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STMicroelectronics News
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TDK News
Integrated DC-DC converters simplify industrial power design
TDK Corporation introduces encapsulated converter modules to reduce design complexity and footprint in industrial power architectures.
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Leuze
Leuze Highlights Seven Steps to Ensure Safe and Seamless Site Inspections
A structured approach to identifying risks, closing safety gaps, and achieving compliance across industrial environments.
29
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Microchip News
Microchip introduces post-quantum root of trust controllers
New controllers support post-quantum cryptography and secure boot for data center, telecom and infrastructure platforms.
29
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Syensqo News
Material for High-Voltage Smartphone Batteries
Syensqo develops Energain SA076 to enable safer high-voltage lithium-ion batteries for next-generation smartphone platforms.
29
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Rohm Semiconductors News
ROHM NFC Chipset Enables Wireless Charging in Wearables
Compact receiver and transmitter ICs support proximity-based power transfer for ultra-small devices, addressing design constraints in next-generation wearable electronics.
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Kyocera News
Multilayer Ceramic Substrate for AI Semiconductor Packaging
Kyocera Corporation introduces a rigid ceramic core substrate to address warpage and wiring density limits in advanced AI and ASIC semiconductor packaging.
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Toshiba News
Toshiba Samples Integrated Motor Control Device for Automotive
New SmartMCD component combines MCU, gate driver, and sensorless FOC to support compact, efficient BLDC motor control in electrified vehicle systems.
28
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MURATA News
Murata introduces ultra-low power AMR sensors
New AMR sensors enable low-voltage operation and extended battery life in healthcare, wearable, and IoT applications.
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Kontron News
