Rutronik stocks TDK Micronas' HVC 5222D with ARM Cortex-M3, 32 KB flash, LIN transceiver, and AEC-Q100 qualification in compact 5×5mm package for automotive and industrial motors.
The collaboration merges Inova’s ISELED 2.0 smart LED platform with TactoTek’s IMSE in-mold electronics to deliver lightweight, space-efficient, and intelligent 3D lighting structures for automotive applications.
Eight years after its launch in January 2017, the ADQ7DC digitizer from Teledyne SP Devices continues to set the benchmark for high-performance data acquisition.
EN 50155-compliant and 1U rackmount-ready, the RBOX-1001-M12X combines Intel Atom x7000RE processing, Hailo AI acceleration, and wide-temperature operation for real-time railway analytics.
The new ecosystem unifies modular software tools, AI augmentation, and cross-standard support to streamline installation, debugging, analysis, and wireless performance optimization.
New RA8M2 and RA8D2 microcontrollers deliver 7300 Coremarks, integrated MRAM, dual Gigabit Ethernet, and advanced graphics for IoT and industrial applications.