Lane Electronics today announced it received a Silver Tier Award for exceptional performance and contributions to supply chain success for BAE Systems, Inc.’s Electronic Systems sector. Lane Electronics was honored at a virtual ceremony and was selected from the pool of suppliers that worked with BAE Systems in 2021.
TTI, Inc., a leading specialty distributor of electronic components, is now stocking the Intercontec M12 one cable technology (OTC) motor connectors from TE Connectivity. The M12 metal connectors with IP66/77 protection, when mated, are rated for 500 mating cycles, enabling robust and reliable installation of small servo motors for applications including automation, robotics, packaging, food & beverage, and material handling.
NEC Corporation, a leading global IT and network transformation services provider, and new windowJuniper Networks, a leader in secure, AI-driven networks, today announced they have worked with Algeria Telecom, the leader in the Algerian telecommunications market, to roll out its modernized, nationwide IP metro commercial network to support current demand for increased capacity as well as future needs driven by 5G and FTTx.
Vision-Based Sports Analytics, Training, and Player Assessment for Europe’s Top Football Clubs. By combining complex algorithms with Teledyne FLIR cameras, skills.lab provides coaching staff with complete holistic views of a player's capabilities including detailed information to create individual training & recovery programs.
The wireless charging market has been increasingly growing over the last years, with more and more applications applying this capability to make use of the offered benefits.
The TEE501 sensing element offers excellent measurement accuracy of up to ±0.2 °C and is easy to integrate thanks to its small DFN enclosure. Austrian sensor manufacturer E+E Elektronik presents its first digital temperature sensing element in the form of the TEE501. It impresses with a measurement accuracy of up to ±0.2 °C and a wide temperature range. The small DFN enclosure with integrated pull-up resistors facilitates the design-in of the sensing element.
MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with an incredible experience, even in some of the most densely populated areas.
The LARA-L6 is a perfect fit for demanding size-constrained applications including video surveillance, dashcams, high-end telematics, gateways and routers, and connected health devices.