr platform supports TI MCUs, MPUs and wireless devices, enabling code portability, security updates and streamlined development across hardware.

International