TI introduces a groundbreaking MCU, 38% smaller than existing models, designed to enhance space efficiency, performance, and power optimization in compact electronics.
High-performance “Zen 5” architecture offers server-grade performance and efficiency combined with purpose-built features for optimized product longevity and system resiliency.
Infineon Technologies AG is launching Drive Core, a scalable software bundle portfolio for AURIX, TRAVEO and PSOC that facilitates a rapid start into automotive software development.
The EV revolution aims to cut emissions, with 350m EVs expected by 2030. Sustainable battery lifecycles are crucial for long-term green transition and reducing environmental impact.
Palantir’s AI and Ontology run on Qualcomm’s edge computing platforms, enable real-time insights, automation, and smarter decisions in industrial and automotive sectors.
The RZ/V2N enables energy-efficient AI for smart factories and cities, optimizing traffic analysis, visual inspection, and driver monitoring with low power consumption.
The new heat sink designs SK 706, SK 707, SK 708 and SK 709 are thermally optimised for free convection in terms of base and fin thickness as well as fin spacing and height.
Intel Xeon 6 processors, optimized for performance and efficiency, are now available at Rutronik. Choose between E-cores and P-cores to meet your specific power, performance, and efficiency needs.